• Title/Summary/Keyword: Grid alloy

Search Result 35, Processing Time 0.021 seconds

Effect of Electroplating Parameters on Oxygen Evolution Reaction Characteristics of Raney Ni-Zn-Fe Electrode (Raney Ni-Zn-Fe 전극의 산소발생 반응 특성에 미치는 도금변수의 영향)

  • CHAE, JAEBYEONG;KIM, JONGWON;BAE, KIKWANG;PARK, CHUSIK;JEONG, SEONGUK;JUNG, KWANGJIN;KIM, YOUNGHO;KANG, KYOUNGSOO
    • Transactions of the Korean hydrogen and new energy society
    • /
    • v.31 no.1
    • /
    • pp.23-32
    • /
    • 2020
  • The intermittent characteristics of renewable energy complicates the process of balancing supply with demand. Electrolysis technology can provide flexibility to grid management by converting electricity to hydrogen. Alkaline electrolysis has been recognized as established technology and utilized in industry for over 100 years. However, high overpotential of oxygen evolution reaction in alkaline water electrolysis reduces the overall efficiency and therefore requires the development of anode catalyst. In this study, Raney Ni-Zn-Fe electrode was prepared by electroplating and the electrode characteristics was studied by varying electroplating parameters like electrodeposition time, current density and substrate. The prepared Raney Ni-Zn-Fe electrode was electrochemically evaluated using linear sweep voltammetry. Physical and chemical analysis were conducted by scanning electron microscope, energy dispersive spectrometer, and X-ray diffraction. The plating time did not changed the morphology and composition of the electrode surface and showed a little effect on overpotential reduction. As the plating current density increased, Fe content on the surface increased and cauliflower-like structure appeared on the electrode surface. In particular, the overpotential of the electrode, which was prepared at the plating current density of 320 mA/㎠, has showed the lowest value of 268 mV at 50 mA/㎠. There was no distinguishable overpotential difference between the type of substrate for the electrodes prepared at 80 mA/㎠.

Soft-$golf^{TM}$ Shaft Kick Point and Stiffness due to the Difference in Performance Analysis (소프트 골프 샤프트의 킥 포인트와 강성의 차이에 따른 성능 분석)

  • Oh, H.Y.;Yu, M.;Kim, S.H.;Jang, J.H.;Kim, N.G.;Kim, D.W.
    • Journal of Biomedical Engineering Research
    • /
    • v.31 no.3
    • /
    • pp.227-233
    • /
    • 2010
  • This study analyzed performance according to kick point and stiffness of Soft-$golf^{TM}$ shaft. This research team developed soft-$golf^{TM}$ as a new fusion sports with similar motions with golf and it can be learned safely for all age groups in 2002. The head of Soft-$golf^{TM}$ club is made of zinc alloy and has a mesh or a grid structure, and shaft uses carbon graphite to reduce the total weight of the club. To improve carry distance and to assure consistency of a ball during Soft-$golf^{TM}$ swing, this study manufactured shaft with various kick points (low, middle and high) and stiffness (stiff, regular, lady, morelady) and analyzed a swing motion with characteristics of each shaft presented in a dynamic condition such as a ball's speed, a head's torsion angle and a ball's deviation with ProAnalyst program through a high-speed camera taking pictures using a swing machine robot system(Robo-7). From all of the results, this study determined an appropriate shaft of Soft-$golf^{TM}$.

A Study on Fabrication of Monolithic Lightweight Composite Electronics Housing for Space Application (우주용 일체형 경량 복합재료 전자장비 하우징 제작에 관한 연구)

  • Jang, Tae Seong;Seo, Jung Ki;Rhee, Juhun
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.41 no.12
    • /
    • pp.975-986
    • /
    • 2013
  • This paper dealt with the fabrication and performance evaluation of the electronics housing made of lightweight composite materials, aiming at the enhancement of satellite mass savings by replacing conventional aluminum alloy widely used for satellite avionics with lightweight composite material. For this purpose, a fabrication process was designed to overcome low machinability of CFRP and to minimize the post-treatment. The composite housing with grid-stiffened and monolithic frame was made using co-curing method. Its performance was also evaluated regarding endurance, stiffness, thermal conductivity, electrical grounding, EMI protection and radiation shielding. The composite housing can provide the considerable mass savings over the aluminum housing with same dimension.

A Study on Broadband Inductive Coupler using Impregnated Nanocrystalline Ribbon (함침된 나노결정립 리본을 이용한 광대역 유도형 결합기 연구)

  • Kim, Hyun-Sik;Ju, Woo-Jin;Sohn, Kyung-Rak
    • Journal of IKEEE
    • /
    • v.23 no.2
    • /
    • pp.599-605
    • /
    • 2019
  • Ferrite cores are used as a soft magnetic material in the fabrication of couplers for inductive powerline communication (PLC). However, it is difficult to adjust the size freely according to the power-line and power-grid environment. In this paper, we report that a nano-crystalline alloy with higher permeability than ferrite can be used as an inductive coupler for non-contact PLC. Since nano-crystalline are produced in the form of a thin ribbon, the size of the coupler can be freely controlled by the number of ribbons wound on the toroidal core. It was fabricated with induction type coupler and showed to be suitable for non-contact power line communication. Experimental results show that the communication bandwidth is 45 Mbps for 100 m and 8 Mbps for 200 m under the current fluctuation of less than 100 A, and the reception ratio is 100%.

High Efficiency Solar Cell(I)-Fabrication and Characteristics of $N^+PP^+$ Cells (고효율 태양전지(I)-$N^+PP^+$ 전지의 제조 및 특성)

  • 강진영;안병태
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.18 no.3
    • /
    • pp.42-51
    • /
    • 1981
  • Boron was predeposited into p (100) Si wafer at 94$0^{\circ}C$ for 60minutes to make the back surface field. High tempreature diffusion process at 1145$^{\circ}C$ for 3 hours was immediately followed without removing boron glass to obtain high surface concentration Back boron was annealed at 110$0^{\circ}C$ for 40minutes after boron glass was removed. N+ layer was formed by predepositing with POCI3 source at 90$0^{\circ}C$ for 7~15 minutes and annealed at 80$0^{\circ}C$ for 60min1es under dry Of ambient. The triple metal layers were made by evaporating Ti, Pd, Ag in that order onto front and back of diffused wafer to form the front grid and back electrode respectively. Silver was electroplated on front and back to increase the metal thickness form 1~2$\mu$m to 3~4$\mu$m and the metal electrodes are alloyed in N2 /H2 ambient at 55$0^{\circ}C$ and followed by silicon nitride antireflection film deposition process. Under artificial illumination of 100mW/$\textrm{cm}^2$ fabricated N+PP+ cells showed typically the open circuit voltage of 0.59V and short circuit current of 103 mA with fill factor of 0.80 from the whole cell area of 3.36$\textrm{cm}^2$. These numbers can be used to get the actual total area(active area) conversion efficiency of 14.4%(16.2%) which has been improved from the provious N+P cell with 11% total area efficiency by adding P+ back.

  • PDF