• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 한국공작기계학회 1998년도 추계학술대회 논문집
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• pp.293-298
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• 1998

In surface grinding, the conditions of the grinding wheel give a significant effect on the ground workpieces comparing with other metal removal processes. In this paper, to assist the development, a non-contacting optical method is introduced to make in-process measurements of scattering intensities from laser beam during surface grinding processes. This show indications of changes in surface texture of wheel working surfaces. Also, in order to determine the dressing time monitoring method of grinding wheel in surface grinding, a three-dimensional computer simulation of the grinding operation has been attempted based on the contact mechanism and surface-shaping system between the grinding wheel and the workpiece. The optical dressing time is determined based on the amount of the grain wear and work surface roughness.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.405-409
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• 2003

We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed depth of cut and feed rate were altered while grinding the workpiece surfaces of 20m in diameter. Surface roughness is measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness better than 0.02${\mu}{\textrm}{m}$ Ra and the form accuracy of around 0.2${\mu}{\textrm}{m}$ PV.

• International Journal of Precision Engineering and Manufacturing
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• 제8권3호
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• pp.24-44
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• 2007

Cylindrical grinding is one of the important metal cutting processes used extensively in the finishing operation of discrete components. The inherent high cutting temperature in grinding if not controlled may lead to rapid tool wear, which in turn will lead to dimensional inaccuracy. The very nature of the grinding mechanism in material removal impairs the grounded surfaces by inducing residual stress, micro cracks and other thermal damages at the machined surface. This paper is an attempt to review some of the surface integrity issues in cylindrical grinding taken up and reported by number of researchers over the years. This review may have been planned to be useful to the researchers and other professionals interested to work on grinding.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.308-313
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• 2002

In order to investigate the characteristics of grinding and diamond wheel grinding ceramic materials, grinding resistance, surface roughness of worked surface and image of grinding wheel were acquired using experimental method. Through the experiments, this makes it possible to observe grinding wheel behavior by grinding resistance, surface roughness and cutting edge ratio. In case of A1$_2$O$_3$, cutting edge ratio is begger than that of ZrO$_2$and Si$_3$N$_4$. That's because A1$_2$O$_3$has a characteristics of low fracture toughness and bending stress.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.15-20
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• 1999

In this study, the effects of the maximum grit depth of cut on the grinding characteristics were investigated. And AE signals produced during grinding processes have been studied to find out the appropriate AE parameters for assessing grinding processes. S45C steel has been ground under the conditions yielding removal rate of workpiece, 100, 200, 300 and 400rnm$^3$/min which was achived by altering workpiece velocity($\upsilon$) and apparent depth of cut(Z). According to the experimental results, the value of surface roughness increases but grinding power, energy rate of AE signal(AErms$^2$) and specific grinding energy consumed decrease with increase of the maximum grit depth of cut.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• Journal of the Korean Society for Precision Engineering
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• 제23권1호
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• pp.113-120
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• 2006

This paper proposed the control algorithm fur aspheric surface grinding and was verified by the experiment. The functions of the algorithm were simultaneous control of the position and interpolation of the aspheric curve. The non-linear formula of the tool position was derived from the aspheric equations and the shape of the tool. The function was partitioned by an certain interval and the control parameters were calculated at each control section. The movement in a session was interpolated with acceleration and velocity. The position error was feed-backed by rotary encorder. The concept of feedback algorithm was correcting position error by increasing or decreasing the speed. In the experiment, two-axis machine was controlled to track the aspheric surface by the proposed algorithm. The effect of the control and process parameters was monitored. The result showed that the maximum tracking error was under sub-micro level for the concave and convex surfaces.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.355-359
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• 2001

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel grinding ceramic materials. Normal component of grinding resistance of $AI_2O_3$ was less then that of $Si_3N_4$ and $ZrO_2$. It is because the resistance for grain shedding is less then that for layer formation. For the case of $Si_3N_4$ and $ZrO_2$, as the grain mesh number of wheel increases, the surface roughness decreases. For the case of $AI_2O_3$, the surface roughness does not decreases. For the case of $Si_3N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $AI_2O_3$, grinding is carried out by grain shedding process.

• Journal of the Korea Academia-Industrial cooperation Society
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• 제13권12호
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• pp.5704-5708
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• 2012

In this paper, the algorithm to determine the optimal condition of traverse grinding is proposed by using differential evolution algorithm(DEA). The cost function to determine the optimal grinding condition is designed with considering process cost, production rate, surface roughness. Also, the constraint conditions for grinding such as thermal damage effect, machine tool stiffness, wear parameter of grinding wheel, surface roughness are considered. The algorithm is implemented with LabView software which is widely used at the industrial field. The performance of proposed algorithm is verified by comparing with the result of genetic algorithm(GA) through computer simulation.

• Transactions of the Korean Society of Machine Tool Engineers
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• 제11권1호
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• pp.26-31
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• 2002

In this study an experimental investigation was conducted to find the grinding characteristics of ceramics, STD11 and STS304 materials. The grinding force and the microscopic observation of the workpieces were obtained in surface grinding. Grinding characteristics of ceramics were inspected through the microscopic examination the cutting force, and the surface roughness. It has been found that the finding force of ceramics is relatively low as compared to that of steels and that CBN wheel has an excellent performance. The surface roughness was measured according to the feedrate and the depth of out.