• Journal of the Korean institute of surface engineering
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• v.56 no.1
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• pp.55-61
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• 2023

As a preliminary study to produce functional nanocomposites in a heat dissipation device, we performed the direct synthesis of carbon nanotubes (CNTs) on the surface of alumina (Al₂O₃) powders. A thermal chemical vapor deposition (TCVD) system was used to grow CNTs directly on the Al₂O₃ surface. In order to investigate the growth behavior of CNTs, we varied both furnace temperature of the TCVD ranging from 700 to 850 ℃ and concentration of the ferritin-dissolved DI solution from 0.1 to 2.0 mg/mL. From the previous results, the gas composition and duration time for CNT growth were fixed as C₂H₄ : H₂ = 30 : 500 (vol. %) and 10 min, respectively. Based on the analysis results, the optimized growth temperature and ferritin concentration were found to be 825 ℃ and 0.5 mg/mL, respectively. The obtained results could be adopted to achieve mass production of nanocomposites with heat dissipation functionality.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.924-927
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• 2013

In this study, we proposed CMP-PLAs to replace the Al heat sinks as heat sink materials, and investigated heat dissipation characteristics of the LED lighting devices using them. The crystallinity of the proposed CMP-PLA heat sinks decreased with increasing carbon nanotube contents in CMP-PLA. However, the thermal conductivity was improved with the increase of the carbon nanotube contents. The heat dissipation characteristics of the LED lighting devices using CMP-PLA heat sinks was improved with increasing carbon nanotube contents in CMP-PLA. For the LED lighting devices using CMP-PLA heat sinks with 40% carbon nanotube contents, the initial temperature measured at the heat sink plate was $27^{\circ}C$, which increased as time, and it was saturated around $56^{\circ}C$ after an hour. The LED lighting devices using CMP-PLA heat sinks are expected to be functional materials that can reduce their weight and improve their electric properties, compared to those using existing Al heat sinks.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.110-114
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• 2020

In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.4173-4180
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• 2023

The stability of engineered barriers in high-level radioactive waste disposal systems can be influenced by the decay heat generated by the waste. This study focuses on the thermal analysis of various canister designs to effectively lower the maximum temperature of the engineered barrier. A numerical model was developed and employed to investigate the heat dissipation potential of copper rings placed across the buffer. Various canister designs incorporating copper rings were presented, and numerical analysis was performed to identify the design with the most significant temperature reduction effect. The results confirmed that the temperature of the buffer material was effectively lowered with an increase in the number of copper rings penetrating the buffer. Parametric studies were also conducted to analyze the impact of technical gaps, copper thickness, and collar height on the temperature reduction. The numerical model revealed that the presence of gaps between the components of the engineered barrier significantly increased the buffer temperature. Furthermore, the reduction in buffer temperature varied depending on the location of the gap and collar. The methods proposed in this study for reducing the buffer temperature hold promise for contributing to cost reduction in radioactive waste disposal.

• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.415-420
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• 2018

The possibility of an improvement in heat dissipation performance of aluminum alloy heat sink for shipboard LED luminaries through plasma electrolytic oxidation (PEO) was investigated. Four different PEO coatings were produced on aluminum alloy 5052 in silicate based alkaline solution by varying current density ($50{\sim}200mA/cm^2$). On voltage-time response curves, three stages were clearly distinguished at all current densities, namely an initial linear increase, slowdown of increase rate, and steady state(constant voltage). It was found that the increase in current density caused the breakdown voltage to increase. Two different surface morphologies - coralline porous structure and pancake structure - were confirmed by SEM examination. The coralline porous structure was predominant in the coatings produced at lower current densities (50 and $100mA/cm^2$) while under high current densities(150 and $200mA/cm^2$) the pancake structure became dominant. The coating thickness was measured and found to be in a range between about $13{\mu}m$ and $44{\mu}m$, showing increasing thickness with increasing current density. As a result, $100mA/cm^2$ was proposed as an effective process parameter to improve the heat dissipation performance of aluminum alloy heat sink, which could lower the LED operating temperature by about 30%.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2286-2291
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• 2008

Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

• ETRI Journal
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• v.27 no.3
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• pp.337-340
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• 2005

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit(PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.2
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• pp.56-64
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• 2006

Rapid progress in many branches of technology has led to a demand on new materials such as high strength light weight alloys, powdered alloys and composite materials. The hydrostatic extrusion is essentially a method of extruding a clad rod through a die. In order to investigate the effect of the process conditions such as friction heat, deformation and clad thickness on the clad extrusion process, viscoplastic finite element simulations were conducted. A specific model for theoretical analysis used in this study is The single scalar variable version of Hart's model. An experiment also has been carried out using 1.5MN hydrostatic extruder with variable speed ram, LVDT and load cell for comparison. It is found that the hydrostatic extrusion pressure considering the effect of heat dissipation in this theoretical work was closer to the experimental pressure than the isothermal hydrostatic extrusion pressure.

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.2
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• pp.313-318
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• 2020

Since the engineering plastics having a melting point of higher than 300 degrees have a high mechanical rigidity, chemical resistance, friction and abrasion performance, those are being highlighted as metal replacement materials in various industries. In this study, 3D printer nozzle with excellent heat dissipation characteristics are designed and analytically verified to form engineering plastics with high melting points in 3D printers based on the melt-lamination modeling method. In order to insulate between the heat block heated to a melting point of filament material and the upper part of the nozzle where the filament is transferred, the heat brake part with low thermal conductivity was designed to have two separate parts, and a cooling fin structure is further applied to the heat brake part to lower steady-state temperature by air convection. Optimized structural design on FDM nozzle part reduces the temperature at the heat sink and at the end part of heat brake by 50% and 14% respectively, compared to the conventional BCnozzle structure.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.5
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• pp.105-110
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• 2020

The global battery market is rapidly growing due to the development of vehicles(EV) and wireless electronic products. In particular logistics robots, which hielp to produce EVs, have attracted much interest in research in Korea Because logistics sites and factories operate continuously for 24 hours, the technology that can dramatically increase the operation time of the logistics equipment is rapidly developing, and various high-level technologies are required for the batteries used in. for example, logistics robots. These required technologies include those that enable rapid battery charging as well wireless charging to charge batteries while moving. The development of these technologies, however, result in increasing explosions and topical accidents involving rapid charging batteries These accidents due to the thermal shock caused by the heat generated during the charging of the battery cell. In this study, a performance evaluation of a heat dissipation design using infrared thermal imaging was performed on an energy storage systrm(Ess) applied with an internal heat conduction cooling method using a heating plate.