• Title/Summary/Keyword: H.N.C

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Paper-Electrophoretic Separation of Ruthenium Chloro-Complexes (전기영동에 의한 루테늄 염화착물의 분리)

  • Byung-Hun Lee;Cheon-Hwey Cho
    • Nuclear Engineering and Technology
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    • v.16 no.2
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    • pp.58-63
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    • 1984
  • Paper electrophoretic separation of octahedrally bonded (Ruc $l_{6}$ )$^{3-}$ has been carried out by using the specially designed migration apparatus. The supporting electrolyte solutions are as follows: 0.1M-HCl $O_4$, 0.05 M-HCl+0.09M-KCl, 0.1M-HCl, 5$\times$10$^{-3}$ M-NTA, 0.01M-HCl, 0.01M-HCl $O_4$, 0.01M-citric acid, 0.01M-K $H_2$P $O_4$+0.01M-N $a_2$HP $O_4$, 0.05M-borax, 0.025M-N $a_2$C $O_3$+0.025M-NaHC $O_3$, 0.01M-N $a_3$P $O_4$, 0.01M-NaOH and 0.1 M-NaOH. The (Ruc $l_{6}$ )$^{3-}$ appears in 2 to 4 peaks and is found in several chemical species such as (RuCl ($H_2O$)$_{5}$ )$^{2+}$, cis and trans (RuC $l_2$($H_2O$)$_4$)$^{1+}$, (RuC $l_3$($H_2O$)$_3$)$^{0}$ , (RuC $l_4$($H_2O$)$_2$)$^{1-}$, (RuC $l_{5}$ ($H_2O$))$^{2-}$ and (RuC $l_{6}$ )$^{3-}$. The retention value has been found to be highest in the 0.025M-N $a_2$C $O_3$+0.025M-NaHC $O_3$ electrolyte solution.n.

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Ionic Characteristics of the Ground Water for Hydroponics in Kyeongnam Area (경남지역 양액재배용 지하수의 이온 분포특성)

  • 이영한;전성건;황연현;조강희;신원교
    • Journal of Bio-Environment Control
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    • v.7 no.3
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    • pp.246-252
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    • 1998
  • This study was carried out to investigate the quality of ground water for hydroponics in Kyeongnam area in 1995. Water samples were collected and analyzed from 77 wells in green houses throughout Kyeongnam area. The values of several components in well water were as follows ; 7.4 in pH, 0.46dS/m in EC, 0.3mg/L in N $H_{4}$-N, 25.4mg/L in $Ca^{2+}$, 42.6mg/L in C $l^{[-10]}$ and 72.5mg/L in S $O_{4}$$^{2-}$. The pH value showed high positive significance of correlationships with $Ca^{2+}$ and EC. Also, the EC value showed high positive significance with N $a^{+}$, $Ca^{2+}$, S $O_{4}$$^{2-}$, $Mg^{2+}$ and C $l^{[-10]}$ .

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Fabrications and Characterization of High Temperature, High Voltage Ni/6H-SiC and Ni/4H-SiC Schottky Barrier Diodes (고온, 고전압 Ni/4H-SiC 및 Ni/6H-SiC Schottky 다이오드의 제작 및 전기적 특성 연구)

