• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.5
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• pp.263-267
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• 2017

The Co-Cr as-cast alloys are widely used in the manufacturing of orthopedic implants made with investment casting techniques because of its high strength, good corrosion resistance and excellent biocompatibility properties. Carbide precipitation at grain boundaries and interdendritic regions is the major strenthening mechanism in the as-cast condition. In this study, effects of GPS (Gas Pressured Sintering) heat-treatment on the microstructure and crystallinity of the as-cast Co-Cr alloy prepared by investment casting were investigated. It was confirmed that the content of metal carbide ($Cr_{23}C_6$) was increased in the grain boundary by using optical microscopy (OM), field-emission scanning electron microscopy (FE-SEM) and energy dispersive spectroscopy (EDS).

• Journal of the Korean Society for Nondestructive Testing
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• v.19 no.6
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• pp.411-419
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• 1999

It has been well recognized that a long term service at elevated temperature of $350^{\circ}C{\sim}550^{\circ}C$ induces embrittlement damage due to carbide precipitation and/or P, Sb and Sn segregation at grain boundaries and thereby deteriorates the grain boundary strength of heat resisting components in the energy-related plants. Therefore, it is very important to assess quantitatively the extent of embrittlement damage of heat resisting components to secure the reliable and efficient service condition and to prevent brittle failure in service. However, because fracture tests are limited in size and number of specimen obtained from the structural components, nondestructive test method is required. In this study, the optimum electrochemical parameters are investigated and discussed to evaluate nondestructive embrittlement damage for aged 2.25Cr-1Mo steels by means of electrochemical polarization test method (ECPTM) in proper corrosive environment. In addition, the electrochemical test results are compared with embrittlement degree evaluated by semi-nondestructive SP test.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.53-53
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• 2011

This paper describes results for surface and bulk characterization of the most promising thin film solar cell material for high performance devices, (Ag,Cu) (In,Ga) Se2 (ACIGS). This material in particular exhibits a range of exotic behaviors. The surface and general materials science of the material also has direct implications for the operation of solar cells based upon it. Some of the techniques and results described will include scanning probe (AFM, STM, KPFM) measurements of epitaxial films of different surface orientations, photoelectron spectroscopy and inverse photoemission, Auger electron spectroscopy, and more. Bulk measurements are included as support for the surface measurements such as cathodoluminescence imaging around grain boundaries and showing surface recombination effects, and transmission electron microscopy to verify the surface growth behaviors to be equilibrium rather than kinetic phenomena. The results show that the polar close packed surface of CIGS is the lowest energy surface by far. This surface is expected to be reconstructed to eliminate the surface charge. However, the AgInSe2 compound has yielded excellent atomic-resolution images of the surface with no evidence of surface reconstruction. Similar imaging of CuInSe2 has proven more difficult and no atomic resolution images have been obtained, although current imaging tunneling spectroscopy images show electronic structure variations on the atomic scale. A discussion of the reasons why this may be the case is given. The surface composition and grain boundary compositions match the bulk chemistry exactly in as-grow films. However, the deposition of the heterojunction forming the device alters this chemistry, leading to a strongly n-type surface. This also directly explains unpinning of the Fermi level and the operation of the resulting devices when heterojunctions are formed with the CIGS. These results are linked to device performance through simulation of the characteristic operating behaviors of the cells using models developed in my laboratory.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.363-368
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• 1999

Y-5a-Cu-O superconductors were prepared by TSMG (Top-Seeded Melt Growth) process with multiseeding technique. By using several seeds at the same time, large samples could be fabricated in a short time with simple heat treatment. However, the samples fabricated by normal multiseeding technique show the rapid decrease of trapped magnetic field value across the grain boundaries because of the residual liquid layer. To remove the residual liquid layer, modified multiseeding was newly suggested. The individual grains were combined as single domain, and did not show deterioration of magnetic property at the boundary. The formation mechanism of a well-combined domain by multiseeding technique was discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.153-153
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• 2011

