• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1119-1120
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• 2006

High Energy Milling (HEM) is applied for the grinding of cement and this can lead to substantial refinement $(<2{\mu}m)$ and mechanically activation of the powder particles. The present paper reviews the preliminary studies, explains the novel technique and suggests the route into commercial application. Particular attention is paid to wear results with an applied $Si_3N_4-grinding$ unit where no substantial wear was found after 4000 h of operation.

• 한국생산제조학회지
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• 제19권2호
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• pp.275-281
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• 2010

This research's goal is to process directly aspherics with big sagment and thin center thickness. If we can process directly aspherics with big sagment and thin center thickness, we think it greatly helps to reduce the time of developing optical system. We made very thin glass using diamond grinding whetstone regarding the trace of tool and the detailed drawing of tool super precisive aspherics that has 0.46mm center thickness and over $30^{\circ}$ segment, $0.1{\mu}m$ machining accuracy, 15nm surface accuracy. We think this research's result will be effective to open new market because it is applied not only cell phone optical system but also CCTV robot optical system, internet phone optical system. Also we expect to enhance the super strong brittle precisive process's possibility with super precisive processing technique that achieves 0.46mm glass center thickness as first in the world.

• 한국기계가공학회지
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• 제18권1호
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• pp.9-15
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• 2019

This study focused on the application of ELID mirror-surface grinding technology to the manufacture of off-axis asymmetric large-area reflecting mirrors made of BK7 glass. The size of the parts, such as asymmetric large-area mirrors or lens, made form-accuracy or roughness especially hard to measure after machining because of the measuring range limit of measurement devices. In this study, the ELID grinding system has been set up for mirror-surface machining experiments manufacturing off-axis asymmetric lenses. A measuring method using a reference workpiece has been suggested to measure the form-accuracy and roughness. According to the experimental results, even when using only a reference workpiece, it is confirmed that the surface roughness was 8 nmRa and form-accuracy was 80 nmRMS, with a best fit asymmetric radius when using a grinding wheel of #8,000. It is found that the accuracy of large-area parts could be estimated by the proposed process.

• 마이크로전자및패키징학회지
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• 제16권3호
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• pp.61-65
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• 2009

단결정 실리콘 웨이퍼 위에 그라인딩 공정을 사용하여 인위적으로 결정학적 결함을 만들고 선택적 습식 식각 공정을 통하여 반사율을 저감시켜 태양전지에 적용할 수 있는 새로운 표면 조직을 형성하였다. 식각 용액의 농도와 식각 시간에 따른 표면 형태의 변화를 분석하고 그에 따른 표면의 광학적 반사율의 변화를 측정하였다. 결정학적 결함 분석과 표면 형태의 관찰은 각각 투과전자 현미경과 주사전자현미경을 이용하였고 광학적 특성은 spectrophotometer를 이용하여 분석하였다. 상기 방법에 의한 최적화된 실리콘 표면의 반사율은 평균 1%이하의 우수한 결과를 보였으며 짧은 공정시간 및 가격효율성 면에서 효과적인 제조 방법이라고 사료된다.

• Restorative Dentistry and Endodontics
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• 제27권6호
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• pp.569-576
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• 2002

This study was peformed to evaluate the interfacial shear bond strength of base (direct and indirect) and repair composites with aging and surface treatment methods. Direct composite resin specimens ($Charisma^{\circledR}$, Heraeus Kulzer, Germany) were aged for 5 min, 1 hour, 24 hours, and 1 week in $37^{\circ}C$ distilled water before surface treatment, and then divided into five groups Group 1, grinding; Group 2, grinding and application of bonding agent, Group 3, grinding, etching with 37% phosphoric acid for 30sec, and application of bonding agent, Group 4, grinding, etching with 37% phosphoric acid for 30sec, silane treatment, and application of bonding agent ; Group 5, grinding, etching with 4% hydrofluoric acid for 30sec. silane treatment, and application of bonding agent. Indirect composite resin specimens ($Artglass^{\circledR}$, Heraeus Kulzer, Germany) were aged for 1 week in $37^{\circ}C$ distilled water and divided into seven groups Group 1 - Group 5, equal to Charisma specimens; Group 6, grinding, etching with 37% phosphoric acid for 60sec, silane treatment, and application of bonding agent; Group7, grinding, etching with 4% hydrofluoric acid for 60 sec, silane treatment, and application of bond-ing agent. The repair material($Charisma^{\circledR}$) was then added on the center of the surface (5 mm in diameter. 5 mm in height). The shear bond strength was tested and the data was analyzed using one-way ANOVA and the Student- Newman-Keuls test. The following conclusions were drawn. 1 The shear bond strength of $Charisma^{\circledR}$ specimens aged for 1 hour was significantly higher in Group 2 and Group 5 than in Group 1 (p<0.05), and that of $Charisma^{\circledR}$ specimens aged for 1 week was signifi-cantly higher in Group 3 and Group 5 than in Group 1 (p<0.05). No significant difference was found in the bond strength of specimens aged for 5 min and 24 hours. 2. In Group 2 of the $Charisma^{\circledR}$ specimens, there was significant difference between the bond strength of 24 hours and that of 1 week (p<0.05). 3. In Group 4 of the $Charisma^{\circledR}$ specimens, the shear bond strength of specimens aged for 24 hours was significantly higher than the others(p<0.05) 4. There was no significant difference between the shear bond strength of the $Artglass^{\circledR}$ specimens, 5. Most of the $Charisma^{\circledR}$ specimens showed cohesive fractures. Artglass^{\circledR}$ specimens that were etched with acid (phosphoric or hydrofluoric) for 30 sec showed more cohesive fractures.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.389-390
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.100-103
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• 2005