  • Lee, Ho-Seung;Lee, Sang-Wuk;Shin, Dong-Hyuk;Park, Hyun-Chang;Jung, Woong
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.11
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    • pp.70-77
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    • 1998
  • Ni/SiC Schottky diodes have been fabricated using epitaxial 4H-SiC and 6H-SiC wafers. The epitaxial n-type layers were grown on $n^{+}$ substrates, with a doping density of 4.0$\times$10$^{16}$ c $m^{-3}$ and a thickness of 10${\mu}{\textrm}{m}$. Oxide-termination has been adopted in order to obtain high breakdown voltage and low leakage current. The fabricated Ni/4H-SiC and Ni/6H-SiC Schottky barrier diodes show excellent rectifying characteristics up to the measured temperature range of 55$0^{\circ}C$. In case of oxide-terminated Schottky barrier diodes, breakdown voltage of 973V(Ni/4H-SiC) and 920V(Ni/6H-SiC), and a very low leakage current of less than 1nA at -800V has been observed at room temperature. On non-terminated Schottky barrier diodes, breakdown voltages were 430V(Ni/4H-SiC) and 160v(Ni/6H-SiC). At room temperature, SBH(Schottky Barrier Height), ideality factor and specific on-resistance were 1.55eV, 1.3, 3.6$\times$10$^{-2}$ $\Omega$.$\textrm{cm}^2$ for Ni/4H-SiC Schottky barrier diodes, and 1.24eV, 1.2, 2.6$\times$10$^{-2}$$\Omega$.$\textrm{cm}^2$/ for Ni/SH-SiC Schottky barrier diodes, respectively. These results show that both Ni/4H-SiC and Ni/6H-SiC Schottky barrier diodes are very promising for high-temperature and high power applications.s..

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Phase Equilibria and Reaction Paths in the System Si3N4-SiC-TiCxN1-x-C-N

  • H.J.Seifert
    • Journal of Powder Materials
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    • v.6 no.1
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    • pp.18-35
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    • 1999
  • Phase equilibria in the system Si3N4-TiC-TiCxN1-x-C-N were determined by thermodynamic calculations (CALPHAD-method). The reaction peaction paths for Si3N4-TiC and SiC-TiC composites in the Ti-Si-C-n system were simulated at I bar N2-pressure and varying terpreatures. At a temperature of 1923 K two tie-triangles (TiC0.34N0.66+SiC+C and TiC0.13N0.87+SiC+Si3N4) and two 2-phase fieds (TiCxN1-x+SiC; 0.13

Simulation study of ion-implanted 4H-SiC p-n diodes (이온주입 공정을 이용한 4H-SiC p-n diode에 관한 시뮬레이션 연구)

  • Lee, Jae-Sang;Bahng, Wook;Kim, Sang-Cheol;Kim, Nam-Kyun;Koo, Sang-Mo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.131-131
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    • 2008
  • Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used a Monte-Carlo method. We studied the effect of channeling by Al implantation simulation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the Al distribution in 4H-SiC through the variation of the implantation energies and the corresponding ratio of the doses. The implantation energies controlled 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2\times10^{14}$ to $1\times10^{15}cm^{-2}$. In the simulation results, the Al ion distribution was deeper as increasing implantation energy and the doping level increased as increasing implantation doses. After the post-implantation annealing, the electrical properties of Al-implanted p-n junction diode were investigated by SILV ACO ATLAS numerical simulator.

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Study on Adhesion of DLC Films with Interlayer (중간층을 이용한 DLC 박막의 밀착력에 관한 연구)

  • Kim, Gang-Sam;Cho, Yong-Ki
    • Journal of the Korean institute of surface engineering
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    • v.43 no.3
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    • pp.127-131
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    • 2010
  • Adhesion of DLC film is very significant property that exhibits wear resistance, chemical inertness and high hardness when being deposited to metal substrate. This study was considered that change adhesion of DLC film produced by Plasma Enhanced Chemical Vapor Deposition can be presented through inserting interlayer (Cr, Si-C:H). The thickness of interlayer was result of changing adhesion and residual stress. It was showed that the maximum 12 N of adhesion is on DLC film of Cr interlayer, and that a tendency is to be increased residual stress depend on the thickness. DLC film of Si-C:H interlayer represented 16 N of adhesion at $1{\mu}m$, whereas adhesion is decreased when the thickness is increased. For the interlayer at multi-layer, it was the best that adhesion of Cr/Si-C:H/DLC film was 33 N. Si-C:H interlayer at DLC film controled adhesion of the whole film. It was relaxed the internal stress of DLC film produced by inserting Cr, Si-C:H interlayer.

