• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.29-34
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• 2020

본 연구에서는 무전해 니켈 도금액 pH 변화에 따른 electroless nickel immersion gold (ENIG)/Sn-3.0wt.%Ag-0.5wt.%Cu(SAC305) 솔더 접합부 취성 파괴 거동에 대하여 평가하였다. ENIG 표면처리를 위한 무전해 니켈 도금액의 pH는 4.0에서 5.5로 변화 시켰다. 무전해 니켈 도금 후 Ni-P 표면 관찰 결과, 도금액의 pH가 낮아질수록 Ni-P 층 nodule 표면에 핀홀이 증가하였다. 솔더링 후 접합부 계면에서는 (Cu,Ni)6Sn5 금속간화합물이 형성되었으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 계면 금속간화합물의 두께는 증가하였다. 고속전단 시험을 통하여 ENIG/SAC305 솔더 접합부의 취성파괴 거동을 확인하였으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 전단강도는 감소하는 경향을 보였다. 또한, 솔더 접합부의 취성 파괴율은 pH가 5일 때 가장 높은 값을 보였다.

• 전기화학회지
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• 제2권3호
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• pp.138-143
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• 1999

최근 large scale integrated circuits(LSI) 및 printed circuit board(PCB)의 세밀화가 전자기기의 소형화로 인하여 필수 불가결하게 되었다. 전해 도금은 LSI및 PCB의 전도도 및 부식저항을 향상시키기 위해서 전도성 라인의 말단에 적용되고 있다. 그러나 회로 기판의 소형화 및 고직접화로 인하여 적용되지 못하고 있다. 따라서 최근 무전해 도금은 복잡한 장치와 외부에서 전원을 필요치 않는 작동의 간편함 때문에 매우 각광 받고 있는 방법 중의 하나이다. 본 연구는 무전해 니켈/금도금의 도금 기술 개발을 위해 시험하였다. 무전해 니켈 도금은 $85^{\circ}C$의 도금 욕에서 PCB기판 위에 침적 시켰고 그 다음 금층은 동일한 방법으로 $90^{\circ}C$에서 니켈 층위에 침적 시켰다. Bonderbility는 무전해 니켈/금도금의 안정성을 평가하기 위해 gold wire 또는 solder ball 테스트로 실험하였다.

• 구강회복응용과학지
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• 제22권2호
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• pp.125-136
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• 2006

Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.

• Restorative Dentistry and Endodontics
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• 제19권2호
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• pp.473-484
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• 1994

To investigate the effect of resin cement, which had been known to increase the adhesive capacity of the cast gold inlay, on the gingival marginal fit and whether the tin-planting of the beveled area affects the marginal fit, Class II cast gold inlays were made on the 25 sound molars. Control group(ZPC goup) was cemented with the ZPC by conventional method. Experimental groups were cemented with the resin cement(Super-hond & $Panavia_{EX}$) and subdivided further by the existence or nonexistence of the tin-plating of the beveled area(ST & PT groups: with plating, SNT & PNT groups: without plating). So, each group was consisted of 5 teeth and the gingival margin of each specimen was mesiodistally sectioned by 3 times and the marginal and internal gap were evaluated by the Stereo Microscope (${\times}180$) and the Scanning Electron Micrascope(${\times}5,000$) was used for examining the adhesive relationship of the resin cement to the cavity wall and to the cast gold surface. The results were as follows : 1. Marginal gap was less than internal gap in all groups. 2. ZPC and SNT(bevel without tin-plating) groups showed the least gap and gap in PNT(bevel without tin-plating) group, ST(bevel with tin-plating) group, PT(bevel with tin-plating) group showed the greater value in order in evaluation of the both internal gap and marginal gap. 3. With the exception of the relationships between ZPC and SNT groups, ST and PNT groups, relationships between any other groups showed the statistical significance in the internal gap(p<0.05). 4. In the marginal gap, all relationships between groups showed the statistical significance (p<0.05) except the relationships between ZPC and SNT groups, ST and PNT groups, ZPC and PNT groups. 5. ZPC group showed more soluble phenamena than the resin groups(ST, SNT, PT, PNT). 6. Resin cement showed the void spaces in spite of good penetration into the micro-irregularities on both the tooth surface and the cast surface. The void was shown more in PT and PNT groups than in the ST and SNT groups. 7. After the treatment of heat and desiccation for SEM specimen, resin cements were detached more easily from the tooth surface than from the cast surface.

• 한국표면공학회지
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• 제28권1호
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• pp.23-33
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• 1995

AISI 304 stainless steel has high resistance to corrosion due to the presence of a self-healing chromium oxide film on the surface, which also accounts for the difficulty in plating. Surface cleaning of this alloy is of fundamental importance in gold plating since its effectiveness puts an upper limit on the quality of the final coating. The cleaning of AISI 304 stainless steel was investigated with elimination of artificial passive oxide film and degreasing of remaining buffing wax as stearic acid. The familiar cleaning methods i.e. ultrasonic cleaning, electro-cleaning and activation treatment were fabricated in this study. Activation treatment showed best cleaning efficiency for elimination of passive oxide film among these methods, which was also confirmed by AES (Auger electron spectrometer) analysis. However, the best condition of cleaning was obtained by combining these methods. Electrocleaning time, for degreasing the stearic acid layer, was decreased with increasing amount of added KCN.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.625-628
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• 1999

Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.993-994
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• 2011

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 추계총회 및 연구발표회 초록집
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• pp.198.1-198
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• 2003

• 한국산학기술학회논문지
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• 제17권7호
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• pp.273-279
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• 2016

본 논문은 니켈-텅스텐 합금 도금 공정액에 대해 혼합 상태에서 각 공정액에 대한 농도를 정확하게 측정할 수 있는 센서 및 이를 기반으로 정밀한 농도 제어를 수행할 수 있는 제어 시스템 대한 논문이다. 최근 인쇄회로기판 시장은 전자산업의 발달로 커지고 있으며, 이에 따라 금 소비도 급격하게 증가되고 있다. 하지만 금은 비싼 원자재로 금을 대체하거나 줄이기 위한 다양한 복합 도금 공정액 개발이 이루어지고 있다. 이에 비해 복합도금 공정액을 실시간으로 측정할 수 있는 센서 개발은 아직 미진한 상태이다. 더군다나 실시간으로 도금 품질을 극대화 할 수 있도록 복합 도금 공정액 농도를 측정하고 이를 토대로 농도를 제어하기 위한 시스템은 전무한 실정이다. 이에 본 논문에서는 이러한 복합 도금 공정액에 대한 농도를 정확하게 측정할 수 있는 센서 및 농도 제어를 수행하기 위한 시스템을 개발하고자 한다. 이를 위해 분광광도법을 기반으로 복합도금 공정액 농도를 정밀하게 측정할 수 있는 센서를 개발하며 센서 농도에 대한 피드백 제어를 통해 농도를 정확하게 유지할 수 있는 시스템을 개발한다.

• 한국표면공학회지
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• 제29권6호
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• pp.709-713
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• 1996

Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $\mu\textrm{m}$ diamiter) by electroless nickel plating have been investigated. Generally, batch type electroless plating is applied to provide conductivity on the nonconductors. Since the surface areas of particles are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. Thus, we applied the continuous dropping method for the preparation of conductive particles. The uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage is further improved without coagulation of particles by the surface active agent treatment before enter the plating bath.