• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.943-946
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• 2007

In-plane piezoelectric charge constant of Electro-Active paper (EAPap) was investigated based on direct and converse piezoelectric effects. EAPap samples were made with cellulose film with very thin gold electrode coated on both sides of the film. To characterize direct piezoelectricity of EAPap, induced charge was measured when mechanical stress was applied to EAPap. In-plane piezoelectric charge constant was extracted from the relation between induced charge and applied in-plane normal stress. To investigate converse piezoelectricity, induced in-plane strain was measured when electric field was applied to EAPap. Piezoelectric charge constant was also extracted from the relation of induced in-plane strain and applied electric field. Piezoelectric charge constants obtained from direct and converse piezoelectricity are 31 pC/N and 178 x 10-12m/V for 45 degree sample, respectively. Measured piezoelectric charge constants of EAPap provide promising potential as a piezoelectric material.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2001.02a
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• pp.92-94
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• 2001

We investigated quench recovery characteristics of Au/YBCO thin film meander lines. YB$a_{2}$$Cu_{3}$ $O_{7}$films were coated in-situ with a gold layer and patterned into 2 mm wide meander lines by photolithography. The limiters were tested with simulated fault currents at various source voltages. Resistance decreased first slowly and then rapidly to zero. Resistance vs. time curves for different source voltages fell on top of each other when translated horizontally. The slowly varying portion of data fell on straight lines of a slope on a semi-log scale at all source voltages. A heat balance equation reflecting heat loss from meander lines to surroundings explains these results quantitatively.

• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.89-93
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• 2002

We investigated the resistance distribution n 4"diameter SFCLS. $YBa_2CU_3O_7$ films coated in-situ with a gold layer were patterned into 3 mm wide 142 cm long meander lines by Photolithography. The limiters were tested with simulated fault currents. The resistance was uniform all over the film except at the edge. At lower source voltages, CFCLs did not quench simultaneously and the resistance distribution was less uniform. Compared with 2" diameter SFCLS 4" SFCLS had similar values and time dependence of resistivity at similar electric fields The resistance distribution was more uniform in 4" SFCLS. The area at the edge where the distribution was not uniform was around 3 mm wide in SFCLs of both sizes. The experimental results were quantitatively explained with a heat transfer concept.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.51-54
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• 2003

We investigated the quench characteristics of thin film type SFCLs with shunt layers of various thickness. The SFCLs ware based on 2 inch diameter YBa$_2$Cu$_3$O$_{7}$ thin films coated in-situ with a gold shunt layer. The shunt layer thickness was varied by Ar ion milling. The limiters were tested with simulated fault currents at various source voltages. The thinner the shunt layer was, the slower was the rise of SFCL temperatures. This means SFCLs of thinner shunt layers had higher voltage ratings. The voltage rating was approximately inversely proportional to the square root of the shunt layer thickness. This result could be understood through the concept of heat balance.e.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.242-245
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• 2003

We investigated the quench characteristics of thin film type SFCLs with shunt layers of various thickness. The SFCLs ware based on 2 inch diameter YBa$_2$Cu$_3$3O$_{7}$ thin films coated in-situ with a gold shunt layer. The shunt layer thickness was varied by Ar ion milling. The limiters were tested with simulated fault currents at various source voltages. The thinner the shunt layer was, the slower was the rise of SFCL temperatures. This means SFCLs of thinner shunt layers had higher voltage ratings. The voltage rating was approximately inversely proportional to the square root of the shunt layer thickness. This result could be understood through the concept of heat balance.e.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.4
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• pp.337-342
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• 2000

We fabricated resistive superconducting fault current limiters based on YB $a_{2}$/C $u_{3}$/ $O_{7}$ thin films and investigated their quench propagation characteristics. The YB $a_{2}$/C $u_{3}$/ $O_{7}$ films was coated with a gold layer and patterned into 1 mm wide meander lines by photolithography. The quench was concluded to start locally and propagates until completed. The quench propagation characteristics were explained based on the heat transfer within the film as well as between the film and the surrounding liquid nitrogen. The quench completion time depended strongly on potential fault current amplitude and not significantly on fault angle which indicates that the quench propagation speed is affected more by heat dissipation rate than by fault current increase rate. The quench completion time was 1 msec at the fault current of 65 $A_{peak/{\ak}}$.

