• 제목/요약/키워드: Grinding Condition

검색결과 219건 처리시간 0.027초

실험 계획법을 이용한 세라믹 재료의 최적 연삭 조건에 관한 연구 (A Study on the Optimal Grinding Condition of Ceramics using the Design of Experiments)

  • 정을섭;김성청;소의열;이근상
    • 한국정밀공학회지
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    • 제19권8호
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    • pp.141-146
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    • 2002
  • This paper has studied to obtain the grinding characteristics and optimal grinding conditions of ceramic materials in the grinding with diamond wheel by design of experiments. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the $Si_3\;N_4\;and\;ZrO_2$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the $A1_2\;O_3$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using design of experiments.

CBN 숫돌을 이용한 연삭에서 공작물의 표면성상 분석 (Analysis on Surface Characteristics of the Workpiece in the Grinding by CBN Wheel)

  • 이영석;곽재섭;하만경;구양;윤문철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.1105-1108
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    • 2001
  • In these days, according s the increase of technological development the part demension goes up for ultra-precision. It is grinding behavior that is important processing which directly influences by machining accuracy at product quality with the net shape manufacturing. In this study, by using CBN wheel an analysis carried out for workpiece's profiles and its characteristics by measuring grinding force and surface roughness. Workpiece materials were used STD11, SUS304 and STB2 varing condition of feedrate and depth of cut.

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컴퓨터 비젼을 이용한 연삭 숫돌의 마멸 검출에 관한 연구 (A Study on the Detection of Wheel Wear by computer vision System)

  • 유은이;사승윤;김영일;유봉환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1994년도 추계학술대회 논문집
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    • pp.119-124
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    • 1994
  • Morden industrial society pursues unmanned system and automation of manufacturing rocess. Abreast with this tendensy, prodution of goods which requires advaned accuracy is increasing as well. According to this, the work sensing time of dressing by monitoring and diagnosis the condition of grinding, which is the representative way in accurate manufacturing, is a important work to prevent serios damages which affect grinding process or products by wearing wheel. Computer vision system is composed, so that grind wheel wurface was acquired by CCD camera and the change of cutting is composed. Then we used autometic threshoding technique from histogram as a way of deviding cutting edge which is used in manufacturing from the other parts. As a result, we are trying to approach unmanned system and sutomation by deciding more accurate time of dressing and by visualizing behavior of grinding wheel by marking use of computer vision.

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Ball Mill 분쇄에 의한 고령토의 미분성분 생성과정의 해석(II) (Analysis of Production Process of Fine Size Fraction of Korean Kaolin by Ball Mill Grinding II)

  • 서태수;심철호;김상필
    • 한국세라믹학회지
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    • 제24권1호
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    • pp.1-8
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    • 1987
  • The validity of Alyavdin-Chujyo's Equation was re-examined over the broader milling conditions that those previously examined. Ordinary ball mill grinding with a laboratory scale batch mill (133mmø×144mm length) were selected as the grinding methods. The results show that in ball milling the Alyavdin-Chunjyo's Equation can be applicable over wide grinding time and size range with few exceptions. The validity of which are examined and discussed. The theoretical consideration of the relation between Alyavdin-Chujyo's Equation and size distributiion equation, such as Rosin-Rammler's law, was tried, and it is found that, under the condition of alyardin-Chujyo's relation, the Rosin-Rammler size distribution law can hold.

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원격조종 콘크리트 표면절삭 장비를 위한 머신비전 기반 품질관리 시스템 (Machine Vision based Quality Management System for Tele-operated Concrete Surface Grinding Machine)

  • 김정환;피승우;서종원
    • 대한토목학회논문집
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    • 제33권4호
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    • pp.1683-1691
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    • 2013
  • 콘크리트 표면절삭 작업은 포장면의 노화 또는 파손으로 인한 보수작업과 그루빙(Grooving) 시공을 통한 포장면의 배수능력을 강화하거나 평탄성을 확보를 위하여 자주 적용되는 공법이다. 그러나 그 작업특성이 노동집약적이고 분진, 슬러지, 소음 등으로 인한 유해한 작업환경을 보유하고 있으며 장비를 다루는 기능공의 숙련도에 따라 생산성 및 절삭품질의 편차가 큰 경향이 있다. 따라서 장비 조종자가 각종 위험에 노출되지 않도록 하기 위한 원격조종 콘크리트 표면절삭 장비 개발이 필요하다. 원격 조종 환경에서는 조종자가 객관적인 절삭 품질을 확인함과 동시에 장비가 계획 경로에 따라 작업이 올바르게 수행되고 있는지를 확인할 수 있도록 하는 지원시스템이 필요케되는 바, 본 연구에서는 머신비전 시스템(Machine Vision System)과 GPS를 적용하여 네트워크 카메라로 촬영한 절삭면의 이미지를 디지털 영상처리(Image Processing)과정을 거쳐 객관적이며 품질관리 프로세스가 자동화된 시스템을 구축하였다. 또한 장비의 현재 위치와 방향, 속도, 계획된 경로와의 오차정보 그리고 작업의 진척도 등을 종합적으로 산출하여 워크 스테이션에 표시함과 동시에 머신 비전 시스템에 의한 작업 품질 정보와의 통합을 위한 프로그램을 개발하였으며, 현장 적용 테스트를 통해 본 기술을 검증하였다.

