• Title/Summary/Keyword: Glass machining

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An Experimental Study on the Improvement of Microscopic Machinability of Glass using the Discharging Peak Control Techniques in the Electrochemical Discharge Machining Technologies

  • Chang, In-Bae;Kim, Nam-Hyeock;Kim, Byeong-Hee;Kim, Heon-Young
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.315-316
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    • 2002
  • Electrochemical discharge machining is a very recent technique for non-conducting materials such as ceramics and glasses. ECDM is conducted in the NaOH solution and the cathode electrode is separated from the solution by $H_2$ gas bubble. Then the discharge is appeared and the non-conductive material is removed by spark and some chemical reactions. In the ECDM technology, the $H_2$ bubble control is the most important factor to stabilize the discharging condition. In this paper, we proposed the discharge peak monitoring/ discharging duty feedback algorithms for the discharge stabilization and the feasibility of this algorithm is verified by various pattern machining in the constant preload conditions for the cathode electrode.

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An Experimental Study on the Improvement of Microscopic Machinability of Glass using the Discharging Peak Control Techniques in the Electrochemical Discharge Machining Technologies

  • Chang, In-Bae;Kim, Nam-Hyeock;Kim, Byeong-Hee;Kim, Heon-Young
    • KSTLE International Journal
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    • v.3 no.2
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    • pp.95-100
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    • 2002
  • Electrochemical discharge machining is a very recent technique for non-conducting materials such as ceramics and glasses. ECDM is conducted in the NaOH solution and the cathode electrode is separated from the solution by H$_2$ gas bubble. Then the discharge is appeared and the non-conductive material is removed by spark and some chemical reactions. In the ECDM technology, the H$_2$ bubble control is the most important factor to stabilize the discharging condition. In this paper we proposed the discharge peak monitoring/discharging duty feedback algorithms fur the discharge stabilization and the feasibility of this algorithm is verified by various pattern machining in the constant preload conditions for the cathode electrode.

A Study on Preventing Cracks at the Small Hole Exit in Ultrasonic Machining Using a Wax Coating (초음파 미세구멍 관통가공에서 왁스 코팅을 이용한 출구크랙 방지에 관한 연구)

  • Li, Hang;Ko, Tae Jo;Baek, Dae Kyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.3
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    • pp.105-111
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    • 2015
  • Ultrasonic machining (USM) does not involve heating or any electrochemical effects, and subsequently causes low surface damage, has small residual stress, and does not rely on the conductivity of the workpiece. These characteristics are suitable for the machining of brittle materials, such as glass or ceramics. However, USM for brittle materials generates cracks on the workpiece while machining, especially at the hole exit with a small diameter. In this study, wax coating was used to deposit wax on the back side of the workpiece to decrease the occurrence of cracks at the exit holes in USM, and it was finally removed with a cleaning process. The experimental results show that this technique is beneficial for restricting the occurrence of cracks in glass or ceramics.

Microdrilling of Glass Substrates by Electrochemical Discharge Machining (전기화학적 방전법에 의한 유리기판의 미세가공)

  • 홍석우;최영규;정귀상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.11a
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    • pp.393-396
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    • 1997
  • Electro Discharge Machining (EDM) is a so-call non-conventional machining technique. This paper presents the experimental results of an EDM technique for the fabircation of microholes on #7440 pyrex glans. With various applied voltages and at various concentration of KOH solution, the glass substrate have been microdrilled using the copper electrodes of which diameters are 250$\mu\textrm{m}$ to 450$\mu\textrm{m}$, respectively. The machined throughholes have been observed the top diameter, the bottom diameter, hollow width and hole diameter of the hole, and machining time hale been measured. The experimental results show that the machining time decreases as the concentration of KOH solution increases or the applied voltage increase. Also, The top diameter increases as the concentration of KOH solution decreases or the allied voltage increases. The bottom and hollow width decreases as the of KOH solution increases or the applied voltage decreases.

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Study the effect of machining process and Nano Sio2 on GFRP mechanical performances

  • Afzali, Mohammad;Rostamiyan, Yasser
    • Structural Engineering and Mechanics
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    • v.76 no.2
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    • pp.175-191
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    • 2020
  • In this study, the effect of Nano silica (SiO2) on the buckling strength of the glass fiber reinforced laminates containing the machining process causes holes were investigated. The tests have been applied on two status milled and non-milled. To promote the mechanical behavior of the fiber-reinforced glass epoxy-based composites, Nano sio2 was added to the matrix to improve and gradation. Nano sio2 is chosen because of flexibility and high mechanical features; the effect of Nanoparticles on surface serenity has been studied. Thus the effect of Nanoparticles on crack growth and machining process and delamination caused by machining has been studied. We can also imply that many machining factors are essential: feed rate, thrust force, and spindle speed. Also, feed rate and spindle speed were studied in constant values, that the thrust forces were studied as the main factor caused residual stress. Moreover, entrance forces were measured by local calibrated load cells on machining devices. The results showed that the buckling load of milled laminates had been increased by about 50% with adding 2 wt% of silica in comparison with the neat damaged laminates while adding more contents caused adverse effects. Also, with a comparison of two milling tools, the cylindrical radius-end tool had less destructive effects on specimens.

