• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.247-251
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• 2004

Chemical-Mechanical Polishing(CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. And there are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these elements the CMP pad is considered one of the most important because of its change. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. So we make CMP pad with micro structure using micro molding method. This paper introduces the basic concept and fabrication technique of CMP pad with micro-structure and the characteristic of polishing. Experimental results demonstrate the removal rate, uniformity, and time vs. removal rate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.651-652
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• 2005

Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in integrated circuit manufacturing. Especially, polishing pad is considered as one of the most important consumables because of its properties. Generally, conventional polishing pad has irregular pores and asperities. If conditioning process is except from whole polishing process, smoothing of asperities and pore glazing occur on the surface of the pad, so repeatability of polishing performances cannot be expected. In this paper, CMP pad with microstructure was made using micro-molding technology and repeatability of ILD(interlayer dielectric) CMP performances and was evaluated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.563-564
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• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A diamond disk use during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In. this study, we characterized diamond disk with 9 kinds of sample.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.51-54
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• 2006

본 연구는 CMP 공정 중의 Conditioning 최적화에 관한 내용이다. CMP Pad Conditioner의 역할은 CMP 공정 중 Slurry 및 연마 잔유물에 의해 Pad 표면에 눈막힘 현상(Glazing)이 발생하여 Wafer의 연마속도가 급속히 저하되는 현상을 방지하여 공정의 안정성을 향상시키는 데 있다. 본 연구 중 Conditioning은 In-situ 방식으로 진행되었으며, Conditioning 비율을 Polishing Time 대비 50%만 진행하여도 연마속도 저하현상은 나타나지 않음을 확인하였다. 이로써 Pad 마모랑 감소 및 Conditioner 교체 주기연장이 가능해져, CMP 공정의 Cost를 절감할 수 있다.

• Korean Journal of Materials Research
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• v.31 no.8
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• pp.450-457
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• 2021

From measured thermal conductivity and modeling by simulation, this study suggests that U-factors are highly related to materials used between steel and polymer. The objective and prospective point of this study are to relate the relationship between the U-factor and the thermal conductivity of the materials used. For the characterization, EDX, SEM, a thermal conductive meter, and computer simulation utility are used to analyze the elemental, surface structural properties, and U-factor with a simulation of the used material between steel and polymer. This study set out to divide the curtain wall system that makes up the envelope into an aluminum frame section and entrance frame section and interpret their thermal performance with U-factors. Based on the U-factor thermal analysis results, the target curtain wall system is divided into fix and vent types. The glass is 24 mm double glazing (6 mm common glass +12 mm Argon +6 mm Low E). The same U-factor of 1.45 W/m²·K is applied. The interpretation results show that the U-factor and total U-value of the aluminum frame section are 1.449 and 2.343 W/m²·K, respectively. Meanwhile, those of the entrance frame section are 1.449 and 2.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.410.1-410.1
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• 2016

Vanadium dioxide ($VO_2$) is a well-known material that exhibits a metal-semiconductor transition at 340 K, with drastic change of transmittance at NIR region. However, $VO_2$ based thermochromics accompany with low visible transmittance value and unfavorable color (brownish yellow). Herein, we demonstrate the adjustment of visible transmittance of $VO_2$ thin film by nanosphere template assisted patterning process using sol-gel method. 2-Dimenstional honeycomb shape was varied as function of diameter of nanosphere and coating conditions. The morphological geometry of the films was investigated by FE-SEM and AFM. Result shows that inversed shape of nanosphere was formed clearly and pattern width was altered according to the bead size. This structure creates the geometrical blank area from the position of nanosphere which improves the optical transmittance at the visible region. Moreover, such patterned $VO_2$ thin film not only maintains the optical switching efficiency, but also generate the gorgeous scattering effect which presumably support the glazing application.

• The Journal of Korean Academy of Prosthodontics
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• v.19 no.1
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• pp.47-54
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• 1981

Dental porcelains are widely used for restorative material because of its excellent esthetic property. But according to contact with natural teeth or metal in oral cavity, the porcelain may be worn and may effect on masticatory physiology and prosthetic function. The purpose of this experiment was to study on wear of porcelain surface which treated in different method. Using the abrasion device which was designed and constructed by myself, the different porcelain surface were abraded by gold alloy, nickel-chrome alloy and natural teeth in order to compare roughness. Results were as follows. 1. The group of porcelain abraded by gold alloy showed less surface roughness change (t=2.92, p<0.05), and the group of porcelain abraded by natural teeth had high surface roughness. change (t=6.84, p<0.05). 2. According to the method of surface treatment, the surface roughness were very significant (F=9.12, p<0.05). 3. After abrading, the porcelain surface roughness change was very significant (F=54.49, p<0.05). 4. There was no significant between surface treatment method and the kind of abrading materials. (F=1.01, p>0..05). 5. The group of natural glazing had the most smooth surface ($2.1{\pm}1.13{\mu}m$).

• Korean Institute of Interior Design Journal
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• v.14 no.3 s.50
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• pp.139-146
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• 2005

This paper focuses on the response of architectural form to the technological characteristics in the institute facilities. For this, we study the meaning of technology in the aspect of physical, formal and social concepts and their architectural expression and sort by grouping through analyzing 27 cases of foreign current Institute facilities. Conclusions can be summarized as followings: 1) Vocabulary of technology in physical concept is presented by the environmental control through the experimental surface such as louver and glazing and the independent exposed equipment. 2) Vocabulary of technology in physical concept is presented using the machine like aesthetics by exposing the structural members and designing the exterior form using dynamical images. 3) The expression of social meaning in technology is presented by standardization, parts assembling through mass production system, the unit material for expression of today's industrial society. The expressions of technological language in the institute facilities are used not only one vocabulary but comprehensive ones.

• Tribology and Lubricants
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• v.38 no.1
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• pp.1-7
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• 2022

Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

• The Journal of Korean Academy of Prosthodontics
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• v.43 no.3
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• pp.293-305
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• 2005

Statement of problems. Conventional feldspathic porcelain is used extensively as a restorative material and it is subjected to grinding and polishing during fabrication and delivery procedures. There is still considerable controversy concerning the best methods to achieve the strongest porcelain restorations after such adjustments. Purpose. The objective of this study was to investigate the effects of (1) overglazing, (2) selfglazing, and (3) fine polishing on the flexural strength and fracture toughness of feldspathic dental porcelain. Material and method. Ninety porcelain disks were prepared for flexural strength test and sixty porcelain disks were fabricated for fracture toughness test. Specimens were divided into three groups for each test as follows: 1) overglazed 2) self-glazed 3) polished. The flexural strength of feldspathic porcelains was determined by ring-on-ring biaxial flexural strength test. The fracture toughness values of three experimental groups were obtained by indentation fracture toughness test. Results. The flexural strength of overglazed group was significantly higher than that of selfglazed and polished group (P<0.05), while the difference between self-glazed and polished group was not significant (P>0.05). The fracture toughness values of overglazed and polished group were significantly higher than that of self-glazed group (P<0.05), while the difference between overglazed and polished group was not significant (P>0.05). Conclusions. This results supported the use of polishing as an alternative to glazing metal ceramic restorations, as it was not detrimental in flexural strength and fracture toughness. But, under the conditions of this study, overglazing was the ideal surface finishing method of feldspathic dental porcelain.