• Progress in Superconductivity and Cryogenics
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• v.5 no.2
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• pp.41-45
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• 2003

Resistance distribution in thin film type SFCL elements of different shunt layer thickness was investigated. The 300 nm thick film of 2 inch diameter was coated with a gold layer and patterned into 2 mm wide meander lines. The shunt layer thickness was varied by ion milling the shunt layer with Ar ions, and also by having the shunt layer grown in different thickness. The SFCL element was subjected to simulated AC fault current for measurements. It was immersed in liquid nitrogenduring the experiment. The resistance distribution was not affected by the shunt layer thickness at applied voltages that brought the temperature of the elements to similar values. This result could be explained with the concept of heat transfer from the film to the surroundings. The resistance distribution was independent of the shunt layer thickness because thick sapphire substrates of high thermal conductivity dominated the thermal conductance of the elements.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.49 no.8
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• pp.418-423
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• 2000

In this paper, we reported the current limiting properties of superconducting fault current limiters (SFCL). Our SFCL was patterned in a coil-type on a YBCO film deposited using rf sputtering techniques and was coated with a gold shunt layer in order to disperse the heat generated at hot spots in the YBCO film. Current increased up to 13.5 Apeak at 60 Hz for the voltage of 11.5 Vpeak, which is the minimum quench point, and increased up to 17.6 Apeak at 60 Hz for the voltage of 80 Vpeak. The quench completion time was 5 msec at 11.5 Vpeak and 4 msec at 80 Vpeak respectively. We think that this architecture using coil-type SFCL can be useful for the protection of the power delivery systems from fault currents.

• Progress in Superconductivity
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• v.8 no.1
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• pp.81-86
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• 2006

We investigated resistance development in $Au/YBa_2Cu_3O_7(YBCO)$ thin film meander lines during high-power faults. The meander lines were fabricated by patterning 300 nm thick YBCO films coated with 200 nm thick gold layers into meander lines. A gold film grown on the back side of the substrate was also patterned into a meander line. The front meander line was connected to a high-power fault-test circuit and the back line to a DC power supply. Resistance of both lines was measured during the fault. They were immersed in liquid nitrogen during the experiment. Behavior of the resistance development prior to quench completion could be understood better by comparing resistance of the front meander lines with that of the back. Quench completion point could be determined clearly. Resistance and temperature at the quench completion point were not affected by applied field strength. The experimental results were analyzed quantitatively with the concept of heat transfer within the meander lines/substrate and to the surrounding liquid nitrogen. In analysis, the fault period was divided into three regions: flux-flow region, region prior to quench completion, and region after quench completion. Resistance was calculated for each region, reflecting the observation for quench completion. The calculated resistance in three regions was joined seamlessly and agreed well with data.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.48 no.10
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• pp.537-543
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• 1999

We fabricated a resistive superconducting fault current limiter (SFCL) of a meander type based on a YBCO film with the meander cross section of 5 $\times$ $10^{-6}$$cm^2$, and performed current limitation experiments. The film was coated quench current was 9.6 Apeak at 60 Hz, and the fast quench time was 0.63 msec. The resistance of the limiter continuously increased for three cycles dut to the temperature rise in the gold layer. The temperature of the current limiting element reached the room temperature in 11 msec, $150^{\circ}C$ in 54 msec after quench, and was saturated afterwards. For $45^{\circ}$and $90^{\circ}$faults the fast quench times were 0.56 msec and 0.26 msec, respectively. The quench time is believed to be reduced because the fault occurred when the current was either increasing or at the peak value. This limiter effectively limited the fault current to about 1/5 of the potential current with no SFCL right after the fault and to about 1/8.5 in three cycles. We confirmed that the gold layer effectively carried out the role of heat dissipation as the SFCL was quenched.