• Journal of the Korean Ceramic Society
• /
• v.24 no.3
• /
• pp.270-276
• /
• 1987

The microstructure and dielectric properties of a SrTiO3-based GBL (Grain Boundary Layer) capacitor were investigated. The 0.6 mol% Nb2O5 doped SrTiO3 was sintered for 3 hr at 1450$^{\circ}C$ in mixed gas(N2/H2) atmosphere. The Nb2O5 promoted the grain growth of the SrTiO3 ceramics was decreased with the amount of Nb2O5. The oxide mixture(PbO, Bi2O3, B2O3) were painted on the reduced specimen and fired at 1000$^{\circ}C$ to 1100$^{\circ}C$ in air. The penetrated oxide mixture into specimen were located in grain boundaries. A SrTiO3-based GBL capacitor had the apparent permittivity of about 3.0${\times}$104, the dielectric loss of 0.01-0.02, and insulating resistance of 108-109$\Omega$.cm. The capacitor had the stable temperature coefficient of capacitance and exhibited dielectric dispersion over 107 Hz. The capacitance-voltage measurements indicated that the grain boundary was composed of the continuous insulating layers.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.5 no.3
• /
• pp.210-217
• /
• 2004

This paper presents a simulation methodology for the poly-silicon oriented TCAD(technology-CAD) system. A computer simulation environment for the poly-silicon processing has been set up with the proper adoption of the two-stream model for ion-doping, diffusion, and defects inside of grain and on the grain boundary. After the simulator calibration, simulation results for the poly-silicon diffusion has showed a good agreement with the SIMS data.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.65 no.10
• /
• pp.1697-1701
• /
• 2016

The leakage conduction and critical voltage characteristic of ZnO ceramic were investigated as a function of $Sb_2O_3$ concentration. Leakage conduction in the ohmic region increased with increasing $Sb_2O_3$ concentration and was attributed to the potential barrier height. The nonlinear coefficient increased with an increasing amount of $Sb_2O_3$. It was found that increases in the apparent critical voltages were associated with the lowered donor concentration in the grain boundary of between two ZnO grains. And the decrease of donor concentration on doping with $Sb_2O_3$ additive was attributed to the lowered capacitance in the grain boundary layer.

• Journal of the Mineralogical Society of Korea
• /
• v.22 no.4
• /
• pp.371-383
• /
• 2009

Crystallinity and textural relations, which are crucial in terms of the quality concept of high-purity limestone, have not been effectively applicable to the limestone evaluation as crude ore due to the difficulties in precise measurements. To overcome the above, as a new method of ore characterization, a measurement of shape factor and grain boundary frequency utilizing the image analysing system was adopted in this study. Some domestic limestones used for lime manufacturing were investigated by such a quality evaluation method, and its results are discussed and correlated each other samples. As the result, even though calcite contents of crude ore, i.e., limestone grade and its crystal size are similar, quality of manufactured lime is remarkably different depending on the degree of shape factor and grain boundary frequency. In other words, as the more irregular in crystal shape and the higher the grain boundary frequency, the manufactured quick lime became more superior in all terms of lime quality such as rate of calcination, porosity, reactivity, sintering and decrepitation effect. However, because the quick lime become easily overheated in case of relatively higher degree in shape factor and grain boundary effect, a technology minimizing heating time is necessary for the manufacturing of high quality lime. In limestone industry, such a ore characterization method will be much more reasonable than the conventional method by measurement of mean size, because the method may collectively comprise crystal shape and other textural factors which can not be numerically evaluated in the past.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.338-338
• /
• 2011

최근 FPD (Flat Pannel Display) 시장이 커짐에 따라 고효율, 저비용 제작 공정이 화두로 떠오르고 있다. ELA (Excimer Laser Annenling)을 이용한 LTPS (Low Temperature Poly Silicon) 공정은 mobility와 전류 점멸비 등에서 장점을 가지지만, 고비용, 대면적과 short-range에서 uniformity가 어렵다는 단점이 있다. 이를 극복하기 위한 방법으로 dLTA (diode Laser Thermal Annealing) 공정에 대한 연구가 진행되고 있다. 본 연구에서는 Flexible Display을 만들기 위한 방법으로 dLTA 공정을 진행하였다. 이 방법은 PI (Poly imide) 기판 위에 a-Si을 ICP CVD로 증착시킨 후, Diode Laser (980 nm)를 이용한 annealing을 통하여 a-Si이 poly-Si으로 결정화가 되는 것을 확인하였고, 에너지 조사량에 따른 grain boundary와 grain size을 통하여 비교 분석하였다. 실험 결과 ELA 공정을 이용한 것과 버금가는 실험 결과를 얻을 수 있었다.

