• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.8 no.4
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• pp.497-509
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• 1996

Evacuated powder insulations have long been known to have better thermal performance than existing commercially available insulators, such as fiber glass and CFC-blown foam. To make a composite powder panel, a series of individually evacuated panels was encapsulated in a rigid closed cell foam matrix. The panels were encapsulated in a thin glass sheet barrier to preserve the vacuum. The thermal conductivity of the individual panel was found to be $0.0062W/m^{\circ}K$ by experiment and the polyurethane foam above had a thermal conductivity of $0.024W/m^{\circ}K$. In this study, numerical analysis using finite element method was carried out to investigate insulation performance of rigid foam/evacuated powder composite panel with respect to panel geometries such as panel pitch, panel aspect ratio and panel area ratio. Numerical analysis has indicated that more optimal vacuum panel geometries, much lower overall thermal conductivities can be achieved.

• Journal of the Korean Society for Railway
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• v.13 no.5
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• pp.476-480
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• 2010

In the corrugated steel panels used for railway vehicles, sound insulation performance is significantly deteriorated by local resonance effect. In this study, as a countermeasure, polyurethane foam is filled in the corrugated steel panel and glass wool layer is inserted in the layered floor panel, and then improvement effect of the sound insulation performance is experimentally estimated. Based on ASTM E2249-02, intensity transmission loss is measured and estimated on the corrugated panel and floor structure. The aim of the study is to identify how the foam filling and inserting glass wool layer improve the sound insulation performance of the train body structure in aspect of the weight increment.

• Journal of the Korean Ceramic Society
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• v.44 no.1 s.296
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• pp.65-69
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• 2007

For self-developed alkali-alkaline earth-silicate and commercial glass melts for plasma display panel substrate, the corrosion behavior of fused casting refractory consisting of $Al_2O_3-ZrO_2-SiO_2$ was examined at the temperature corresponding to $10^2\;dPa{\cdot}s$ of melt viscosity by static finger methode. The corroded refractory specimens showed a typical concave shape due to interfacial convection of melts at their flux line. However, the corrosion thickness by commercial glass melts was $6\sim10$ times comparing to that by the self?developed melts. From the view point of the glass composition and the role of alkaline earth in glass network, it was discussed the effect of alkali/alkaline earth diffusion and temperature on the refractory corrosion.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Korean Journal of Materials Research
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• v.8 no.12
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• pp.1121-1126
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• 1998

For vacuum seated panel, stresses and displacements in the glass plate were calculated. The geometric variables for our experiment were the thickness of glass plate, the size of panel and the width of sealing line. The fracture behaviors and displacements of its under the vacuum were measured. From the measurement of strains and fracture, it was considered that the maximum stress acted at the middle of the sides of the panel. The stresses and displacement distribution of manufactured panels were greatly dependent on the width of the sealing line in the panel. The measured values are more similar to the values which were calculated from the condition of built-in edge as the width of the sealing line is larger. The measured displacement of the panel, made of 3mm thick glass plate, with size of $80\Times120\textrm{mm}^2$ and 20mm sealing line was $57\mu\textrm{m}$. This value is similar to calculated value, $54\mu\textrm{m}$, from built- in edge condition in the finite element method.

• Resources Recycling
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• v.24 no.1
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• pp.58-65
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• 2015

Although Korea is a top market sharing and world leading producer and developer of flat panel display devices, relevant recycling technology is not up to her prestigious status. Besides, most of the waste glass arising from flat panel displays is currently land-filled. The present paper mainly reviews on development of recycling systems for waste TFT-LCD glass from end-of-life LCD TVs and monitors and TFT-LCD process waste of crushed glass particles with target end uses of raw material for high strength concrete pile and glass fibers, respectively. Waste LCD glass was recycled to fabricate ingredients for high strength concrete piles with enhanced physical properties and spherical foam products. The waste LCD glass recycling technology is already developed to fabricate long and short fibers at commercial level. In view of these, future R & D on waste LCD glass materials is to be directed toward implementation of commercial materials recycling system therefrom.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.1
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• pp.31-38
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• 2002

We measured a 3-dimensional images of the light emitted from plasma display panel(PDP) by using newly proposed scanned point detecting system. In the panel without phosphor, as we scan from the rear glass to the front glass, the detected light intensity increases and the light intensity detected in the inside edge of the ITO electrodes shows the stronger intensity than others. The light intensity detected between the barrier ribs shows the largest value of brightness. Also, as the sustain voltage increases, the detected light intensity increases. In the panel with phosphor, the intensity of light detected at barrier rib shows the stronger light intensity than rear plate. Therefore, the phosphor of barrier rib is very important. From these results the 3-dimensional measurement is necessary to understand exactly the discharge phenomenon in the PDP cell.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.706-709
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• 2007

Different from the LCD that have two glass substrates on the top and the bottom, EPD have an advantage that is using the bottom glass substrate and the top e-ink sheet. So, it is impossible to apply R or C type TSP that need bottom and top glass plane. We successfully implemented the TSP (Touch Screen Panel) based on the light over the EPD (Electro Phoretic Display).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.99-102
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• 1999

A mixture which was made from organic gel, glass powder and ceramic powder was masklessly etched for fabrication of barrier rib of PDP(Plasma Display Panel) by focused Ar$^{+}$ laser( λ =514 nm) and Nd:YAG(λ =532, 266 nm) laser irradiation at the atmosphere. The depth of the etched grooves increases with increasing a laser fluence and decreasing a scan speed. Using second harmonic of Nd:YAG laser, the threshold laser fluence was 6.5 mJ/$\textrm{cm}^2$ for the sample of PDP barrier rib softened at 12$0^{\circ}C$. The thickness of 130 ${\mu}{\textrm}{m}$ of the sample on the glass was clearly removed without any damage on the glass substrate by fluence of 19.5 J/$\textrm{cm}^2$....

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.440-444
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• 2016

Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.