• 설비공학논문집
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• 제8권4호
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• pp.497-509
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• 1996

Evacuated powder insulations have long been known to have better thermal performance than existing commercially available insulators, such as fiber glass and CFC-blown foam. To make a composite powder panel, a series of individually evacuated panels was encapsulated in a rigid closed cell foam matrix. The panels were encapsulated in a thin glass sheet barrier to preserve the vacuum. The thermal conductivity of the individual panel was found to be $0.0062W/m^{\circ}K$ by experiment and the polyurethane foam above had a thermal conductivity of $0.024W/m^{\circ}K$. In this study, numerical analysis using finite element method was carried out to investigate insulation performance of rigid foam/evacuated powder composite panel with respect to panel geometries such as panel pitch, panel aspect ratio and panel area ratio. Numerical analysis has indicated that more optimal vacuum panel geometries, much lower overall thermal conductivities can be achieved.

• 한국철도학회논문집
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• 제13권5호
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• pp.476-480
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• 2010

철도차량의 바닥재에 널리 사용되는 주름 강판은 국부공진 효과에 의하여 특정 주파수 대역에서의 차음성능이 심각하게 저하된다. 그 대책으로, 본 연구에서는 우레탄 폼재를 주름내부에 충진시키거나 유리면층을 바닥재에 적층시킨 후, 차음성능의 향상효과를 실험적으로 평가한다. 주름강판 및 바닥 적층재를 대상으로 ASTM E2249-02에 근거하여 인텐시티 투과손실을 측정하고 평가한다. 본 연구의 목적은 폼 충진이나 유리면 적층이 중량 증가 측면에서 열차 차체의 차음성능을 어느 정도 향상시키는가를 규명하는 데에 있다.

• 한국세라믹학회지
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• 제44권1호
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• pp.65-69
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• 2007

For self-developed alkali-alkaline earth-silicate and commercial glass melts for plasma display panel substrate, the corrosion behavior of fused casting refractory consisting of $Al_2O_3-ZrO_2-SiO_2$ was examined at the temperature corresponding to $10^2\;dPa{\cdot}s$ of melt viscosity by static finger methode. The corroded refractory specimens showed a typical concave shape due to interfacial convection of melts at their flux line. However, the corrosion thickness by commercial glass melts was $6\sim10$ times comparing to that by the self?developed melts. From the view point of the glass composition and the role of alkaline earth in glass network, it was discussed the effect of alkali/alkaline earth diffusion and temperature on the refractory corrosion.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• 한국재료학회지
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• 제8권12호
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• pp.1121-1126
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• 1998

평판디스플레이용 진공패널의 제작시 진공으로 유지된 패널을 구성하는 유리판이 받는 응력과 변위를 계산하였다. 유리판의 두께, 패널의 크기 및 실링폭의 크기를 변수로 하여 실제로 진공패널을 제작한 후 패널의 파괴양상과 변위를 측정하였다. 유리판의 파괴양상과 변형측정을 통하여 유리판에 걸리는 최대응력은 테두리부분에 걸리는 것을 확인하였다. 제작된 진공패널이 갖는 응력분포 및 변위의 분포는 패널을 진공실링할 때 사용한 실런트의 폭에 크게 의존하였다. 패널의 실링폭이 커질수록 모서리가 완전 고정된 조건으로 계산한 결과와 유사하였다. 두께가 3mm인 유리판을 사용해서 $80$\times$120textrm{mm}^2$ 크기의 패널을 제작할 때 실링폭이 20mm인 경우 측정된 변위는 $57\mu\textrm{m}$였으며, 이 값은 모서리가 완전히 고정된 조건으로 계산한 갈인 $54\mu\textrm{m}$와 비슷하였다.

• 자원리싸이클링
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• 제24권1호
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• pp.58-65
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• 2015

국내 디스플레이 산업의 핵심기술과 글로벌 점유율은 세계 최고 수준이지만 폐 디스플레이의 재활용 관련한 전반적 기술은 매우 미흡하고 폐 디스플레이의 유리소재는 전량 매립하고 있는 실정이다. 본 논문에서는 폐 초박막 액정표시장치(Thin Film Transistor Liquid Crystal Display) 유리를 고강도 콘크리트 파일 및 발포체의 원료로 재활용 하는 연구, 초박막 액정표시장치 제조 공정에서 발생하는 불량품인 파유리를 장섬유 및 단섬유 등으로 재활용 하는 연구 동향에 대하여 조사하였다. 폐유리를 재활용한 원료 성분은 고강도 콘크리트 파일과 발포체 원료로 재료 재활용이 가능한 것으로 입증되었으며 특히 콘크리트 파일의 경우 기존 제품보다 향상된 특성을 나타내었다. 이외에도 파유리를 장섬유나 단섬유로 재활용 하는 기술은 이미 상용화 단계에 있으므로 향후 폐 디스플레이 유리 소재의 상용화 재활용 시스템을 구축할 수 있는 기술을 확립하는 방향으로 연구를 진행할 필요가 있다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권1호
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• pp.31-38
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• 2002

We measured a 3-dimensional images of the light emitted from plasma display panel(PDP) by using newly proposed scanned point detecting system. In the panel without phosphor, as we scan from the rear glass to the front glass, the detected light intensity increases and the light intensity detected in the inside edge of the ITO electrodes shows the stronger intensity than others. The light intensity detected between the barrier ribs shows the largest value of brightness. Also, as the sustain voltage increases, the detected light intensity increases. In the panel with phosphor, the intensity of light detected at barrier rib shows the stronger light intensity than rear plate. Therefore, the phosphor of barrier rib is very important. From these results the 3-dimensional measurement is necessary to understand exactly the discharge phenomenon in the PDP cell.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.706-709
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• 2007

Different from the LCD that have two glass substrates on the top and the bottom, EPD have an advantage that is using the bottom glass substrate and the top e-ink sheet. So, it is impossible to apply R or C type TSP that need bottom and top glass plane. We successfully implemented the TSP (Touch Screen Panel) based on the light over the EPD (Electro Phoretic Display).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.99-102
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• 1999

A mixture which was made from organic gel, glass powder and ceramic powder was masklessly etched for fabrication of barrier rib of PDP(Plasma Display Panel) by focused Ar$^{+}$ laser( λ =514 nm) and Nd:YAG(λ =532, 266 nm) laser irradiation at the atmosphere. The depth of the etched grooves increases with increasing a laser fluence and decreasing a scan speed. Using second harmonic of Nd:YAG laser, the threshold laser fluence was 6.5 mJ/$\textrm{cm}^2$ for the sample of PDP barrier rib softened at 12$0^{\circ}C$. The thickness of 130 ${\mu}{\textrm}{m}$ of the sample on the glass was clearly removed without any damage on the glass substrate by fluence of 19.5 J/$\textrm{cm}^2$....

• 한국생산제조학회지
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• 제25권6호
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• pp.440-444
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• 2016

Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.