• Title/Summary/Keyword: Grain

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Study on Grain Refinement of Al-7Si Based Alloys with TiC (Al-7Si 합급의 결정립 미세화에 미치는 TiC 첨가의 영향)

  • Han, Yun-Sung;Choi, Chang-Ock
    • Journal of Korea Foundry Society
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    • v.23 no.2
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    • pp.63-68
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    • 2003
  • Al-Ti-C grain refiner form a relatively new alternative to the existing class of Al-Ti-B type grain refiners for achieving fine equiaxed structures in aluminum alloys during casting and solidification. The present study was carried out to investigate the influence of Al-Ti-C master alloys on the grain structure of Al-7Si alloys. The present study also investigates the relationship between grain refining efficiency and concentrations of Fe and Si in hypo-eutectic Al-Si alloys using Al-3Ti-0.13C master alloys. It is found that several parameters affect significantly the grain refining performance in silumin alloys. The present study reports the influence of various parameters such as alloy content, master alloy addition level, melt holding time and superheat on the grain refining efficiency in Al-7Si alloys.

Measurement of Ferrite Grain Size by Ultrasonic Method in Low Carbon Steel (초음파법에 의한 저탄소강의 페라이트 결정립 크기 측정)

  • Hong, Soon Taik;Kwun, Sook In;Choo, Wung Yong
    • Journal of the Korean Society for Heat Treatment
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    • v.12 no.2
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    • pp.157-165
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    • 1999
  • Grain size of steels is one of the most important parameters which influence yield strength and fracture toughness. Ultrasonic wave propagating in polycrystalline materials is mostly attenuated by scattering at grain boundary. Effect of ultrasonic attenuation on average ferrite grain size of carbon steels with tensile strength $40{\sim}60kgf/mm^2$ consisting of multi phases such as ferrite + pearlite and ferrite + pearlite + bainite was evaluated. The attenuation of these steels rapidly increased with average ferrite grain diameter. Average ferrite grain diameter ($D_{av}$, ${\mu}m$) could be expressed as $1.79+22.97*a^{1/2.03}$, where a is attenuation with unit of nepers/cm. From this study, it was confirmed that nondestructive ultrasonic method could be used in measuring average ferrite grain size indirectly.

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A Boundary Diffusion Creep Model for the Plastic Deformation of Grain Boundary Phase of Nanocrystalline Materials (나노재료 입계상의 소성변형에 대한 입계확산크립 모델)

  • 김형섭;오승탁;이재성
    • Transactions of Materials Processing
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    • v.10 no.5
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    • pp.383-388
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    • 2001
  • In describing the plastic deformation behaviour of ultrafine-grained materials, a phase mixture model in which a polycrystalline material is regarded as a mixture of a crystalline phase and a grain boundary phase has been successful. The deformation mechanism for the grain boundary phase, which is necessary for applying the phase mixture model to polycrystalline materials, is modelled as a diffusional flow of matter along the grain boundary. A constitutive equation for the boundary diffusion creep of the boundary phase was proposed, in which the strain rate is proportional to (stress/grain siz $e^{2}$). The upper limit of the stress of the boundary phase was set to equal to the strength to the amorphous phase. The proposed model can explain the strain rate and grain size dependence of the strength of the grain boundary phase. Successful applications of the model compared with published experimental data are described.

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Efficiency Improvement of Polycrystalline Silicon Solar Cells using a Grain boundary treatment (결정입계 처리에 따른 다결정 실리콘 태양전지의 효율 향상)

  • 김상수;김재문;임동건;김광호;원충연;이준신
    • Electrical & Electronic Materials
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    • v.10 no.10
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    • pp.1034-1040
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    • 1997
  • A solar cell conversion effiency was degraded by grain boundary effect in polycrystalline silicon. Grain boundaries acted as potential barriers as well as recombination centers for the photo-generated carriers. To reduce these effects of the grain boundaries we investigated various influencing factors such as emitter thickness thermal treatment preferential chemical etching of grain boundaries grid design contact metal and top metallization along boundaries. Pretreatment in $N_2$atmosphere and gettering by POCl$_3$and Al were performed to obtain multicrystalline silicon of the reduced defect density. Structural electrical and optical properties of slar cells were characterized before and after each fabrication process. Improved conversion efficiencies of solar cell were obtained by a combination of pretreatment above 90$0^{\circ}C$ emitter layer of 0.43${\mu}{\textrm}{m}$ Al diffusion in to grain boundaries on rear side fine grid finger top Yb metal and buried contact metallization along grain boundaries.

