• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.274-277
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• 2006

Nanostructured carbon (nm-C), including carbon nanotubes and nanofibers (CNTs/CNFs) is promising for low-cost field emission display (FED) application. By modification of CNTs/CNFs, uniform CNTs/CNFs can be obtained and used for field emission cathode (FEC) on glass substrate. By screen-printing (SP) and electrophoretic deposition (EPD) process, large area FEC can be obtained. The FED properties are studied and compared. Both SP and EPD FEC show excellent field emission properties, such as low emission field and uniform emission, after optimization the fabrication process. While EPD FEC exhibits better luminescence image. By vacuum sealing, the low cost nm-C-FED prototypes based on EPD cathode have been demonstrated.

• 마이크로전자및패키징학회지
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• 제14권2호
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• pp.1-8
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• 2007

LCD(Liquid Crystal Display) TV(Television) 용 백라이트의 광원으로서 면광원을 개발하였으며 이를 이용한 백라이트를 개발하였다. 백라이트의 광원으로 사용된 면광원은 유리성형을 통하여 채널을 형성하였으며 채널의 모양이 타원형 구조, 높이 4.4 mm, 채널의 실링 부위를 1.4 mm로 최적화된 면광원을 이용하여 제작한 백라이트의 성능을 향상시킬 수 있었다. 본 논문에서는 특히 면광원의 채널구조에 따른 백라이트의 휘도균일도의 변화에 대하여 연구하였으며 특히 광학 시뮬레이션을 통하여 면광원의 채널형상을 최적화 하였다. 채널의 구조가 최적화된 면광원을 이용하여 제작된 32", LCD TV의 휘도는 $576\;cd/m^2$ 이었다.

• 대한소아치과학회지
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• 제24권3호
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• pp.518-536
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• 1997

The purpose of the present study was to analyze the pulpal tissue reactions to several capping materials. 8 adult Mongrel dogs and 4 different capping materials (G I : Calcium hydroxide, G II : Bonding resin, G III : Glass ionomer liner, G IV : Bioactive ceramic) we-reused in the study. The results can be summarized as follows : 1. The formation of hard tissue barrier was observed to begin after 2 weeks in all groups with various forms or positions. 2. According to the result of statistical analysis, G I and G IV showed significantly higher degree of inflammation than G II, G III in 1-week samples(p<.05). And in 2-week samples, G I showed higher degree of inflammation than G II, G IV with statistical significance(p<.05). Howere, these inflammatory reactions have gradually dimiished with time resulting in negligible difference between groups. 3. No bacterial penetration was observed in any group. 4. Hard tissue formation was evident in all groups after 2 weeks regardless of material type in this experiment. Conclusion can be drawn from the above-mentioned results that the perfect marginal sealing after pulp capping procedure is thought to be the most important factor in determining the propgnosis of direct pulp capping.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.110-110
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• 2000

Cantilever-shaped lateral field emitters were fabricated and their electrical characteristics were tested. As shown in Fig.1, poly-silicon cantilevers were fabricated by the surface micromachining and they were used to the vacuum magnetic field sensors. The tunneling devices were vacuum sealed with the tubeless packaging method, as shown in Fig.2 and Fig.3. The soda-lime glasses were used for better encapsulation, so the sputtered silicon and the glass layers on the soda-lime glasses were bonded together at 1x10$^{-6}$ Torr. The getter was activated after the vacuum sealing fur the stable emissions. The devices were tested outside of the vacuum chamber. Through vacuum packaging, the tunneling sensors can be utilized. Fig.4 shows that the sensor operates with the switching of the magnetic field. When the magnetic field was applied to the device, the anode currents were varied by the Lorentz force. The difference of anode currents can be varied with the strength of the applied magnetic field.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.30-32
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• 2005

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.

