• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.65-86
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• 2000

Rare earth-doped ceria powders with a composition of Ce0.8R0.2O1.9(R=Yb, Y, Gd, Sm, Nd and La) were prepared by heating the oxalate coprecipitate. The green compacts began to shrink at 600$^{\circ}$-700$^{\circ}C$. The relative density after the sintering at 1200$^{\circ}$ and 1400$^{\circ}C$ became higher for the higher green density. The samples were densified above 98% relative density by the sintering ant 1600$^{\circ}C$ for 4 h and the grain sizes (4.7-7.6$\mu\textrm{m}$) showed a tendency to become larger with increasing ionic radius of doped-rare earth element. In the intial stag of sintering at 700$^{\circ}$-800$^{\circ}C$, the dominant mass transport process changed from lattice diffusion to grain boundary diffusion to grain boundary diffusion with heating time. The porosity during the intermediated and final stage of the sintering at 1200$^{\circ}$ and 1400$^{\circ}C$ decreased by the mass transport through lattice diffusion with grain growth.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• Journal of Powder Materials
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• v.23 no.6
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• pp.432-436
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• 2016

We investigate the microstructural and magnetic property changes of $DyH_2$, $Cu+DyH_2$, and $Al+DyH_2$ diffusion-treated NdFeB sintered magnets with the post annealing (PA) temperature. The coercivity of all the diffusion-treated magnets increases with increasing heat treatment temperature except at $910^{\circ}C$, where it decreases slightly. Moreover, at $880^{\circ}C$, the coercivity increases by 3.8 kOe in Cu and 4.7 kOe in Al-mixed $DyH_2$-coated magnets, whereas this increase is relatively low (3.0 kOe) in the magnet coated with only $DyH_2$. Both Cu and Al have an almost similar effect on the coercivity improvement, particularly over the heat treatment temperature range of $790-880^{\circ}C$. The diffusivity and diffusion depth of Dy increases in those magnets that are treated with Cu or Al-mixed $DyH_2$, mainly because of the comparatively easy diffusion path provided by Cu and Al owing to their solubility in the Nd-rich grain boundary phase. The formation of a highly anisotropic $(Nd,\;Dy)_2Fe_{14}B$ phase layer, which acts as the shell in the core-shell-type structure so as to prevent the reverse domain movement, is the cause of enhanced coercivity of diffusion-treated Nd-Fe-B magnets.

• Electrical & Electronic Materials
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• v.10 no.10
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• pp.1034-1040
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• 1997

A solar cell conversion effiency was degraded by grain boundary effect in polycrystalline silicon. Grain boundaries acted as potential barriers as well as recombination centers for the photo-generated carriers. To reduce these effects of the grain boundaries we investigated various influencing factors such as emitter thickness thermal treatment preferential chemical etching of grain boundaries grid design contact metal and top metallization along boundaries. Pretreatment in $N_2$atmosphere and gettering by POCl$_3$and Al were performed to obtain multicrystalline silicon of the reduced defect density. Structural electrical and optical properties of slar cells were characterized before and after each fabrication process. Improved conversion efficiencies of solar cell were obtained by a combination of pretreatment above 90$0^{\circ}C$ emitter layer of 0.43${\mu}{\textrm}{m}$ Al diffusion in to grain boundaries on rear side fine grid finger top Yb metal and buried contact metallization along grain boundaries.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.325-333
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• 2001

The effect of base metal grain size on isothermal solidification behavior of Ni-base superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 insert metal. TLP-bonding of single crystal. coarse-grained and fine-grained CMSX-2 was carried out at 1373∼1548k for various holding time in vacuum. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process for single crystal, coarse-grained and fine-grained base metals. The completion time for isothermal solidification decreased in the order ; single crystal, coarse-grained and fine-grained base metals. The difference of isothermal solidification rates produced when bonding the different base metals could be explained quantitatively by the effect of base metal grain boundaries on the apparent average diffusion coefficient of boron in CMSX-2.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.10a
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• pp.66-69
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• 2000

In order to analyze the densification behaviour of stainless steel powder compacts during hot isostatic pressing (HIP) at elevated temperatures, a power-law creep constitutive model based on the plastic deformation theory for porous materials was applied to the densification. Various densification mechanisms including interparticle boundary diffusion, grain boundary diffusion and lattice diffusion mechanisms were incorporated in the constitutive model, as well. The power-law creep model in conjunction with various diffusion models was applied to the HIP process of 316L stainless steel powder compacts under 50 and 100 MPa at 1125 $!`\acute{\dot{E}}$. The results of the calculations were verified using literature data It could be found that the contribution of the diffusional mechanisms is not significant under the current process conditions.

