• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.561-562
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• 2006

To enhance the precision and productivity of ultra precision aspheric surface micro lens, the development of ultra-precision grinding system and process for the aspheric surface micro lens are described. In the work reported in this paper, an ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the grinding surface roughness and profile accuracy. This paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. The optimization of grinding conditions on ground surface roughness and profiles accuracy is investigated using the design of experiments.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1099-1104
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• 2004

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.10
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• pp.195-201
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• 2002

This paper deals with the precision grinding for aspherical surface of optical parts. A parallel grinding method using the spherical wheel was suggested as a new grinding method. In this method, the wheel axis is positioned at a $\pi$/4 from the Z-axis in the direction of the X-axis. An advantage of this grinding method is that the wheel used in grinding achieves its maximum area, reducing wheel wear and improving the accuracy of the ground mirror surface. In addition, a truing by the CG (curve generating) method was proposed. After truing, the shape of spherical wheel transcribed on the carbon is measured by the Form-Talysurf-120L. The error of the form in the spherical wheel which is the value ${\Delta}x$ and $R{^2}{_y}$ inferred from the measured profile data is compensated by the re-truing. Finally, in the aspherical grinding experiment, the WC of the molding die was examined by the parallel grinding method using the resin bonded diamond wheel with a grain size of ＃3000. A form accuracy of 0.16${\mu}m$ P-V and a surface roughness of 0.0067${\mu}m$ Ra have been resulted.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.3
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• pp.143-149
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• 2000

Grinding technology in morden industry society is focusing on research and development for grinding stone and machin-ing parts for the purpose of high accuracy and high efficiency of products. But in order to equip the high technology and high accuracy of micro stone which is one of grinding stone a continuous effort on R& D is require. In this study the honing processing work of 2 cycle engine cylinder for motorcycle which has an open hole is carried out so as to investigate the boring and hone stone effects on accuracy of honing. As the experimental result of this study we could conclude that it is possible to secure good conditions of honing by controlling and keeping appropriate cycle-time in the stage of boring for the prior step of honing.

• Journal of Mechanical Science and Technology
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• v.16 no.5
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• pp.633-638
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• 2002

An approach to enhance dimensional accuracy of the grinding process has been presented, and grinding of a glass material with a metal-bonded diamond wheel has been studied. In this study, a grinding tool is suspended flexibly and controlled by an electromagnetic actuator. During grinding, profile error of a ground surface is indirectly measured and fed back to a control system. A model of grinding error has been suggested on which the indirect measurement has been based. An optimal PID control is adopted and effectiveness of the in-process feedback control has been verified experimentally.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.34-38
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• 1996

Cylindrical plunge grinding is widely used for final machining process of precision parts such as automobile, aircraft, measurement units. In order to make parts which have high precison accuracy and high surface integrity, it is neccessary to consider grinding characteristics. these grinding characteristics are closely related grinding force. Soin this study, to examine closely characteristics of grinding force, effects of dressing condition, depth of cut and speed ratio on grinding force are considered. As the result, It is shown that grinding forces are affected bydressing condition, depth of cut and speed ratio and that there exist threshod grinding force and it also affected by dressing conditon.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.20-23
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• 2002

In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

• Journal of the Korean Society for Precision Engineering
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• v.11 no.5
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• pp.42-55
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• 1994

Presently, abrasive processing is on eof several methods for cutting and grinding brittle materials, and high quality in dimensional accuracy and surface roughness are often required as a structural components, therefore most of them has to be ground. In manufacturing of tungsten-carbide components, grinding by diamond wheel is usually adopted in order to provide configurational and dimensional accuracy to the components. The present study proposes the experi- mental research of optimum condition to the high quality surface grinding of the WC-Co material using diamond abrasive wheel in order to minimize the damage on the ground surface and to pursue the precise dimension by conventional grinding machine. Brief investigation is carried out to decrease the dressing is constant, theoretical grinding effect such as machining precision is changed according to the speed of workpiece. Accordingly, normal and tangential grinding forces, which are Fn, Ft were analyzed for the machining processes of WC-Co material to obtain optimum grinding conditions, 3-point bending test is carried out to check machining damage on the ground surface layer, which is one of sintered brittle materials.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.905-909
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• 1997

A geometric error of machine parts is one of the most important factors that affect the accuracy of positioning, generating and measuring for precision machinery. It is known that the thermal deformation of a workpiece during surface grinding is the most important in the geometric error of ground surface. This paper experimentally describes the grinding characteristics of creep-feed grinding. The wheels have 6 slotted pieces in order to compare the grinding temperature with the geometric.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.8
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• pp.52-59
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• 1996

Conventionally, grinding of stainless steel, aluminium ally, copper alloy, and titanum alloy are difficult to obtain the high quality finish, because they have the mechanical properties such as low hardness, high toughness which result in the loading of wheel and the poor surface finish. Inorder to perform the grinding operations for these sorts of materials easily, the discontinuous grinding wheel with multi-porous grooves has newly been developed. The multi-porous grooves were formed during wheel production. This discontinous grinding wheel increases the grinding performance. It is desirable to use the discontinuous grinding wheel when grinding materials wiht high efficiency and accuracy which is impossible by conventional wheels. In this paper, the constructing and manufacturing method of grinding wheel with multi-proous grooves are explained, and the grinding charateristics of discontinuous grinding wheel are also illustrate.