• Journal of Electrical Engineering and Technology
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• v.11 no.3
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• pp.781-789
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• 2016

Busbar has been used as electric conductor within extra high voltage (EHV) gas insulated switchgear (GIS), which makes EHV GIS higher security, smaller size and lower cost. However, the main fault of GIS is overheating of busbar connection parts, circuit breaker and isolating switch contact parts, which has been already restricting development of GIS to a large extent. In this study, a coupled magneto-flow-thermal analysis is used to investigate the thermal properties of GIS busbar in steady-state. A three-dimensional (3-D) finite element model (FEM) is built to calculate multiphysics fields including electromagnetic field, flow field and thermal field in steady-state. The influences of current on the magnetic flux density, flow velocity and heat distribution has been investigated. Temperature differences of inner wall and outer wall are investigated for busbar tank and conducting rod. Considering the end effect in the busbar, temperature rise difference is compared between end sections and the middle section. In order to obtain better heat dissipation effect, diameters of conductor and tank are optimized based on temperature rise simulation results. Temperature rise tests have been done to validate the 3-D simulation model, which is observed a good correlation with the simulation results. This study provides technical support for optimized structure of the EHV GIS busbar.

• Journal of IKEEE
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• v.26 no.4
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• pp.537-544
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• 2022

This paper analyzes the occurrence and cause of bond wires fusing used in the manufacture of pulsed high power amplifiers. Recently GaN HEMT has been spotlight in the fields of electronic warfare, radar, base station and satellite communication. In order to produce the maximum output power, which is the main performance of the high-power amplifier, optimal impedance matching is required. And the material, diameter and number of bond wires must be determined in consideration of not only the rated current but also the heat generated by the transient current. In particular, it was confirmed that compound semiconductor with a wide energy band gap such as GaN trigger fusing of the bond wire due to an increase in thermal resistance when the design efficiency is low or the heat dissipation is insufficient. This data has been simulated for exothermic conditions, and it is expected to be used as a reference for applications using GaN devices as verified through IR microscope.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.693-698
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• 2002

For the evaluation of the plasma display panel (PDP)'s noise, vibration and sound characteristics of fanless PDP are measured and investigated. PDP is a type of two-electrode vacuum tube which operates on the same principle as a household fluorescent light. An inert gas such as argon or neon is injected between two glass plates on which transparent electrodes have been formed, and the glass is illuminated by generating discharge. For this discharge, both high voltage and currents are needed and cause an acoustic noise. We investigated the noise characteristics connected with both a electromagnetic elements from SMPS to panel through X, Y and logic board, and a mechanical elements form panel to case through transfer path which related with vibration and heat. To reduce the noise of PDP, a discharge pulse memory design related with both higher brightness and lower power consumption is important and mechanical characteristics connected with dissipation process of both heat and vibration generated by panel discharge must be investigated.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.9
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• pp.114-121
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• 2004

Thermal design changes and analysis on the engineering model of Command Telemetry Unit(CTU) for a geostationary communications satellite arc performed for the purpose of developing an engineering qualification model. A thermal model is developed by using power consumption measurement values of each functional board and thermal cycling test results. In modeling heat dissipated EEE parts, heat dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board. All the EEE parts of CTU meet the requirement of their allowable temperature range when placed on the engineering qualification level of thermal vacuum environments in accordance with the proposed thermal design changes.

• Laser Solutions
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• v.18 no.1
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• pp.1-6
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• 2015

High welding speed and narrow weld seam are favorable for welding of magnesium alloy. Magnesium alloy is recommended for the smart frame because it has several advantages such as low density, high thermal conductivity, EMI shielding capability and good cast ability. This study is for the assembly welding of the magnesium smart frame with high productivity, good performance and low cost. The window for battery on AZ91D frame produced by die-casting was prepared by CNC machining. Corresponding AZ31 blank of 0.2mm thickness was prepared by die-blanking cut. All system set was fixed at the stationary bed but the laser beam was manipulated by scanner up-to 1,000mm/s speed. The weld joint between AZ31 sheet and AZ91D frame was welded by fiber laser on 850~1,000W output power. The joint showed penetration enough but some humping bead. The distortion by the weld heat was almost free because of the quick dissipation of the heat by small beam size and fast welding. Consequently, the thinner magnesium foil was assembled successfully to the magnesium frame of mobile phone.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• Proceedings of the KIEE Conference
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• 2003.10b
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• pp.119-121
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• 2003

The magnetic bearing is an important element for high-speed system, such as semiconductor equipment and machine tools. Particularly, The homopolar magnetic bearing has the advantages of lower power losses, more space for heat dissipation and coil winding. This paper deals with analysis and comparison of the homopolar magnetic bearing according to four different PM structures. On the basis of these results, we find one homopolar magnetic bearing superior to the others. finally, this paper derive force characteristic equation for this model and deals with comparison of between analytical and FE results.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.1
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• pp.42-48
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• 2000

Friction in bearing exerts an important effect upon power dissipation and heat generation of spindle system. This paper presents frictional moments derived from rotational axis coordinate system of spindle and frictional characteristics to spindle speed A frictional moment of spindle bearings is derived by work-energy method. Differential sliding moments in outer raceway has a major effect upon frictional resistance; spin sliding moments in inner raceway has a secondary effect. As spindle speed increases, also the frictional moments increase. In high-speed region, ceramic ball bearing 몬 smaller frictional moment than steel ball bearing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.350-353
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• 1999

This Paper Presents the optimized design of micro-heaters using 501(Si-on-insulator) substrate and oxide-filled trench structure In order to justify a lumped model approximation and thermal boundary assumptions, two-dimensional FDM(finite difference among which conduction is the dominant heat dissipation path. Compared with no-trenchs on the SOI structure, the micro-heaters with trench structures has properties of low heater loss and good thermal isolation. The simulation results show that the heater loss decreases as the number. width and distance of trenchs increases.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.489-494
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• 2006

Electronic and telecommunication industries are constantly trying to develop compact components having high power density. Therefore, a proper heat dissipation method is very important to allow reliable operation of the telecommunication equipment. In this study, a hybrid refrigeration system for a telecommunication equipment room was designed to save energy consumption and improve reliability of the compressor In addition, the performance of the hybrid refrigeration system was measured with a variation of outdoor load. The designed hybrid refrigeration system for the telecommunication equipment shelter saved the energy approximately 50%e at the mode switch temperature of $8.3^{\circ}C$.