Precise Drilling characteristics of glass fiber epoxy composite material (유리섬유 에폭시 복합재료의 정밀드릴가공 특성)

  • 김홍배
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.4
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    • pp.117-122
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    • 1998
  • Glass fiber epoxy composite material is widely used in the structures of aircrafts, robots and other machines because of their high specific strength, high specific stiffness and high damping. In order for the composite materials to be used in the aircraft structures or machine elements, accurate surfaces for bearing mounting or joint must be provided, which require precise machining. In this paper, the machinability of the glass fiber epoxy composite material was experimentally investigated. The results can be summarized as follows : 1. The entrance of hole is very good manufacturing existing, but exit come to occur sever surface exfoliation. 2. The cutting force in drilling of the glass fiber epoxy composite material is decreased as the drilling speed increased. 3. If the glass fiber epoxy composite material is drilling by the standard twist drill, then the hole recommand cutting condition is spindle speed 400∼600rpm, feed 40∼50mm/min.

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An Experimental Study of Ultra-precision Turning of High Transmittance Optical Glass(SF57HHT) (고투과율 광학유리(SF57HHT) 초정밀절삭의 실험적 연구)

  • Kim, Min-Jae;Lee, June-Key;Hwang, Yeon;Kim, Hye-Jeong;Kim, Jeong-Ho
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.2
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    • pp.191-195
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    • 2012
  • Heavy flint optical glass(SF57HHT) is new material that has extremely high transmittance. Due to brittleness and high hardness, optical glass is one of the most difficult to materials for ultra-precision turning. According to the hypothesis of ductile machining, all materials, regardless of their hardness and brittleness, will undergo transition from brittle to ductile machining region below critical undefromed chip thickness. In this study, cutting test was carried out to evaluate cutting performance of heavy flint glass using ultra-precision machine with single crystal diamond bite. The machined workpiece surface topography, tool wear and surface roughness were examined using AFM and SEM. The experimental results indicate that the machining mode become the brittle mode to ductile mode, when the maximum undeformed chip thinkness is large than critical value. Tool wear mainly occurs on the flank face and its wear mechanism is dominated by abrasion. This study demonstrates the feasibility of SF57HHT by diamond turning.

Ablation of Cr Thin Film on Glass Using Ultrashort Pulse Laser (극초단펄스 레이저에 의한 크롬박막 미세가공)

  • 김재구;신보성;장원석;최지연;장정원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.620-623
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    • 2003
  • The material processing by using ultrashort pulse laser, in recently, is actively applying into the micro machining and nano-machining technology since ultrashort pulse has so faster than the time which the electrons energy absorbing photon energy is transmitted to surrounding lattice-phonon that it has many advantages in point of machining. The micro machining of metallic thin film on the plain glass is widely used in the fields such as mask repairing for semiconductor, fabrication of photonic crystal, MEMS devices and data storage devices. Therefore, it is important to secure the machining technology of the sub-micron size. In this research, we set up the machining system by using ultrashort pulse laser and conduct on the Cr 200nm thin film ablation experiments of spot and line with the variables such as energy, pulse number, speed, and so on. And we observed the characteristics of surrounding heat-affected zone and by-products appeared in critical energy density and higher energy density through SEM, and also examined the machining features between in He gas atmosphere which make pulse change minimized by nonlinear effect and in the air. Finally, the pit size of 0.8${\mu}{\textrm}{m}$ diameter and the line width of 1${\mu}{\textrm}{m}$ could be obtained.

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A study on micro grooving characteristics of planar lightwave circuit and glass using ultrasonic vibration cutting (초음파 진동절삭을 이용한 평면 광도파로와 유리의 미세 홈 가공특성에 관한 연구)

  • 이준석;김병국;정융호;이득우
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.04a
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    • pp.167-172
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    • 2002
  • Recent years, optical components'are widely used in optical communication industry for high speed and mass storage data processing. Micro grooving of planar lightwave circuit and glass, those are widely used in optical component, are realized by polycrystalline diamond tool with ultrasonic vibration. To know the characteristics of brittle materials cutting, ultrasonic vibration cutting tool and machining system are built for the experiment. Grooving on planar lightwave circuit and glass experiments are performed and their shape are measured by photograph with microscope. It reveals that better groove shape with low chipping of planar lightwave circuit and glass are obtained by micro grooving machining with ultrasonic vibration. These experiments are considered as a possibility to the micro grooving of optical communication components.

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Reserarch for Possibility of ELID Grinding of Hard Disk Glass (HDD용 Glass Disk의 ELID 연삭 성능 평가)

  • 김경년;김영태;박철우;이용철;대삼정;이상조
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.2
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    • pp.161-168
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    • 2000
  • In this paper, machining characteristics of glass for HDD media are researched. Nowadays HDD media are used globally as a data storage device. In generally, it is machined by the lapping. But the lapping process time is long and the productivity is low. In this reason, 1 examined the possibility of ELID grinding of glass fur HDD media. If the machining process of HDD media can be changed to ELID grinding, a product cost will be largely saved. The machines used in this experiment were a special rotary type grinder and a normal rotary grinder. The one has an air bearing spindle, the other has not. Experimental results show the possibility of highly efficient grinding and mirror surface can be achieved by the ELID grinding.

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