유리나 폴리머를 기판으로 하는 TFT(Thin film transistor), solar cell에서는 낮은 공정 온도에서($200{\sim}500^{\circ}C$) amorphous semiconductor thin film을 poly-crystal semiconductor thin film으로 결정화 시키는 기술이 매우 중요하게 대두 되고 있다. Ge은 Si에 비해 높은 carrier mobility와 낮은 녹는점을 가지므로, 비 저항이 낮을 뿐만 아니라 더 낮은 온도에서 결정화 할 수 있다. 하지만 일반적으로 쓰이는 Ge의 결정화 방법은 비교적 높은 열처리 온도를 필요로 하거나, 결정화된 원소에 남아있는 metal이 불순물 역할을 한다는 문제점, 그리고 불균일한 결정크기를 만든다는 단점이 있었다. 그 중에서도 현재 가장 많이 쓰이고 있는 MIC, MILC는 metal과 a-Ge이 접촉되는 interface나, grain boundary diffusion에 의해 핵 생성이 일어나고, 결정이 성장하는 메커니즘을 가지고 있으므로 단순 증착과 열처리 만으로는 앞서 말한 단점을 극복하는데 한계를 가지고 있다. 이에 PIII&D 장비를 이용하면, 이온 주입된 원소들이 모재와 반응 할 수 있는 표면적이 커짐으로 핵 생성을 조절 할 수 있을 뿐만 아니라, 이온 주입 시 발생하는 self annealing effect로 결정 크기까지도 조절할 수 있다. 또한 이러한 모든 process가 한 진공 장비 내에서 이루어지므로 장비의 단순화와, 공정간 단계별로 발생하는 불순물과 표면산화를 막을 수 있으므로 절연체 위에 저항이 낮고, hall mobility가 높은 poly-crystalline Ge thin film을 만들 수 있다. 본 연구에서는, 주로 핵 생성과정에서 seed를 만드는 이온주입 조건과, 결정 성장이 일어나는 증착 조건에 따라서 Ge의 결정방향과 크기가 많은 차이를 보이는데, 이는 HR-XRD(High resolution X-ray Diffractometer)와 Raman spectroscopy를 이용하여 측정 하였으며, SEM과 AFM으로 결정의 크기와 표면 거칠기를 측정하였다. 또한 Hall effect measurement를 통해 poly-crystalline thin film 의 저항과 hall mobility를 측정하였다.

• Korean Journal of Materials Research
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• v.25 no.8
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• pp.386-390
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• 2015

Fe-base superalloy powders with $Y_2O_3$ dispersion were prepared by high energy ball milling, followed by spark plasma sintering for consolidation. High-purity elemental powders with different Fe powder sizes of 24 and 50 mm were used for the preparation of $Fe-20Cr-4.5Al-0.5Ti-O.5Y_2O_3$ powder mixtures (wt%). The milling process of the powders was carried out in a horizontal rotary ball mill using a stainless steel vial and balls. The milling times of 1 to 5 h by constant operation (350 rpm, ball-to-powder ratio of 30:1 in weight) or cycle operation (1300 rpm for 4 min and 900 rpm for 1 min, 15:1) were applied. Microstructural observation revealed that the crystalline size of Fe decreased with an increase in milling time by cyclic operation and was about 15 nm after 3 h, forming a FeCr alloy phase. The cyclic operation had an advantage over constant milling in that a smaller-agglomerated structure was obtained. The milled powders were sintered at $1100^{\circ}C$ for 30 min in vacuum. With an increase in milling time, the sintered specimen showed a more homogeneous microstructure. In addition, a homogenous distribution of Y-compound particles in the grain boundary was confirmed by EDX analysis.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.6
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• pp.303-313
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• 2022

