• Title/Summary/Keyword: Grinding characteristics

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A Study on the Grinding Characteristics of Ceramics (세라믹 재료의 연삭 특성에 관한 연구)

  • 정을섭;김성청;김태봉;소의열;이근상
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.3
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    • pp.86-92
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    • 2002
  • In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel far ceramic materials. Normal component of grinding resistance of $Al_2$O$_3$ was less then that of $Si_3 N_4$ and $ZrO_2$. This seems to be the characteristics of ceramic tools on work pieces both of high hardness. For the case of $Si_3 N_4$ and $ZrO_2$, as the mesh number of wheel increases, the surface roughness decreases. For the case of $Al_2 O_3$, the surface roughness does not decreases. Specific binding energy decreases as the material removal rate per unit time increases. For the case of $Si_3 N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $Al_2 O_3$, grinding is carried out by grain shedding process due to brittle fracture.

A Study on the Improvement of Physical Properties for Titanium Alloy by the Grinding Conditions (연삭가공조건에 따른 티타늄 합금의 물성치 향상에 관한 연구)

  • Kim, Won Il;Lee, Yun Kyung;Wang, Duck Hyun;Heo, Soon
    • Journal of the Korean Society of Industry Convergence
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    • v.4 no.3
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    • pp.237-242
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    • 2001
  • Ti-6Al-4V alloy can be obtained the stability of organization and product treasure, the evaluation of the cutting ability and the mechanical characteristics after the heat treatment of annealing, solution and aging. The difficulty in machining titanium alloy is how treat the heat generated during the process. Because the heat conductivity of titanium alloy is regardfully low, the heat generated during grinding is accumulated in workpiece. and it causes the increasing of grinding wheel grits' wear and makes the ground surface rough. So, these characteristics in grinding of titanium alloy will change the mechanical properties of the titanium alloy. From this study. the mechanical characteristics of annealed one and solution and aging one treated Ti-6Al-4V alloy after grinding was concerned with checking out the bending strength and hardness. For the result, both of bending strength and hardness were increased at the burned area on the surface. Roughness value was remarkably high at the table speed of 10m/min.

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Fracture Characteristics of Carbonized Silicon Grinding Wheels (탄화규소 연삭숫돌의 파괴특성)

  • Oh, Dong-Seuk;Lee, Byong-Gon
    • Journal of the Korean Society of Safety
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    • v.17 no.4
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    • pp.45-51
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    • 2002
  • In this study, the fracture characteristics of carbonized silicon grinding wheels were examined with tensile, compression, impact and bending test. The experiment was performed for the various grinding wheels with grain size #46, #80, and grade H, L, P, and one vitrified bond and one structure No.7. Also the centrifugal fracture rpm of carbonized silicon grinding wheels were measured and compared with the calculated values for the various wheel diameters and thicknesses. The results showed that the fracture tensile strength was $1.5~2.0Kg_f/mm^2$, and it was increased by decreasing grain size and increasing grade. The fracture compression loads were $1,600~3,000Kg_f$, and the inner stress was higher than outer's. And the absorption energy of impact test was 3.3~4.7 J, and it was increased by decreasing grain size but it was not effected by grade. The fracture bending stress was $0.1~0.2Kg_f/mm^2$, and it was increased by decreasing grain size and increasing grade. The centrifugal fracture rpm of carbonized silicon grinding wheel was about 8,500~12,000 and agreed well with the calculated value, and it was increased by decreasing diameter. However, it was almost constant for the reduction of wheel thickness.

A Development of Micro-Positioning Grinding Table using Piezoelectric Voltage Feedback (압전전압 궤환에 의한 미세구동 연삭테이블의 개발)

  • Nam, Soo-Ryong;Kim, Jeong-Du
    • Journal of the Korean Society for Precision Engineering
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    • v.12 no.2
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    • pp.48-58
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    • 1995
  • A micro positioning system using piezoelectric actuators have very wide application region such as ultra-precision machine tool, optical device, measurement systen. In order ro keep a high precision displacement resolution, they use a position sensor and feedback the error. From the practical point of view, a high-resolution displacement sensor system are very expensive and difficult to guarantee such sensitive sensors work properly in the hard opera- tion environment of industry. In this study, a micro-positioning grinding table which does not require position sensor but uses piezoelectric voltage feedback, has been developed. It is driven by hystersis-considering reference input voltage which calculated from computer and then uses actuator/sensor characteristics of piezoelectric materials. From the result of experiments we proved a fast and stable response of micro-positioning system and suggested efficient technique to control the piezoelectric actuator. And through grinding experiments, it is revealed that a characteristics of ground surfaces transient to plastic deformation as extremely small depth of grinding.

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A Study on the Grinding Characteristics using Automatic Balancer (Automatic Balancer를 이용한 연삭특성 연구)

  • 김해지
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.498-501
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    • 1999
  • Grinding machine rotating at high speed express the unbalance by the spindle and the weight of grinding wheel. Therefore, the parts requiring a precision processing for grinding machine need acutely to establish of automatic balancer. But the more wheel speed increases the more vibration amplitude increases, surface roughness show the satisfactory according to increase of the wheel speed. Surface roughness of the occasion installing the automatic balancer made better than an occasion no installing the automatic balancer.

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Analysis of Grinding Characteristics of Ceramic (SiC) Materials (세라믹 소재의 연삭가공 특성 분석)

  • Park, Hwi-Keun;Park, Sang-Hyeon;Park, In-Seung;Yang, Dong-Ho;Cha, Seung-Hwan;Ha, Byeong-Cheol;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.1
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    • pp.16-22
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    • 2018
  • Silicon carbide (SiC) is used in various semiconductor processes because it has superior thermal, mechanical, and electrical characteristics as well as higher chemical and corrosion resistance than existing materials. Due to these characteristics, various manufacturing technologies have been developed for SiC. A recent development among these technologies is Chemical Vapor Deposition SiC (CVD-SiC). Many studies have been carried out on the processing and manufacturing of CVD-SiC due to its different material characteristics compared to existing materials like RB-SiC or Sintered-SiC. CVD-SiC is physically stable and has excellent chemical and corrosion resistance. However, there is a problem with increasing the thickness, because it is manufactured through a deposition process. Additionally, due to its high strength and hardness, it is difficult to subject to machining.

Mirror Surface Grinding Characteristics and Mechanism of Carbon Fiber Reinforced Plastics (탄소섬유강화 플라스틱의 경면연삭가공 특성)

  • 박규열;이대길;중천위웅
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.10
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    • pp.2514-2522
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    • 1994
  • The mirror surface grinding of carbon fiber reinforced plastics(CFRP) was realized by using the metal bonded super-abrasive micro grain wheel with electrolytic in-process dressing(ELID). The maximum surface roughness $R_{max}$ of CFRP which was obtained with #6,000 wheel, was 0.65 $\mu{m}$, which was rougher surface finish compared to those of hard and brittle materials with the same mesh number wheel with ELID. The grinding performance was much dependent on the grinding direction and the best surface roughness was obtained at $90^{\circ}C$ grinding with fiber direction. The spark-out effect on the surface improvement was significant when smaller mesh number grinding wheels were used. From the surface observations of CFRP with scanning electron microscope(SEM) and Auger electron spectroscopy(AES), it was found that the mirror surface grinding of CFRP was generated by the homogenization due to carbonization of the ground surface and smearing of chips composed of the carbon fiber and carbonized epoxy resin into the ground surface.