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Effect of the Number of Nodular Grains on Low Cycle Fatigue Life in Spheroidal Graphite Cast Iron (저사이클 피로수명에 영향을 미치는 구상흑연주철의 흑연입자수의 영향)

  • Kim, Min-Gun;Lee, Byeong-Hyeon;Yoo, Byung-Ho
    • Journal of Industrial Technology
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    • v.20 no.B
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    • pp.3-8
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    • 2000
  • Low cycle fatigue life of spheroidal graphite cast iron is determined by the morphological parameters of internal graphite. The aim of this study is to clarify the effect of the number of nodular grain of spheroidal graphite cast iron on low cycle fatigue life. Two specimens that have identical average nodular grain size by changing nodular grain volume fraction and different number of nodular grain count was tested. In this paper, the parameter governing fatigue life through fatigue test, the number of nodular grain seriously affect fatigue life and nodular grain size is no longer governing parameter of it.

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Abnormal Grain Growth Behavior of $BaTiO_3$ Ceramics with Addition of Seed Grains (Seed 입자 첨가에 따른 $BaTiO_3$ 요업체의 비정상 입성장거동)

  • 이태헌;김정주;김남경;조상희
    • Journal of the Korean Ceramic Society
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    • v.32 no.5
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    • pp.587-593
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    • 1995
  • Abnomal grain growth behavior of BaTiO3 ceramics was investigated with addition of seed grains. It was foudn that the nucleation rate of abnormal grain was constant and growth of abnormal grain was linearly increased with sitnering time, regardless of amount of seed grains. These facts were also confirmed by fitting of the volume fraction of abnormal grain vs. sintering time using Avrami type equation (n=4). It was suggested that seed grains did not change the nucleation rate or growth mechanism of abnormal grain but increase the number of abnormal grains at initial stage of sintering and then it led to fine microstructure of BaTiO3 ceramics.

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NONUNIFORMITY OF GRAIN BOUNDARIES IN ZnO VARISTORS (ZnO 바리스터에서 입계의 전기적 불평등성에 관한 연구)

  • ;He Jin-Liang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.11a
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    • pp.98-101
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    • 1997
  • The nonuniformity of electrical characteristics of grain boundaries in ZnO varistors wei\ulcorner systematically analyzed. The high nonuniformity exist in barrier voltages and nonlinearity coefficients among different grain boundaries. The barrier voltages have normal distributions, only a few grain boundaries were electrically active, and the grain boundaries can be simply classified into good, bad, and ohmic ones according to the electrical characteristics of grain boundaries. The average barrier voltage is equal to 3.3 V by direct method, but it is only 2.3 V by indirect method. There is a high difference between the barrier voltages by direct and indirect measurement methods. The A1$_2$O$_3$ dopants affect the electrical characteristics of grain boundaries by changing the electron status In grain boundary and intragrain.

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EBSD studies of the grain size and grain orientation distribution of $SrTiO_3$ (EBSD를 이용한 $SrTiO_3$의 입자 크기 및 입자 배향 분포)

  • Park, Myung-Beom;Shih, Shao-Ju;Cho, Nam-Hee;Cockayne, David J.H.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.46-46
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    • 2006
  • $SrTiO_3$ was annealed at two different annealing times (1 h and 16 h) to investigate the annealing effect on the grain size and orientation distribution. Electron backscattered diffraction (EBSD) was used to analyze the grain size and grain orientation distributions of the $SrTiO_3$. It is possible to understand the annealing effect on the microstructure evolution, by comparing the grain size and orientation distribution of the $SrTiO_3$ as a function of annealing time.

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Effects of Microstructure on the Fretting Wear of Inconel 690 Steam Generator Tube

  • Hong, Jin-Ki;Kim, In-Sup;Park, Chi-Yong;Kim, Jin-Weon
    • Nuclear Engineering and Technology
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    • v.34 no.2
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    • pp.132-141
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    • 2002
  • The effects of microstructure on fretting wear were investigated in Inconel 690 tube. The microstructure observation indicated that the solution annealing temperature and time affected the grain size of the Inconel 690 tubes. The carbide morphology, along grain boundaries, was mainly affected by thermal treatment time and temperature. The wear test results showed that specimens with larger grain size and with coarse carbides along grain boundaries had better wear resistance. Cracks were found in specimens with carbides along the grain boundary, while few cracks were found in carbide free specimens. It seemed that the carbides on grain boundary assisted crack formation and propagation in carbide containing specimens. On the other hand, the micro-hardness of specimen did not have a major role in fretting wear. It could be inferred from the SEM images of worn surfaces that the main wear mechanism of carbide containing specimen was delamination, while that of carbide free specimen was abrasion.

A Development of High-Durability Copper Foil Materials for Clock Spring Cable Using Grain Size Control Techniques (결정립 제어 기술을 이용한 클락스프링 케이블용 고내구 동박 소재 개발)

  • Chae, Eul Yong;Lee, Ho Seung
    • Journal of Auto-vehicle Safety Association
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    • v.13 no.3
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    • pp.20-25
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    • 2021
  • Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).