Analysis of Spin Exchange Interactions in (C2N2H10)[Fe(HPO3)F3] on the Basis of Electronic Structure Calculations

  • Koo, Hyun-Joo
    • Bulletin of the Korean Chemical Society
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    • v.32 no.2
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    • pp.467-471
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    • 2011
  • Spin exchange interactions of $(C_2N_2H_{10})[Fe(HPO_3)F_3]$ were examined by performing a spin dimer analysis based on extended Huckel tight binding method and a mapping analysis based on first principles density functional theory. Spin exchange interactions occur through the super-superexchange paths $J_1$ and $J_2$ in $(C_2N_2H_{10})[Fe(HPO_3)F_3]$. In the super-superexchange path $J_2$ magnetic orbital interactions between eg-block levels are much stronger than those from $t_{2g}$-block levels. Both electronic structure calculations show that the spin exchange interaction through the super-superexchange path $J_2$ is much stronger than that of $J_1$.

Ferromagnetism and Magnetotransport of GaMnN

  • Kim, K. H.;Lee, K. J.;Kim, D. J.;Kim, C. S.;Kim, C. G.;S. H. Yoo;Lee, H. C.;Kim, H. J.;Y. E. Ihm
    • Proceedings of the Korean Magnestics Society Conference
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    • 2002.12a
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    • pp.146-147
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    • 2002
  • III-V magnetic semiconductors initiated by GaMnAs growth at low temperatures via molecular beam epitaxy (MBE) has been a hot issue recently for their possible application to spntronics. GaMnN may be one of the candidates for room temperature operating ferromagnetic semiconductors as proposed by a theoretical calculation, However, since GaN was grown at very high temperatures above ∼750$^{\circ}C$ even with MBE, it is expected that the incorporation of Mn into GaN will be limited. (omitted)

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The Crystal and Molecular Structure of Carbutamide, ($C_11H_17N_3O_3S$) (Carbutamide ($C_11H_17N_3O_3S$)의 결정및 분자구조)

  • 구정회;조성일;연양희
    • YAKHAK HOEJI
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    • v.26 no.1
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    • pp.9-23
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    • 1982
  • The structure of 1-butyl-3-sulfanyl urea, ($C_{11}H_{17}N_{3}O_{3}S$) carbutamide has been determined from 575 significant independent reflections collected on an automated four-circle diffractometer. The crystals are orthorhomic, space group, $P2_{1}2_{1}2_{1}$, Z=4, with unit cell dimensions a=9.257 (2), b=9.928 (2), c=15.287 (3)${\AA}$. The structure was solved by the direct methods and refined by least-squares procedure to a final R value of 0.062. Features of the structure include layers of molecules joined by N-H....O hydrogen bond distances ranging from 2.745 to 3.100${\AA}$ involved in a bifurcated hydrogen bond across two fold screw along a and b axes. The atoms forming the urea system are essentially planar.

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The Effect of RF Power and $SiH_4$/($N_2$O+$N_2$) Ratio in Properties of SiON Thick Film for Silica Optical Waveguide (실리카 광도파로용 SiON 후막 특성에서 RF Power와 $SiH_4$/($N_2$O+$N_2$) Ratio가 미치는 영향)

  • 김용탁;조성민;서용곤;임영민;윤대호
    • Journal of the Korean Ceramic Society
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    • v.38 no.12
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    • pp.1150-1154
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    • 2001
  • Silicon oxynitride (SiON) thick films using the core layer of silica optical waveguide have been deposited on Si wafer by PECVD at low temperature (32$0^{\circ}C$) were obtained by decomposition of appropriate mixture of (SiH$_4$+$N_2$O+$N_2$) gaseous mixtures under RF power and SiH$_4$/($N_2$O+$N_2$) ratio deposition condition. Prism coupler measurements show that the refractive indices of SiON layers range from 1.4663 to 1.5496. A high SiH$_4$/($N_2$O+$N_2$) of 0.33 and deposition power of 150 W leads to deposition rates of up to 8.67 ${\mu}{\textrm}{m}$/h. With decreasing SiH$_4$/($N_2$O+$N_2$) ratio, the SiON layer become smooth from 41$\AA$ to 6$\AA$.

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