• 대한기계학회논문집B
• /
• 제30권8호
• /
• pp.772-779
• /
• 2006

Window is a critical component in the design of energy-efficient buildings. To minimize the heat loss, insulation performance of the glazing has to be improved. Manufacturing of vacuum glazing has been motivated by the possibility of making windows of very good thermal insulation properties for such applications. It is made by maintaining vacuum in the gap between two glass panes. Pillars are placed between them to withstand the atmospheric pressure. Edge covers are applied to reduce conduction through the edge. Accurate measurements have been made of the radiative heat transfer, the pillar conduction and the gas conduction using a guarded hot plate apparatus. Vacuum glazing is found to have low thermal conductance roughly below $1W/m^2K$. Among the heat transfer modes of residual gas conduction, conduction through support pillar and the radiative heat transfer between the glass panes, the last one is the most dominant to the overall thermal conductance. Vacuum glazing using very low emittance AI-coated glass has an overall thermal conductance of about $0.7W/m^2K$.

• 한국해양공학회지
• /
• 제29권2호
• /
• pp.169-174
• /
• 2015

This paper addresses experimental methodologies to measure the temperature-dependent thermal conductivity of the insulation materials popularly used for LNG cargo containment systems. The measurement techniques considered in this paper are the guarded hot plate (GHP) method and heat flow method (HFM). The former is based on the power supplied to the hot plate to keep the temperature constant, and the latter is based on a direct heat flux measurement. In order to improve the accuracy of the HFM, the thermal conductivity obtained by GHP was cross-compared with the HFM results, and a calibration factor was derived. It was found that the thermal conductivities measured by the two methods corresponded well under room temperature, but the deviation tended to slightly increase as the temperature decreased. Because of the easy installation and operability of HFM, it can be used to measure thermal conductivity in a large scale mock-up test or unit insulation panel test, where the GHP method is difficult to apply.