In this study, tool path control algorithm for aspherical surface grinding was derived and discussed. The aspherical surface actually means contact points between lens and tool. Tool positions are generally defined at the center of a tool, so there is difference between tool path and lens surface. The path was obtained from contact angle and relative position from the contact point. The angle could be calculated after differentiating an aspheric equation and complex algebraic operations. The assumption of the control algorithm was that x moves by constant velocity while z velocity varies. X was normal to the radial direction of lens, but z was tangential. The z velocities and accelerations were determined from current error and next position in each step. In the experiment, accuracy of the control algorithm was checked on a micro-precision machine. The result showed that the control error tended to be diminished when the tool diameter increased, and the error was under sub-micro level.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.999-1002
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• 1997

In this study, in order to set ELID conditions in the internal grinding wheel, the characteristics with the variations of grit size, output voltage and peak current were examined by using conventional machining center(M/C) equipped with electrolytic in-process dressing(EL1D). The initial working voltage was lowered and the working current was high with increasing grit size. The insulating layer thickness increased, as the final voltage increased with the output voltage and peak current. The initial wear rate of the wheel machined with ELID were measured indirectly by using surface roughness tracer. The initial wear rate of the wheel with ELID increased along with high grit size. In case that the grit size with ELID was low, the output voltage and peak current had to be increased to increase the insulating layer thickness. In case of the high grit size, the output voltage and the peak current were established low, which made the insulating layer thickness decreased.

• 청정기술
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• 제10권3호
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• pp.139-148
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• 2004

스와프는 철강 제조 공정 중에 발생되는 금속 부산물로서 연마유의 함량이 10%이상 되므로 국내에서 지정폐기물로 분류된다. 연마유가 함유된 스와프를 재활용하기 위하여 초임계 이산화탄소를 이용하여 재생하였고, 온도(313.15K-323.15K), 압력(10MPa-30MPa)의 실험 조건이 연마유 추출 효율에 미치는 영향을 살펴보았다. 초임계 이산화탄소의 압력이 높을수록 높은 추출 효율을 보였고, 같은 압력을 기준으로 하였을 때는 온도가 높을수록 빠른 시간 내에 추출 공정이 완료됨을 확인하였다. 본 실험에서는 선형 탈착 kinetics가정의 단일 매개 변수 모델을 사용하여 재생 효율을 예측하였고, 이는 실험 결과와 비교적 잘 일치하였다.

• 한국신뢰성학회지:신뢰성응용연구
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• 제16권1호
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• pp.26-31
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• 2016

Purpose: The purpose of this study was to investigate the effect of grinding process and thickness on the fracture strength of silicon die used for semiconductor substrate. Method: Silicon wafers with different thickness from $200{\mu}m$ to $50{\mu}m$ were prepared by chemical mechanical polishing (CMP) and dicing before grinding (DBG) process, respectively. Fracture load was measured by point load test for 50 silicon dies per each wafer. Results: Fracture strength at the center area was lower than that at the edge area of the wafer fabricated by DBG process, while random distribution of the fracture strength was observed for the CMPed wafer. Average fracture strength of DBGed specimens was higher than that of the CMPed ones for the same thickness of wafer. Conclusion: DBG process can be more helpful for lowering fracture probability during the semiconductor fabrication process than CMP process.