• Journal of Welding and Joining
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• v.9 no.4
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• pp.28-39
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• 1991

The change of microstructure in the bonded interlayer and mechanical properties of the joints were investigated during Transient Liquid Phase Diffusion Bonding(TLP bonding) of STS304/SM17C and STS304/SM45C couples using Ni base amorphous alloys added boron and prepared alloy as insert metal. Main experimental results obtained in this study are as follows: 1) Isothermal solidification process was completed much faster than theoretically expected time, 14ks at 1473K temperature. Its completion times were 3.6ks at 1423K, 2.5ks at 1473K and 1.6ks at 1523K respectively. 2) As the concentration of boron in the insert metal increased, the more borides were precipitated near bonded interlayer and grain boundary of STS304 side during isothermal solidification process, its products were $M_{23}P(C,B)_6}_3)$ The formation of grain boundary during isothermal solidification process was completed at structural carbon steel after starting the solidfication at STS304 stainless steel. 4) The highest value of hardness was obtained at bonded interface of STS304 side. The desirable tensile properties were obtained from STS304/SM17C, STS304/SM45C using MBF50 and experimentally prepared insert metal with low boron concentration.

• Journal of Powder Materials
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• v.1 no.1
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• pp.79-84
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• 1994

The mechanism of activated sintering of tungsten powder was discussed in terms of diffusion and segregation of activator atoms at W grain boundaries. Shrinkage behaviours of W-0.2wt.% Ni, W-0.2wt.% Cu or pure W powder compacts during sintering at low temperatures of 900~ $1200^{\circ}C$ were investigated. It was found that the Cu additive inhibits sintering process causing lower densification than pure W compact while remarkable shrinkage occurred in the Ni added W powder. Such contrary effect was explained by comparing self diffusion processes along Ni or Cu segregated W boundaries in which Ni segregants enhance but Cu atoms retard the migration of W atoms at W boundaries.

• Korean Journal of Materials Research
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• v.14 no.6
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• pp.379-388
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• 2004

To investigate the effect of D-ferrite on the hot workability and surface defect of STS 304 billets containing 3 wt. % Cu, microstructure observations and high temperature mechanical properties test were carried out for the specimens extracted mainly from raw or oxidized billets. It was found that the total $\delta$-ferrite content has little influence on the hot workability, even though the fracture cracks due to high temperature tension or compression test were initiated and propagated mostly along $\delta$/${\gamma}$ boundary in the specimens. On the other hand, it was supposed that the direct causes of surface defects in the wire rolled from the as-continuously cast billet were the grain boundary embrittlement arose from the deep diffusion of oxygen into the grain boundary, and the oxidation of $\delta$-ferrite connected by a grain boundary to the surface during the billet reheating process as well.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.169-169
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• 2000

최근 반도체 소자의 초고집적화 현상에 따라 기존의 Al-base 합금에 대한 한계에 달하면서 그에 대한 대체 물질로 Cu가 관심을 모으게 되었고 그럼으로써 Cu metallization을 위한 많은 연구가 진행되어 왔다. Cu는 Al-base 합금계보다 비저항이 낮고, 녹는점이 높으며, 또한 electromigration 특성이 뛰어난 것으로 알려져 있다. 공학적인 면에서 이미 이들 계에 대한 adhesion 및 전기적 특성에 대한 많은 연구가 있어왔지만, 이들 특성 변화에 대한 물리적 의미를 제공할 만한 기초 자료들이 부족한 상태이다. 본 연구에서는 부도체인 polyimide 박막과 diffusion barrier인 TiN 박막위에서의 Cu 박막성장에 따르는 interface chemical reaction의 변화를 XPS를 이용하여 관찰함으로서 이들 계에 있어서의 adhesion과의 관계를 조사하였다. 그리고 XPS를 이용한 modified surface accumulation method를 적용시켜 TiN diffusion barrier를 통한 Cu의 grain boundary diffusion 상수들을 측정하였다. Cu/TiN system의 경우에는 interface chemical reaction이 일어나지 않았지만 Cu/polymide system에 있어서는 boundary diffusivity는 특히 40$0^{\circ}C$에서 $650^{\circ}C$ 영역에서, Db=60$\times$10-11exp[-0.29/(kBT)]cm2/sec 이었다.