• Korean Journal of Materials Research
• /
• v.4 no.3
• /
• pp.329-333
• /
• 1994

A large number of grain boundaries were seen to crack in near-eutectic solder joints of leadless ceramic chip carriers (LLCC's) during thermal cycling at temperature ranges from -$35^{\circ}C$ to +$125^{\circ}C$ with lhr time period. One potential explanation for this type of cracking might be the presence of embrittling species on the boundary. Although there do not appear to be any instances reported in the literature of solders being embrittled by small amounts of contaminating species, the possibility of such an occurrence exists. The potential presence of impurities located at crack surfaces was inspected using Scanning Auger Microprobe(SAM) and it was found that intergranular cracking could be accomplished by the oxidation of the grain boundary. A physical model for fatigue crack growth was introduced, in which grain boundary separation took place under oxidation facilitated by sliding.

• Nuclear Engineering and Technology
• /
• v.45 no.1
• /
• pp.73-80
• /
• 2013

The primary water stress corrosion cracking (PWSCC) of Alloy 600 in a PWR has been reported in the control rod drive mechanism (CRDM), pressurizer instrumentation, and the pressurizer heater sleeves. Recently, two cases of boric acid precipitation that indicated leaking of the primary cooling water were reported on the bottom head surface of steam generators (SG) in Korea. The PWSCC resistance of Ni base alloys which have intergranular carbides is higher than those which have intragranular carbides. Conversely, in oxidized acidic solutions like sodium sulfate or sodium tetrathionate solutions, the Ni base alloys with a lot of carbides at the grain boundaries and shows less stress corrosion cracking (SCC) resistance. The role of grain boundary carbides in SCC behavior of Ni base alloys was evaluated and effect of intergranular carbides on the SCC susceptibility were reviewed from the literature.

• Journal of the Korean Ceramic Society
• /
• v.29 no.11
• /
• pp.888-892
• /
• 1992

The chemically induced grain-boundary migration has been studied in MgAl2O4 spinel under ZnO atmosphere. MgAl2O4 compacts been prepared by sintering powder mixture of Al2O3 and MgO at 1$600^{\circ}C$ for 60 h in air. The sintered MgAl2O4 has been heat-treated at 150$0^{\circ}C$ in a ZnO atmosphere. During the heat-treatment grain boundaries have become curved or faceted, and the total area of grain boundaries have increased. In the migrated region, the ZnO content is higher by 6 wt% than that in other regions, indicating that the migration was induced by addition of ZnO. In some shrinking grains, the faceted planes of different grain boundaries for the same grain are parallel to each other. This result provide an experimental support for the coherency strain energy in diffusion layer of the shrinking grain as being the major driving force. Calculated coherency strain energy of MgAl2O4 shows the maximum at {111} planes and the minimum at {100} planes. Although the minimum surface energy is at {111} planes, the faceted moving boundaries are expected to be {100} planes because of lowest driving force for the grain-boundary migration.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.25 no.1
• /
• pp.13-19
• /
• 2015

Among the various possible factors affecting the Minority Carrier Life Time (MCLT) of the mc-Si crystal, dislocations formed during the cooling period after solidification were found to be a major element. It was confirmed that other defects such as grain boundary or twin boundary were not determinative defects affecting the MCLT because most of these defects seemed to be formed during the solidification period. With a measurement of total thickness variation (TTV) and bow of the silicon wafers, it was found that residual stress remaining in the mc-Si crystal might be another major factor affecting the MCLT. Thus, it is expected that better quality of mc-Si can be grown when the cooling process right after solidification is carried out as slow as possible.

• Journal of the Korean Society for Heat Treatment
• /
• v.5 no.1
• /
• pp.13-22
• /
• 1992

The thermal stability of duplex high Mn-steel structure have been investigated using 15%Mn~1.0~2.4%C steels which are composed of ${\gamma}$-and ${\theta}$-phases in the range of temperature from 900 to $1100^{\circ}C$, and time from 50 to 300h. The results are as follows ; 1) The grain growth in single-phase region proceeds by grain boundary migration and the relation between mean radius $\bar{r}$ and annealing time t is described as follows ; $\bar{r}^2-{\bar{r}_0}^2=k_0{\cdot}t$ 2) The grain growth of duplex, (${\gamma}+{\theta}$), strucrure is slower than that single phase because the chemical composition of ${\gamma}$-and ${\theta}$-phases differs esch others. 3) The grain of (${\gamma}+{\theta}$) duplex structure grow slowly in a mode of Ostwald ripening. Because grain boundaries of ${\gamma}$-phase migrate under a restriction of pinning by ${\theta}$-phases. 4) In the duplex structures. the dispersed structures change to the dual-structures, as the volume fraction of the dispersed second-phase increase. Consequently, the growth-law, which is controlled by boundary-diffusion change to that of the volume diffusion-mechanism.