• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.899-902
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• 1997

The heat generated during surface grinding process can lead to elevate a grinding temperature, which cause the thermal damage to the workpiece material. Because of this reason, it is important to be able to predict the temperature which is occurred during grinding. The process parameters, therefore, should be adjusted properly to yield the acceptable workpiece temperature. In this study, we conducted an experimentation to obtain and also to analyze the temperature distribution of the workpiece with accordance in varying the grinding condition. For measuring the workpiece temperature, thermocouples of the CA type were inserted into the predetermined locations of the workpiece.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.918-921
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• 2001

In grinding process, the heat of $1200^{\circ}$~$1500^{\circ}$ on the grinding area between grinding wheel and workpiece is generated. It decreases the surface integrity of workpiece and causes the thermal damages such as the deformed layer, residual stress and grinding burn. Generally coolant is widely used for preventing the heat generation on the grinding area, but it deteriorates the working condition by polluting the atmosphere of workplace and in the end pollutes the environment. The grinding methods using the compressed cold air and mist are the cooling methods to substitute conventional coolant. They can decrease the environmental pollution through not using coolant any more or minimizing it. In this study, the cooling effects of grinding methods using the compressed cold air and mist have been investigated. The grinding system equipped with the water bathe and mist spray nozzle was developed. The energy partition to workpiece through measuring the temperature on the workpiece surface was calculated. The surface integrity of workpiece and thermal damage like the deformed layer were analyzed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.219-224
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• 1997

In surface grinding, the contact between the grinding wheel and the workpiece introduces heat and resistance, which restrict the self-dressing of the grits and result in burrs and cracks on the workpiece. Therefore, before or during th grinding wheel for more accurate performance. In order to determine the dressing time monitoring method of grinding wheel in surface grinding, a three-dimensional computer simulation of the grinding operation has been attempted based on the contact mechanism and surface-shaping system between the grinding wheel and the workpiece. The optimal dressing time is determined based on the amount of the grain wear and work surface roughness.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.90-95
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• 2005

To perform the finish outside-diameter grinding process of ferrules which are widely used as fiber optic connectors, a high-precision centerless grinding machine is necessary. In this study, the thermal characteristics of the high-precision centerless grinding machine such as the temperature distribution, temperature rise and thermal deformation, are estimated based on the virtual prototype of the grinding machine and the heat generation rates of heat sources related to the machine operation conditions. The reliability of the predicted results is demonstrated by the temperature characteristics measured from the physical prototype. Especially, the predicted and measured results show the fact that the high-precision centerless grinding machine consisted of the hydrostatic GW and RW spindle systems, hydrostatic RW feeding mechanism, RW swivel mechanism, on-machine GW and RW dressers, and concrete-filled steel bed, has very stable thermal characteristics.

• Journal of the Korean Society for Heat Treatment
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• v.30 no.5
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• pp.222-226
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• 2017

Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.4
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• pp.118-122
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• 2001

In this study, the variation of surface roughness was tested in surface grinding for the three working materials SM45C, heat-treated SM45C, and gray cat iron. IT was performed for the various grinding wheels with two grain size #60, #100, and three grade I, O, R and various grinding depths and feeds, The fractural grinding depths which were obtained when the grinding wheels were destructed in surface grinding works, were examined and compared with the calculated value sug-gested in this study, The results showed that the surface roughness was decreased by decreasing grinding depth, and feed, and increasing grain size and grades. The fracture grinding depths were increased by increasing grain size, grade and feed.

• Korean Journal of Materials Research
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• v.29 no.4
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• pp.264-270
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• 2019

As a case study on aspect ratio behavior, Kaolin, zeolite, $TiO_2$, pozzolan and diatomaceous earth minerals are investigated using wet milling with 0.3 pai media. The grinding process using small media of 0.3 pai is suitable for current work processing applications. Primary particles with average particle size distribution D50, ${\sim}6{\mu}m$ are shifted to submicron size, D50 ${\sim}0.6{\mu}m$, after grinding. Grinding of particles is characterized by various size parameters such as sphericity as geometric shape, equivalent diameter, and average particle size distribution. Herein, we systematically provide an overview of factors affecting the primary particle size reduction. Energy consumption for grinding is determined using classical grinding laws, including Rittinger's and Kick's laws. Submicron size is obtained at maximum frictional shear stress. Alterations in properties of wettability, heat resistance, thermal conductivity, and adhesion increase with increasing particle surface area. In the comparison of the aspect ratio of the submicron powder, the air heat conductivity and the total heat release amount increase 68 % and 2 times, respectively.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.60-67
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• 2012

In the study, the effect grinding condition on the workpiece arithmetical average roughness(Ra) to 10 steps leading to cutting each section with the spindle rotational speed 8000rpm and feed rate 150mm/min of grinding in GC(green silicon carbide) grinding processing after heat treatment and non heat treatment of SCM415 material. Also the following conclusions were obtained analysis of stress distribution displacement and finite elements method(FEM) on assemble parts with 3+2 axis simultaneous control through grinding and gave a load 11kg on ATC arm both sides gave a load of 11kg. For the centerline average roughness(Ra) in the heat and non-heat treatment work pieces, which were appeared the most favorable in the fifth section were $0.511{\mu}m$ and $0.514{\mu}m$, that were shown in the near the straight line section was the smallest deformation of curve. In addition, the bad surface roughness appeared on the path is too long by changing angle, the more inclined depth of cut, because the chip discharging is not smoothly.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.1
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• pp.112-118
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• 1998

In surface grinding, the contact between the grinding wheel and workpiece introduce heat and resistance, which restrict the self-dressing of the grits and result in burrs and cracks on the workpiece. Therefore, before or during the grinding operation, it is necessary to self-dress the grinding wheel for more accurate performance. In order to determine the dressing time monitoring method of grinding wheel in surface grinding, a three-dimensional computer simulation of the grinding operation has been attempted based on the contact mechanism and surface-shaping system between the grinding wheel and the workpiece. The optimal dressing time is determined based on the grain wear and work surface roughness.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.3 no.2
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• pp.10-17
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• 2004

A real depth of cut in deformed zone has larger than an ideal depth of cut. So the heat generated during grinding operation makes the deformation of a workpiece surface as convex farm. Consequently the workpiece surface remains a geometric error as concave form after cooling In this study, the grinding force and the geometric error were examined in surface grinding. Through magnitude and mode of geometric error were evaluated according to grinding conditions, an optimal grinding condition was proposed to minimize the geometric error In addition, the relationship between the geometric error and the grinding force was examined. Due to least square regression, It was possible to predict the geometric error by using the grinding force.