Extracting Gold from Pyrite Roster Cinder by Ultra-Fine-Grinding/Resin-in-Pulp

  • Guo, Bingkun;Wei, Junting
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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    • pp.337-341
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    • 2001
  • A new method to extract gold from pyrite roster cinder, which combines ultra-fine-grinding with resin-in-pulp, has been studied in this paper. Compared with traditional leaching technology, it can short leaching time, avoid complex filter process, lower sodium cyanide consumption and increase gold recovery by 35%. During leaching, aluminium oxide ball was used as stirred medium, hydrogen peroxide as leaching aid and sodium hexametaphosphate as grinding aid. With the high efficiency and chemistry effect of ultra-fine-grinding, the leaching process was developed and the gold leaching rate may reach 88%. With AM-2 Б resin as abosorber and sulfocarbamide (TU) as eluent, gold was recovered from cyanide pulp by resin-in-pulp. AM-2 Б resin has good adsorbability in cyanide solution(pH=10). It was easy to elude gold from the loaded resin with 0.1㏖/L cholhydric acid and 1㏖/L sulfocabamide. The effect of contact time, temperature and acidity etc. on the gold absorption had been examined with static methods. The results showed that the adsorption and desorption of gold could both reach over 98%. The effects of flow rate of solution on dynamic adsorption and elution of gold had been examined with dynamic methods. Breakthrough curve and elution curve had been drawn in this paper. A mild condition was determined through a number of experiments: leaching time 2 hours, liquid solid ratio 4:1, sodium cyanide 3kg/t, hydrogen peroxide 0.05%, sodium hexametaphosphate 0.05%; adsorption time 30 minutes, temperature 10-3$0^{\circ}C$, resin($m\ell$) solid(g) ratio 1:10, eluent resin ratio 10-20:1, velocity of eluent $1.5m\ell$/min. Under the mild condition, the gold recovery may reach 85%.

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콘크리트 표면절삭 장비의 품질관리를 위한 머신비전 알고리즘 개발 (A Study of the Machine Vision Algorithm for Quality Control of Concrete Surface Grinding Equipment)

  • 김정환;서종원;송순호;이원식
    • 한국건설관리학회:학술대회논문집
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    • 한국건설관리학회 2007년도 정기학술발표대회 논문집
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    • pp.983-986
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    • 2007
  • 콘크리트 표면절삭 작업은 콘크리트 표면의 평탄성 및 부착성을 필요로 하는 공사에서 빈번히 사용되고 있으나 작업형태가 노동집약적이며, 유해한 작업환경을 보유하고 있다. 또한 장비를 다루는 기능공의 숙련도에 따라 생산성 및 절삭품질의 편차가 큰 경향이 있다. 그러므로 주변 환경오염 방지와 장비 조종자가 위험에 노출되지 않도록 하기 위한 원격조종 콘크리트 표면절삭 장비 개발이 요구된다. 그러나 원격 조종 시스템에서 조종자가 절삭면의 품질을 측정하기 난해하고 품질에 대한 객관적인 판단을 내리기가 어려우므로, 본 연구에서는 머신비젼시스템(Machine Vision System)을 적용하여 네트워크 카메라로 촬영한 절삭면의 이미지를 디지털 영상처리(Image Processing)과정을 거쳐 그 결과를 그래픽 MMI(Man-Machine Interface) 프로그램에 표현함으로써 품질관리 시스템을 구축하였다. 머신비전 알고리즘은 콘크리트 절삭면의 디지털 영상처리 알고리즘을 의미하며 본 논문에서 제안된 알고리즘을 적용하여 콘크리트 절삭면의 객관적인 품질관리 기준을 제시하고자 한다.

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마이크로 필름을 이용한 경면연마가공 특성에 관한 연구 (A Study on the Characteristics of the Mirror Surface Abrasive Finishing using Micro Abrasive Film)

  • 김홍배;배명일;남궁석
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.970-976
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    • 1997
  • The ultra-precision machining is widely used for final machining process of precision parts, so in this study, mirror surface finishing systems using the micro abrasive film, one of ultra-precision machining method, have to examine mirror surface characteristics of the cylindrical workpiece(SM45) such as surface roughness, workpiece removal and evaluated under the condition varing film feed rate, applied pressure, grinding speed after fixing other condition. It was found that varrious machining condition have significant influences on workpiece removal, surface roughness.

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ENGINEERING CERAMICS의 평면연삭가공 특성에 관한 연구

  • 김호철;김원일;강재훈
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1992년도 추계학술대회 논문집
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    • pp.136-144
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    • 1992
  • Recently, Silicon Nitrde ceramic is regarded as the representative engineering ceramic with the excellent mechanical properties and many functions for mechanical components and parts among various kinds of ceramics in the mechanical industry. But, during the manufacturing of engineering ceramics, there is many volumetric shrinkage coupled with a distortion of the parts which is produced. Due to the requirement for high accuracy of size, form, and surface finish of the components, machining is needed surely. Nowdays, grinding with a resin bond type diamond wheels has been generally applied to machining of the engineering ceramics in the whole world because that it can be conveniently proceeded for workers to dress of tool and made with high reliability in producing factories among many bond type super-abrasive wheels yet. It is important task for attaining prescribed mechanical components with high reliability to observe the grinding mechanism of ceramics as like generation of cracks and chipping of material during process. Because they considerably effects on the strength characteristic of machined mechanical components. In this study, various surface grinding experiments using resin bond type diamond wheels are carried out for Silicon Nitride ceramic. Grinding mechanism of ceramics is observed experimentally and the relationship with various conditions is also attained. Form this experimental study, some useful machining data and information to determine proper machining condition for grinding of Silicon Nitride ceramic is obtained.

CVD-SiC 소재의 가공 특성에 관한 연구 (A Study on the Machining Characteristics of CVD-SiC)

  • 박휘근;이원석;강동원;박인승;이종찬
    • 한국기계가공학회지
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    • 제16권5호
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    • pp.40-46
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    • 2017
  • A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.