• 한국자동차공학회논문집
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• 제25권1호
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• pp.42-50
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• 2017

A study has been conducted to develop an aluminum EGR cooler for the LPL EGR system of a diesel engine. Aluminum has a much lower density and thermal conductivity that is about 12 times or more than that of stainless steel, so it is advantageous for use in an EGR cooler for weight reduction and cooling performance effects. A design process has been carried out to ensure heat dissipation performance in a restricted space to investigate the geometric parameters and satisfy the requirements for pressure drops at both fluid sides. The tubes of exhaust gas have been designed as extruded tubes. An aluminum EGR cooler consisting of extruded tubes entails a simpler manufacturing process compared to a stainless steel EGR cooler with conventional heat transfer fins. A prototype has been manufactured from the final model selected through the design process. The performance of the aluminum EGR cooler was evaluated and compared with that of the conventional one. The weight of the aluminum EGR cooler is reduced by 22.9%, while performance is significantly improved.

• 설비공학논문집
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• 제15권8호
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• 대한기계학회논문집B
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• 제20권7호
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• pp.2356-2366
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• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1231-1236
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• 2004

In the present work, the practical thermal design process of 1 DIN car DVD receiver described. In the course of its efficient design, CAE technique was essentially used. CAE technique has reduced research period, man power and material cost but has increased research convenience, organized results and persuasive power. CAE technique helped to study parameters such as vent, fan and heat sink. Using these elements, it tried to meet optimal thermal solution. But safety standard, printed circuit board and framework mechanism should be considered as the constraint. To overcome these constraints, we tried to communicate and compromise with projectors in charge. After all, the price of those efforts has made the most competitive heat sink for heat dissipation in the 1 DIN car DVD receiver market. Moreover, we are trying to save $3 per product by removing fan. This paper is supposed to show an example of the CAE technique and help thermal designers to make electronic packaging goods.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.788-789
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• 2011

A comprehensive thermo-electromagnetic model has been developed to estimate temperature and electromagnetic distribution in an three-phase induction motor under steady state operation. Electromagnetic modeling enables us to predict thermal dissipation rates by eddy-current loss and copper loss in induction motors. Non-uniform temperature distributions are investigated to account for the strong effect of local temperature build-up on the motor performance and expected life-span. For more accurate thermal modeling purpose, Heat loss mapping method, which is matched up with electromagnetic losses and volumetric heat source, is developed and performed analysis. Heat loss mapping method can be greatly used as a design or diagnostic tool for three-phase induction motors with complex structural electromagnetic fields.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1566-1571
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• 2003

The cold plate used for a CEU(Control Electronics Unit) of an EV(Electric Vehicle) is extremely important since the dissipation of the heat generated from power devices like IGBT(Insulated Gate Bipolar Transistor) and diode has a significant effect on the performance as well as the durability of the CED. The cold plate consists of seven power devices, and coolant flows through the passage bonded to a groove of the cold plate. In order to find out heat transfer and pressure drop characteristics, series of numerical analyses for the cold plate with enhanced coolant passages were conducted. Based on results of the numerical analyses, an improved model of the cold plate has been proposed. The experiments under the various conditions have been conducted to compare the performance of the proposed cold plate to the present one. As a result of the numerical analyses together with the experiments, the ideal design of the cold plate could be offered.

• 전력전자학회논문지
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• 제28권1호
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• pp.39-47
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• 2023

This paper applies a structural technique with uniform parallel switch characteristics in gates and power loops to minimize the ringing and current imbalance that occurs when a general discrete package (TO-247)-based power semiconductor device is operated in parallel. Also, this propose a heat sink integrated switching module with heat sink design flexibility and high power density. The developed heat dissipation-integrated switching module verifies the symmetry of the parasitic inductance of the parallel switch through Q3D by ansys and the validity of the structural technique of the parallel switch using the LLC resonant converter experiment operating at a rated capacity of 7.5 kW.

• 한국자동차공학회논문집
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• 제15권2호
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• pp.87-94
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• 2007

It has been argued that the use of plastics can cause problems during design and manufacture owing to their low strength, relatively poor thermal conductivity and large thermal expansion. However, the advantages of plastics e.g., corrosion resistance, low cost, curtailment of weight, design flexibility etc., can compensate abundantly for the disadvantages. This study analyzes and compares the heat transfer performance characteristics of automotive compact oil cooler composed of plastic tube bundle with conventional metal oil cooler on the same core area basis as diameter, tube thickness, number of tube or tube arrangement varies. The performance analyses are accomplished by use of computational fluid dynamics program Fluent 6.2, which is verified and compared with the results of performance tests. The result of analyses is coincided with that of experiments. Flow pattern at air side according to tube arrangement is dominant factor which affects heat dissipation in case of similar total heat transfer surface area.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.95-100
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• 2010

LED (Light Emitting Diode)는 인가된 에너지 대비 15%가 빛으로, 나머지 85%가 열로 변환되는 것은 이미 잘 알려져 있다. 최근 LED칩 용량이 증가함에 따라서 LED칩으로부터 방출되는 열은 더욱 증가하게 되고 이는 LED 제품의 성능저하와 수명단축에 직접적인 영향을 미친다. 따라서, 산업계에서는 고출력 LED 칩에서 발생하는 열을 제어하기 위해 제품설계구조 연구가 진행 중에 있으며 또한, 부가적으로, 기존의 알루미늄, 접착제 및 구리를 사용하는 MCL(Metal Clad Laminate)구조에서 저가형 FR4 및 구리를 사용하는 CCL (Copper Clad Laminate)로 변경하여 원가절감을 하고자 하는 대체 소재연구가 진행되고 있다. 본 연구에서는 저가형 CCL에 열방출 극대화를 위하여 열비아(thermal via)를 디자인별로 형성한 후 1 W급 LED 칩을 실장하여 열저항(thermal resistance) 변화를 분석하였으며, 최적의 열방출을 위한 열비아 구조를 제안하고자 하였다.

• Composites Research
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• 제35권3호
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• pp.175-181
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• 2022

무선통신기술의 발전과 함께 통신기기의 활용영역은 기하급수적으로 증가하고 있으며, 이에 따라 통신기기 성능의 저하를 막기 위한 전자파 노이즈 간섭문제 해결 및 방열문제 해결 소재에 대한 관심이 높아지고 있다. 본 연구에서는 전자파 차폐와 우수한 방열특성을 동시에 가질 수 있는 복합소재 필름을 제안하였다. 이 필름은 고분자 수지에 자성 및 방열 필러 물질이 분산된 복합소재 레이어와 전도성 그리드로 구성되어 있다. 복합소재 레이어의 조성 및 특성에 대한 제어 및 전도성 그리드 형상에 대한 설계를 통해 높은 전자파 차폐능(>40 dB), 낮은 전자파 반사능(<3 dB), 우수한 열전도도(>10 W/m·K)를 5G 통신 대역인 26.5 GHz에서 500 ㎛ 이하의 극박 필름으로 달성하는 데 성공하였다.