• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.41-45
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• 2012

Oxynitride green phosphors for white light emitting diodes (LEDs) were synthesized and their optical properties were evaluated. The N/O ratio ($\delta$) of $SrSi_2O_{2-{\delta}}N_{2+2/3{\delta}}:Eu^{2+}$ closely depended on the synthesizing conditions. The most excellent green emission (545 nm), which was assigned to the $5d{\rightarrow}4f$ transition of $Eu^{2+}$ ions, was achieved at the conditions of $1700^{\circ}C$, 5 mol% $Eu^{2+}$, and $H_2$ atmosphere. The well-developed $Ca-{\alpha}-SiAlON:Yb^{2+}$ particles with homogeneous size were obtained at m = 3 (n = 0.15) for the compound of $Ca_{0.5m-0.005}Yb_{0.005}Si_{12-(m+n)}Al_{m+n}O_nN_{16-n}$, resulting in the strong green emission at around 550 nm.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.

• Food Science and Preservation
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• v.15 no.6
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• pp.791-795
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• 2008

In order to establish the method to prepare and use the sulfur dioxide gas generating agent in low temperature storage of grape fruits, the $SO_2$ generation capacity from various sulfite compounds was investigated, and the method to regulate $SO_2$ gas generation and to detect the gas was developed. The conidial germination and mycelium growth of Botrytis cinerea which causes gray mold disease during grape fruit storage was completely inhibited at the $SO_2$ gas concentration of 400 ppm and 3200 ppm, respectively. Sodium hydrosulfite generated the most amount of $SO_2$ gas among the investigated 5 different sulfite or bisulfite compounds. By adjusting the number of pinholes on packaging film of the compound or by adding pH adjusting agent, e.g. citric acid or phosphates, it was possible to regulate the amount and duration of $SO_2$ gas generation from the compound. Because malachite green was quantitatively discolored by $SO_2$ gas, the solution or impregnated paper with the compound could be practically utilized as a indicator detecting $SO_2$ gas. Finally, when Muscat Bailey A grape was stored at low temperature with $SO_2$ gas generating agent, the disease incidence was reduced after storage.

• Journal of Surface Science and Engineering
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• v.48 no.5
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• pp.211-217
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• 2015

To fabricate white LED having a high color rendering index value, red color phosphor mixed with the green color phosphor together in the blue chip, namely the blue chips with RG phosphors packaging is most favorable for high power white LEDs. In our previous papers, we reported on successful syntheses of $Sr_{2-}$ $Si_5N_8:Eu^{2+}$ and $CaAlSiN_3$ phosphors for red phosphor. In this work, for high power green phosphor, greenemitting ternary nitride $Ba_3Si_6O_{12}N_2:Eu^{2+}$ phosphor was synthesized in a high frequency induction furnace under $N_2$ gas atmosphere at temperatures up to $1400^{\circ}C$ using $EuF_3$ as a raw material for $Eu^{2+}$ dopant. The effects of molar ratio of component and experimental conditions on luminescence property of prepared phosphors have been investigated. The structure and luminescence properties of prepared $Ba_3Si_6O_{12}N_2:Eu^{2+}$ phosphors were investigated by XRD and photoluminescence spectroscopy. The excitation spectra of $Ba_3Si_6O_{12}N_2:Eu^{2+}$ phosphors indicated broad excitation wavelength range of 250 - 500 nm, namely from UV to blue region with distinct enhanced emission spectrum peaking at ${\approx}530nm$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.64-64
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• 2009

As the advanced packaging technology developing, Copper electro-plating processing has be wildly utilized in the semiconductor interconnect technique. Chemical solution monitoring methods, including PH and gravity measurement exist in industry, but economical and practical real-time monitoring has not been achieved yet. Red-green-blue (RGB) color sensor can successfully monitor the condition of $CuSO_4$ solution during electric copper plating process. Comparing the intensity variations of the RGB data and optical spectroscopy data, strong correlation between two in-situ sensors have shown.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.8
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• pp.1250-1254
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• 1990

The cordierite (MgO, SiO2, Al2O3) is of great interest for microelectronic packaging of integrated circuits. Its main advantages are low dielectric constant and low thermal expansion. The cordierite precursor is obtained by sol-gel synthesis using organic and inorganic compounds. The obtained cordierite precursor is an amorphous state at about 900\ulcorner. Green and fired cordierite samples were studied by SEM. Microanalysis X and TEM for microscopic properties. The fired cordierite shows forte diminution of Mg in comparison with its value at volume and the deficit of Mg compensates by sugmentation of Al and Si \ulcornercordierite and \ulcornercordierite are present near the surface (< 100) and small quantities of magnesium aluminate (MgAl2O4)is presented spinnel phase.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.137-137
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• 2010

Copper electroplating is a very popular and important technology for depositing high-quality conductor interconnections, especially in through silicon via (TSV). As this advanced packaging technique developing, a mass of copper and chemical solution are used, so attention to these chemical materials into the utilization and costs can not be ignored. An economical and practical real-time chemical solution monitoring has not been achieved yet. Either Red-green-blue (RGB) or optical emission spectroscopy (OES) color sensor can successfully monitor the color condition of solution during the process. The reaction rate, uniformity and quality can map onto the color changing. Hidden Semi Markov model (HSMM) can establish mapping from the color change to upper indicators, and artificial neural network (ANN) can be integrated to comprehensively determine its targets, whether the solution inside the container can continue to use.