• Transactions of the Korean Society of Automotive Engineers
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• v.25 no.1
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• pp.42-50
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• 2017

A study has been conducted to develop an aluminum EGR cooler for the LPL EGR system of a diesel engine. Aluminum has a much lower density and thermal conductivity that is about 12 times or more than that of stainless steel, so it is advantageous for use in an EGR cooler for weight reduction and cooling performance effects. A design process has been carried out to ensure heat dissipation performance in a restricted space to investigate the geometric parameters and satisfy the requirements for pressure drops at both fluid sides. The tubes of exhaust gas have been designed as extruded tubes. An aluminum EGR cooler consisting of extruded tubes entails a simpler manufacturing process compared to a stainless steel EGR cooler with conventional heat transfer fins. A prototype has been manufactured from the final model selected through the design process. The performance of the aluminum EGR cooler was evaluated and compared with that of the conventional one. The weight of the aluminum EGR cooler is reduced by 22.9%, while performance is significantly improved.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.8
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.7
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• pp.2356-2366
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• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1231-1236
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• 2004

In the present work, the practical thermal design process of 1 DIN car DVD receiver described. In the course of its efficient design, CAE technique was essentially used. CAE technique has reduced research period, man power and material cost but has increased research convenience, organized results and persuasive power. CAE technique helped to study parameters such as vent, fan and heat sink. Using these elements, it tried to meet optimal thermal solution. But safety standard, printed circuit board and framework mechanism should be considered as the constraint. To overcome these constraints, we tried to communicate and compromise with projectors in charge. After all, the price of those efforts has made the most competitive heat sink for heat dissipation in the 1 DIN car DVD receiver market. Moreover, we are trying to save $3 per product by removing fan. This paper is supposed to show an example of the CAE technique and help thermal designers to make electronic packaging goods.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.788-789
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• 2011

A comprehensive thermo-electromagnetic model has been developed to estimate temperature and electromagnetic distribution in an three-phase induction motor under steady state operation. Electromagnetic modeling enables us to predict thermal dissipation rates by eddy-current loss and copper loss in induction motors. Non-uniform temperature distributions are investigated to account for the strong effect of local temperature build-up on the motor performance and expected life-span. For more accurate thermal modeling purpose, Heat loss mapping method, which is matched up with electromagnetic losses and volumetric heat source, is developed and performed analysis. Heat loss mapping method can be greatly used as a design or diagnostic tool for three-phase induction motors with complex structural electromagnetic fields.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1566-1571
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• 2003

The cold plate used for a CEU(Control Electronics Unit) of an EV(Electric Vehicle) is extremely important since the dissipation of the heat generated from power devices like IGBT(Insulated Gate Bipolar Transistor) and diode has a significant effect on the performance as well as the durability of the CED. The cold plate consists of seven power devices, and coolant flows through the passage bonded to a groove of the cold plate. In order to find out heat transfer and pressure drop characteristics, series of numerical analyses for the cold plate with enhanced coolant passages were conducted. Based on results of the numerical analyses, an improved model of the cold plate has been proposed. The experiments under the various conditions have been conducted to compare the performance of the proposed cold plate to the present one. As a result of the numerical analyses together with the experiments, the ideal design of the cold plate could be offered.

• The Transactions of the Korean Institute of Power Electronics
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• v.28 no.1
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• pp.39-47
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• 2023

This paper applies a structural technique with uniform parallel switch characteristics in gates and power loops to minimize the ringing and current imbalance that occurs when a general discrete package (TO-247)-based power semiconductor device is operated in parallel. Also, this propose a heat sink integrated switching module with heat sink design flexibility and high power density. The developed heat dissipation-integrated switching module verifies the symmetry of the parasitic inductance of the parallel switch through Q3D by ansys and the validity of the structural technique of the parallel switch using the LLC resonant converter experiment operating at a rated capacity of 7.5 kW.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.2
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• pp.87-94
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• 2007

It has been argued that the use of plastics can cause problems during design and manufacture owing to their low strength, relatively poor thermal conductivity and large thermal expansion. However, the advantages of plastics e.g., corrosion resistance, low cost, curtailment of weight, design flexibility etc., can compensate abundantly for the disadvantages. This study analyzes and compares the heat transfer performance characteristics of automotive compact oil cooler composed of plastic tube bundle with conventional metal oil cooler on the same core area basis as diameter, tube thickness, number of tube or tube arrangement varies. The performance analyses are accomplished by use of computational fluid dynamics program Fluent 6.2, which is verified and compared with the results of performance tests. The result of analyses is coincided with that of experiments. Flow pattern at air side according to tube arrangement is dominant factor which affects heat dissipation in case of similar total heat transfer surface area.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.95-100
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• 2010

LED (Light Emitting Diode) is 85% of the applied energy is converted into heat that is already well known. Lately, LED chips increasing the capacity as result delivered to increase the heat of the LED products and module that directly related to life span and degradation. Thus, in industry the high-power LED chip to control the heat generated during the course of the study and the existing aluminum, copper adhesives, and uses MLC (Metal clad laminate) structures using low-cost FR4 and copper CCL (Copper Clad Laminate) to reduce costs by changing to a study being carried out. In this study, using low-cost CCL Class, mounted 1W LED chip to analyze changes in the thermal resistance. In addition, heat dissipation in the CCL to facilitate a variety of thermal via design outside of the heat generated by the LED chip to control and facilitate the optimal structure of the heat dissipation is suggested.

• Composites Research
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• v.35 no.3
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• pp.175-181
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• 2022

Due to the increasing number of wireless communication devices in mmWave frequency bands, there is a high demand for electromagnetic interference (EMI) shielding and heat dissipating materials to avoid device malfunctions. This paper proposes an EMI shielding composite film with a high heat dissipation characteristic. To achieve this, a conductive grid is integrated with a polymer-based composite layer including magnetic and heat dissipating filler materials. A high shielding effectiveness (>40 dB), low reflection shielding effectiveness (<3 dB), high thermal conductivity (>10 W/m·K), thin thickness (<500 ㎛) are simultaneously achieved with a tailored design of composite layer compositions and grid geometries in 5G communication band of 26.5 GHz.