• Journal of Welding and Joining
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• v.9 no.4
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• pp.28-39
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• 1991

The change of microstructure in the bonded interlayer and mechanical properties of the joints were investigated during Transient Liquid Phase Diffusion Bonding(TLP bonding) of STS304/SM17C and STS304/SM45C couples using Ni base amorphous alloys added boron and prepared alloy as insert metal. Main experimental results obtained in this study are as follows: 1) Isothermal solidification process was completed much faster than theoretically expected time, 14ks at 1473K temperature. Its completion times were 3.6ks at 1423K, 2.5ks at 1473K and 1.6ks at 1523K respectively. 2) As the concentration of boron in the insert metal increased, the more borides were precipitated near bonded interlayer and grain boundary of STS304 side during isothermal solidification process, its products were $M_{23}P(C,B)_6}_3)$ The formation of grain boundary during isothermal solidification process was completed at structural carbon steel after starting the solidfication at STS304 stainless steel. 4) The highest value of hardness was obtained at bonded interface of STS304 side. The desirable tensile properties were obtained from STS304/SM17C, STS304/SM45C using MBF50 and experimentally prepared insert metal with low boron concentration.

• Journal of Powder Materials
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• v.7 no.3
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• pp.137-142
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• 2000

In order to analyze the densification behaviour of stainless steel powder compacts during hot isostatic pressing (HIP) at elevated temperatures, a power-law creep constitutive model based on the plastic deformation theory for porous materials was applied to the densification. Various densification mechanisms including interparticle boundary diffusion, grain boundary diffusion and lattice diffusion mechanisms were incorporated in the constitutive model, as well. The power-law creep model in conjunction with various diffusion models was applied to the HIP process of 316L stainless steel powder compacts under 50 and 100 MPa at $1125^{\circ}C$. The results of the calculations were verified using literature data. It could be found that the contribution of the diffusional mechanisms is not significant under the current process conditions.

• Interaction and multiscale mechanics
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• v.1 no.3
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• pp.369-379
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• 2008

A combined stochastic diffusion and mean-field model is developed for a systematic study of the grain growth in a pure single-phase polycrystalline material. A corresponding Fokker-Planck continuity equation is formulated, and the interplay/competition of stochastic and curvature-driven mechanisms is investigated. Finite difference results show that the stochastic diffusion coefficient has a strong effect on the growth of small grains in the early stage in both two-dimensional columnar and three-dimensional grain systems, and the corresponding growth exponents are ~0.33 and ~0.25, respectively. With the increase in grain size, the deterministic curvature-driven mechanism becomes dominant and the growth exponent is close to 0.5. The transition ranges between these two mechanisms are about 2-26 and 2-15 nm with boundary energy of 0.01-1 J $m^{-2}$ in two- and three-dimensional systems, respectively. The grain size distribution of a three-dimensional system changes dramatically with increasing time, while it changes a little in a two-dimensional system. The grain size distribution from the combined model is consistent with experimental data available.

• Journal of the Korean Ceramic Society
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• v.34 no.1
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• pp.23-30
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• 1997

Semiconductive SrTiO3 ceramic bodies were prepared by conventional ceramic powder processes in-cluding sintering in a reducing atmosphere. Sodium or potassium ions were diffused from the surface of the sintered bodies into the inner region using thermal diffusion process at 800-120$0^{\circ}C$. The effects of such ther-mal treatments on the electrical and chemical characteristics of the grain boundaries were investigated. The presence of sodium or potassium ions at grain boundaries produces non-linear current-voltage behaviors, electrical boundary potential barriers of 0.1-0.2eV, and threshold voltages of 10-70V. The diffused ions form diffusion layers with thicknesses of 20-50nm near the grain boundaries, reducing the concentration of strontium and oxygen.