• 조명전기설비학회논문지
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• 제28권7호
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• 항공우주시스템공학회지
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• 제14권3호
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• pp.51-59
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• 2020

초소형 위성인 큐브위성의 경우 위성체의 제한적인 중량 및 부피를 고려하여 경량화 및 전기적 회로설계 측면에서 유리한 PCB 기반의 전개형 태양전지판이 폭넓게 적용되고 있으나, PCB의 낮은 두께 방향 열전도율로 인해 태양전지셀의 방열이 어려운 점이 있다. 본 논문에서 제안한 6U 큐브위성용 태양전지판은 PCB 기반의 태양전지판으로 제작되고, 판넬 외곽에 장착된 알루미늄 보강재 접속부에 열전도 패드가 적용된다. 따라서 판넬 전면부의 태양전지셀에서 방열면인 판넬 후면으로 열전달이 원활하도록 하여 PCB 적용에 따른 장점을 유지하면서도 방열성능을 극대화함으로서 태양전지셀 온도 하강에 따른 전력생성효율 향상이 가능한 장점을 갖는다. 본 연구에서 제안된 열전도 패드가 적용된 태양전지판의 열제어 측면에서의 유효성 입증을 위해 궤도 열해석을 통해 기존 PCB 태양전지판과 비교 분석을 실시하였다.

• 한국전기전자재료학회논문지
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• 제27권9호
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• pp.594-599
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• 2014

The heat dissipation conditions of high-power 5 watt LEDs-based searchlight modules were optimized with varying LED bar'shape, materials, and ambient temperature. The LED junction temperature was estimated by using Computational Fluid Dynamics simulation. The optimal heat dissipation conditions were found as follows; LED bar' shape: L=80 mm, W=4 mm, t=10 mm, copper material, LED junction temperature of $116.6^{\circ}C$, ambient temperature of $50^{\circ}C$, total mass of 184 g, and shadowing area of $320mm^2$. The difference between the junction temperatures of our fabricated and simulated LEDs-based searchlight modules is about $3^{\circ}C$, which confirms the validity of our thermal simulation results.

• Human Ecology Research
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• 제56권5호
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• pp.473-491
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• 2018

This study identifies Japanese study content on heat stroke prevention measures using clothes, provides basic data for quantitative wearing assessment studies, presents a developmental direction for those, and helps invigorate further research. Studies were collected concerning clothing-based heat stroke measures in order to analyze the following factors: current status of heat stroke by industry and working environment, heat stroke and body cooling method, clothing microclimate and air circulation in a hot environment, hot environments and wearable sensors, and heat stress reduction and skin exposure. The current WBGT standard does not consider the diversity of wearing clothes according to the working environment. Therefore, it is preferable to add a correction value in consideration of design, materials, and ventilation to prevent heat strokes. For the heat stroke and body cooling method, wearing water-perfused clothing is effective to reduce heat stress and maintain exercise ability. Changing the material and design of clothing or wearing air-conditioned clothing can improve ventilation and the clothing microclimate. However, further evaluation is needed on the effectiveness of air-conditioned clothing as a heat stroke prevention product. The measurement method using a wearable sensor can provide real-time data on the body response due to working in a hot environment. Therefore, it is an effective alarm for heat stroke. Skin exposure area and heat dissipation efficiency should be considered to prevent heat stroke. Reducing the covering area by exposing the head, neck, and limbs, and wearing breathable material can prevent heat stroke from increased body temperature.

• 한국기계가공학회지
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• 제15권6호
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• pp.58-63
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• 2016

This paper presents a study of heat dissipation away from the fuel combustion of a marine diesel engine. These engines are operated for long periods under high load conditions: so cooling systems are necessary for radiation and control of the high temperature levels. In the study, each component of the water cooling system was developed to achieve improvements in cooling and safety. Heat transfer considerations and arrangement design for the components were important and an intercooler and exhaust manifold incorporated. An optimization of the cooling water's flow path was achieved subject to the need for convenient maintenance. The 750Ps marine diesel engine was used for performance testing of the cooling system. The test results showed adequate cooling performance improvement.

• 한국기계가공학회지
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• 제16권4호
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• pp.135-139
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• 2017

In recent years, the optical fiber laser has been widely used in industrial fields due to its excellent economical efficiency and its suitability for industrial applications. This usage has increased even further since the KW class Laser was developed. In this paper, structural analysis and heat transfer analysis of a 500W class optical fiber laser end cap module was performed. The stability of end cap housing with the efficient heat dissipation structure of a 500W-class end cap was evaluated. This research determined the optimal design that should be applied to the design and evaluation of future KW class laser output modules.

• 한국전기전자재료학회논문지
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• 제26권2호
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• 마이크로전자및패키징학회지
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• 제23권2호
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• pp.73-78
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• 2016

집적회로(Integrated Circuit) 소자의 트랜지스터(transistor) 밀도 증가는 소자에서 발생하는 열 방출(heat dissipation)의 급격한 상승을 초래하여 열 문제를 발생시키고, 이는 소자의 성능과 열적 신뢰성에 영향을 크게 미친다. 열문제의 해결방안 중 본 연구에서는 냉매를 이용한 액체 냉각방법을 연구하였으며, 실리콘 웨이퍼에 관통실리콘비아(through Si via)와 마이크로 채널(microchannel)을 딥 반응성 이온 애칭(deep reactive ion etching)로 구현한 후 유리기판과 어노딕본딩을 통하여 액체 냉각 구조를 제작하였다. 제작된 마이크로 채널 위에 Ag, Cu 또는 Cr/Au/Cu bump를 스크린프린팅(screen printing) 방법으로 형성하였고, 범프의 유무를 통해 액체 냉각 전후의 냉각 모듈의 실리콘 표면온도의 변화를 적외선현미경으로 분석하였다. Cr/Au/Cu bump가 탑재된 액체 냉각 모듈의 경우 가열온도 $200^{\circ}C$에서 냉각 전후의 실리콘 표면 온도 차이는 약 $45.2^{\circ}C$이고, 전력밀도 감소는 약 $2.8W/cm^2$ 이었다.

• 유공압시스템학회논문집
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• 제6권4호
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• pp.24-32
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• 2009

For a design of on/off solenoid actuator for valve actuating, designer must have the experimental knowledge as well as general electromagnetic formulas to design object. It is possible for theoretical knowledge to do the out-line design, but it is impossible to optimal design without experimental knowledge which only can be achieved through many repeated experiments. In addition, in present on/off type solenoid actuator field, the smaller, lightening, lower consumption power, high response time are effected as the most important design factor. So, experimental knowledge is more needed for optimal design of solenoid actuator. In this study, we derived the governing equations for optimal design of on/off solenoid actuator for valve actuating and developed a design program composed electromagnetic theories and experimental parameter values for inexperienced designers. And we proved the propriety of this program by experiments.

• 한국정밀공학회지
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• 제18권6호
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• pp.141-147
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• 2001

A heat dissipation technology using flow resonant phenomenon is a kind of new concept in heat transfer area. A vibration exciter is needed to generate an air turbulence which has the natural shedding frequency of a heat system. A mechanical vibrating device for the air flow oscillation is introduced, which is driven by a moving coil actuator. An analytical dynamic model for this mechanical vibration exciter is presented and its validity is verified by the comparison with experimental data. Values of some unko주 system parameters in the analytic model are estimated through the system identification approach. based on this mathematical model, a high bandwidth vibration exciter is designed using feedback control. During the experimental verification phased, it turns out the high frequency modal resonant characteristics of vibrating plate are the major barrier against obtaining a high bandwidth vibration exciter.