• Journal of the Korean Ceramic Society
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• v.35 no.4
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• pp.347-354
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• 1998

Densification and grain growth behaviors of ITO ceramics were investigated as a function of TiO2 ad-ditions. TiO2 addition led to inhibition of the grain growth and promotion of the densification of ITO ceram-ics. From the microstructure observation it was found that the crack-like voids which were formed in pure ITO specimens decreased with increase of TiO2 additon. The grain growth exponent(n) was measur-ed to be 4 for pure ITO 3 for TiO2-doped ITO specimens respectively. It was supposed that the grain boun-dary migration of pure ITO ceramics was controlled by the pores which were moved by surface diffusion. On the contrary the grain boundary migration of TiO2-doped ITO specimens was depressed by solute drag effect. The activation energies for grain growth were measured to be 1013 kJ/mol for pure ITO ceramics and 460kJ/mol for TiO2-doped ITO specimens respectively.

• Transactions of Materials Processing
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• v.16 no.6
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• pp.473-478
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• 2007

In this study, a deformation mechanism map of metallic nanocrystalline materials(NCMs) using the phase mixture model is proposed. It is based on recent modeling that appears to provide a conclusive description of the phenomenology and the mechanisms underlying the mechanical properties of NCMs. The proposed models adopted the concept of a 'phase mixture' in which the grain interior and the grain boundaries are treated as separate phases. The volume fraction of this grain boundary 'phase' may be quite appreciable in a NCM. Based on the theoretical model that provides an adequate description of the grain size dependence of plasticity covering all grain size range from coarse down to the nanoscale, the tensile deformation response of NCMs, especially focusing on the deformation mechanisms was investigated. The deformation mechanism map is newly proposed with axes of strain rate, grain size and temperature.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1430-1432
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• 1997

A solar cell conversion effiency was degraded by grain boundary effect in polycrystalline silicon. To reduce these effects of the grain boundaries, we investigated various influencing factors such as preferential chemical etching of grain boundaries, grid design, transparent conductive thin film, and top metallization along grain boundaries. Pretreatment in $N_2$ atmosphere and gettering by $POCl_3$ and Al were performed to obtain polycrystalline silicon of the reduced defect density. Structural, electrical, and optical properties of solar cells were characterized. Improved conversion efficiencies of solar cell were obtained by a combination of Al diffusion into grain boundaries on rear side, fine grid finger, top Yb metal grid on Cr thin film of $200{\AA}$ and buried contact metallization along grain boundaries.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.251-254
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• 2001

In this paper, the effect of grain refinement on room temperature ductility of copper was addressed. Recent experimental results have shown that this material, as well as a number of other single-phase metals that are ductile when coarse-grained, loose their ductility with decreasing grain size in the sub micrometer range. A recently developed model in which such materials are considered as effectively two-phase ones (with the grain boundaries treated as a linearly viscous second phase) was applied to analyze stability of Cu against ductile necking. As a basis, Hart's stability analysis that accounts for strain rate sensitivity effects was used. The results confirm the observed trend for reduction of ductility with decreasing grain size. The model can be applied to predicting the grain size dependence of ductility of other metallic materials as well.

• Journal of the Korean Ceramic Society
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• v.29 no.4
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• pp.65-65
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• 1992

Role of CaO in the sintering of 12Ce-TZP ceramics was studied. The addition of small amounts of CaO increase the densification rate of 12Ce-TZP by altering lattice defect structure and the diffusion coefficient of the rate controlling species, namely cerium and zirconium cations. CaO also inhibits grain growth during sintering and allows the sintering process to proceed to theoretical density by maintaining a high diffusion flux of vacancies from the pores to the grain boundaries. The inhibition of grain growth is accomplished by the segregation of solute at the grain boundaries, causing a decrease in the grain boundary mobility. The segregation of calcium was revealed by AES study.

• Journal of Welding and Joining
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• v.15 no.3
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• pp.128-135
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• 1997

Reaction diffusion and formation of $Ni_3Al$phase with $L1_2$ structure have been studied in temperature range of 1432K to 1573K using the diffusion couple of (Ni-40, 5at%Al)/(Ni-14, 1at%Al) and (Ni-49, 2at%Al)/ (Nickel). The layer growth of Ni$_{3}$Al pyhase in the annealed diffusion couple was measured by optical microscope and electron probe microanalyzer (EPMA). The layer growth of $Ni_3Al$phase in diffusion zone obeyed the parabolic law without any indication of grain boundary effects. The layer growth of $Ni_3Al$phase in temperature range of 1423K to 1573K was mainly controlled by the volume diffusion mechanism. The rate of layer growth of $Ni_3Al$phase was found to be colsely related to the composition of intermetallic compound NiAl phase. The activation energy for layer growth of $Ni_3Al$phase was calculated to be 127kJ/mol.