• 한국농공학회논문집
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• 제52권2호
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• pp.67-73
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• 2010

Unlike Urban building, horticultural facilities has a lot of heat loss through plastic or glass covering material which could be much influential to growing plant and consuming energy for heating greenhouse. In many cases, heat loss from a break of cover, a gap of joint sealing, the entrance to greenhouse and windows for ventilation are the main factors considered in calculating the heating load for horticultural facilities. however the normal observation through human eye and digital camera could not recognize where the heat loss occurred. but the infrared thermal image camera with detecting thermal difference could be very effective for noticing heat loss by analyzing infrared thermal image. In this study, greenhouse structure, covering material, internal and external provisions for Horticultural facilities were surveyed in different sites and Infrared thermal camera shooting and image analysis were performed for auditing heat loss from cultivation facilities The results from this study were that unexpected heat loss had been noticed in 7 representative cases of greenhouse such as side wall covered with single or double plastic, and the joint of horizontal thermal curtain, roof without horizontal thermal curtain, entrance to greenhouse, windows for ventilation. the most important factors for keeping heat energy were whether the horizontal thermal curtain with multifold thermal material was installed or not. The internal or external covering using multifold thermal curtain proved to be the most effective ways to keep heat energy from losing through heat transmission, heat radiation. from inside to outside the horticultural facilities.

• 대한소아치과학회지
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• 제31권1호
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• pp.59-65
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• 2004

치근천공은 근관치료시 종종 발생되는 사고로서 치근과 치주조직과의 개통을 의미하며, 치과의사에 의하여 우발적 또는 의도적으로 발생된다. 성공적인 치근천공의 치료로서 즉시 천공부위를 충전하여 감염을 방지하는 것이 중요한데 이러한 목표를 위하여 치근천공의 발생 시간, 크기 및 위치에 대한 고려가 필요하다. 치근천공의 진단을 위하여 직접 육안으로 출혈을 관찰하거나 방사선검사 또는 천공위치를 파악하는 보조적 방법 등이 유용하며, 치료로서 비수술적 또는 수술적 방법이 사용될 수 있다. 본 증례는 전북대학교 소아치과에 내원한 환자에서 영구전치의 치근 치경부에서 치근 천공이 일어난 경우로서 보존적인 접근을 통해 양호한 결과를 얻었기에 보고하는 바이다.

• 전자공학회논문지D
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• 제35D권6호
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• pp.72-78
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• 1998

Ti:LiNbO$_3$ 광도파로위에 CPW 전극 구조를한 광변조기 내부칩을 제작한 후 일련공정에 따라 패키징 작업을 하였고 소자의 전기적특성과 광학적특성을 측정하였다. 광변조기 패키징을 위하여 페룰, 보조용 LN블럭 및 글래스, 진동 및 흡수용패드, 알루미나피더의 부분품을 사용하였으며 피그테일링, Au 와이어본딩, 에폭싱, SMA커넥팅, 실링 작업을 수행하였다. 전기적 특성에서 S/sub 21/은 -3 dB 점에서 9.8GHz의 값을, S/sub 11/은 14.4 GHz 대에서 -8.9 dB 값을 나타내었다. 광학적 특성은 제작된 광도파로가 1550nm 파장대에서 단일모드를 만족하였고, 패키지후 소자의 삽입손실은 실온에서 4.3 dB 이였으며, 소자를 온도감압챔버에 넣은후 5∼45℃까지 온도변화를 주었을 때 4.3∼6.4 dB의 삽입손실을 보였다. E-O bandwidth 응답은 3dB점에서 7.8GHz를 나타내어 10Gbps급 광통신시스템에 응용할수 있음을 확인하였다.

• 한국정밀공학회지
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• 제18권11호
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• pp.138-147
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• 2001

Alignment systems are frequently used under various semiconductor manufacturing environment. Particularly in PDP(Plasma Display Panel) manufacturing process, the alignment system is applied to the combining and sealing processes of the upper and lower glass panels of PDP, where these processes are performed in the vacuum chamber of high vacuum and high temperature. In this paper, the XYΘ-alignment stage is developed to align PDP panels. Because of high vacuum and high temperature environment, the alignment chamber has been designed to isolate the inner part of the alignment chamber from the outer environment of high vacuum and high temperature, in which every part of the alignment stage is inserted. As it is difficult to attach feedback sensors to the alignment stage in the alignment chamber, the alignment stage is implemented with the open loop algorithm, where the parallel link structure has been designed using step-motors and ball-screws for structural simplicity. The kinematic analysis is performed to drive the parallel link structure, based on the experiments of actuation-compensation of the alignment stage. For the error compensation, the hyperpatch model has been used to model the errors. From the experiments, the positional accuracy of the alignment stage can be improved significantly.

• 한국주조공학회지
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• 제25권6호
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.