The purpose of this study was to test and analyze the effects of the mechanical properties and structural changes of the austenitized and tempered martensite STS 410 stainless steel containing 11.5~13%Cr and 0.10%C on its temper embrittlement. The STS 410 stainless steel test pieces for each 3 hours at 960℃, 1000℃ and then, tempered them for 2 hours at 300℃, 350℃, 400℃, 450℃, 500℃, 550℃, 600℃, 650℃ and 700℃ known as the intervals vulnerable to temper embrittlement to observe the changes of their structures and mechanical properties. In case autenitizing was insufficient due to lower temperature of thermal treatment for solution, unsolved carbides and ferrites remained in the structure after quenching, which meant that the parts could wear out and corrode to embrittle at the room temperature. Elongation and impact energy changes with Tempering conditions showed minimum results in range of 400~500℃. The decrease in elongation and impact energy at 400~500℃ was the hardening effect of the subgrain due to the precipitation of many M₃C or M₇C₃, M₂₃C₆. And STS 410 stainless steel corrosion tested in 10% NaCl solution at 30℃ after tempering treatment. The degree of corrosion sensitization showed increasing tendency with increase of tempering temperature and Cr carbide precipitation were observed in grain boundary.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.122-131
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• 1995

The effects of cooling rate on the microstructures, precipitation of Cu-cluster, .epsilon.-Cu and impact toughness of high strength low alloy(HSLA) steel were studied using hardness tester, impact tester, DSC(differential scanning calorimetry), AES(auger electron spectroscopy) and TEM(transmission electron microscopy). Not only the Cu-precipitates but also the segregation of Cu, As, Sb, P, S, N, Sn along grain boundary were not observed at the specimens heat treated from 800.deg. C to 300.deg. C with the cooling time of 12-125 sec. The Cu-cluster, .epsilon.-Cu are formed by introducing ageing after cooling and the effect of precipitates on hardening increase after cooling was the same in all cooling rate. The peak hardness was obtained at an ageing of 500.deg. C in all cooling conditions. The impact energy become higher as the cooling time increases. This fact can be explained to be due to the tempering effect applied on the cooling stage since the present alloy has a relatively high Ms temperature and the local high concentration of the retained austenite.

• Journal of Welding and Joining
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• v.22 no.5
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• pp.38-45
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• 2004

The present study is to investigate the effect of heat input on the microstructure, tensile properties and toughness of single-pass submerged arc bead-in-groove welds produced on SA508 class 3 steels. The heat input was varied in the range of 1.6, 3.2 and 5.0 kJ/mm. The toughness of weld metals was evaluated by using subsize Charpy V-notch specimens in the temperature range of -19$0^{\circ}C$ to 2$0^{\circ}C$. The weld microstructure and fractography were observed by optical and scanning electron microscopies, respectively. With increasing heat inputs, tensile strength and hardness of weld metals were decreased while elongation was increased. The poor notch toughness at 1.6 kJ/mm was attributed to the formation of ferrite with aligned second phase and banitic microstructure with high yield strength while that at 5.0 kJ/mm was due to the presence of grain boundary and polygonal ferrites. The microstructure of the intermediate energy input welds consisted of a high proportion of acicular ferrite with limited polygonal ferrites, which provide improved notch toughness.

• Journal of the Korean Vacuum Society
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• v.10 no.4
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• pp.403-410
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• 2001

Acceleration in integration density and speed performance of ULSI circuits require miniaturization of CMOS and interconnections as well as higher current density capabilities for transistors. A leading candidate to substitute Al-alloy is Cu, which has lower resistivity and higher melting point. So we can expect much higher electromigration resistance. In this paper, we are going to explain the major features of EM for MOCVD Cu according to variant conditions. We compared the life time and activation energy of MOCVD Cu with those of I-beam Cu and AA in the same conditions. The electromigration experiments were performed with Cu/Al/TiN multilayer. Experimental results shows that the deposition rate and electromigration characteristics of Cu thin film were improved by the Al interlayer.