• 제목/요약/키워드: Growth of Solid

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NUMERICAL SIMULATION OF THREE-DIMENSIONAL DENDRITIC GROWTH WITH FLUID CONVECTION (유체 유동을 동반한 수치상결정 미세구조의 3차원 성장에 대한 수치해석적 연구)

  • Yoon, Ik-Roh;Shin, Seung-Won
    • 한국전산유체공학회:학술대회논문집
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    • 2009.04a
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    • pp.355-362
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    • 2009
  • Most material of engineering interest undergoes solidification process from liquid to solid state. Identifying the underlying mechanism during solidification process is essential to determine the microstructure of material which governs the physical properties of final product. In this paper, we expand our previous two-dimensional numerical technique to three-dimensional simulation for computing dendritic solidification process with fluid convection. We used Level Contour Reconstruction Method to track the moving liquid-solid interface and Sharp Interface Technique to correctly implement phase changing boundary condition. Three-dimensional results showed clear difference compared to two-dimensional simulation on tip growth rate and velocity.

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Cultural Condition for the Mycelial Growth of Phellinus igniarius on Chemically Defined Medium and Grains (화학합성배지 및 곡물을 이용한 Phellinus igniarius의 균사체 배양조건)

  • Jung, In-Chang;Kim, Seon-Hee;Kwon, Yong-Il;Kim, So-Yeun;Lee, Jong-Suk;Park, Shin;Park, Kyung-Sook;Lee, Jae-Sung
    • The Korean Journal of Mycology
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    • v.25 no.2 s.81
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    • pp.133-142
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    • 1997
  • The chemical media composition and culture conditions were optimized for mycelial growth of Phellinus igniarius 26005. The method of solid-state fermentation, cultivation of basidiomycetal strains in various grains, was developed. Media composition for optimal growth of Phellinus igniarius 26005 was made of 7.0% malt extract, 0.3% bacto soytone, and 0.2% yeast extract. The optimum condition for mycelial growth was $28^{\circ}C$ and pH 7.0, respectively. For the mass cultivation of mycelia, the hydrated grains with cold water, were put into the plastic bottle. The mycelial growth rate in the bottled grains was high in the early stage with inoculation of homogenized mycelium. The activity of mycelium was maintained by adding sterilized water in the middle of cultivation. The glucosamine content which determins the mycelial growth rate in solid material was in the order of job's tears>barley>black soybean>wheat>malt soybean>brown rice>sorghum>glutinous rice.

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Behaviors of Grain Growth in Carbide Added TiC Matrix Cermets (탄화물첨가 TiC기지 서멧의 입성장 거동)

  • Shin, Soon-GI;Lee, Jun-Hee;Lee, Hwa-Sang
    • Korean Journal of Materials Research
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    • v.12 no.10
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    • pp.825-830
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    • 2002
  • The growth rate of solid grains in TiC-XC-2vol% and TiC-XC-30vo1% Ni cermets, where X=Zr, W or Mo, was fitted to an equation of the form $d^3$-$do^3$=Kt. The grain growth behavior during liquid phase sintering at 1673K decreased markedly with addition of $Mo_2$C or WC and increased with addition of ZrC. The contiguity ratio was greater in the alloys with smaller growth rate constant and decreased with increasing Ni content in the $TiC-Mo_2$C-Ni cermet. The grain growth mechanism could be explained by the effect of contiguous grain boundaries in restricting the overall grain growth.

Growth Behavior of Intermetallic Compounds in Sn-Ag-Bi/Cu Solder Joints during Aging (Sn-Ag-Bi/Cu 솔더 조인트의 aging시 금속간화합물 성장 거동)

  • Han Sang Uk;Park Chang Yong;Heo Ju Yeol
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.133-137
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    • 2003
  • The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers. This enhanced IMC growth rate was primarily due to the rapid increase In the growth rate of $Cu_6Sn_5$ sublayer. The growth rate of $Cu_3Sn$ sublayers was little influenced and appeared to be retarded by the Bi additions. The observed growth behavior of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers could be understood if the interfacial reaction barrier at the $Cu_6Sn_5/solder$ interface were reduced by the segregation of Bi at the interface.

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