• Title/Summary/Keyword: Gimbal Hub

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Design of Gimbal Hub for Smart UAV Tilt Rotor (스마트무인기 틸트로터용 짐발허브 설계)

  • Lee, Joo-Young;Kim, Jai-Moo;Lee, Myeong-Kyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.5
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    • pp.625-634
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    • 2007
  • KARI SUAV program was initiated to develop a Smart Unmanned Aerial Vehicle with innovative smart technologies. SUAV is a tilt rotor aircraft of which rotor system is 3-bladed, gimbaled hub type. Several existing concepts of gimbaled hub were analyzed and compared to investigate the applicability to SUAV rotor system design. From the result of these investigations, it was concluded that a new design concept of low cost and high reliability characteristics was necessary for the rotor hub development of SUAV. The design requirements of new gimbal hub concept and the design results were presented. Also, the analysis results to verify the satisfaction of design requirements of SUAV rotor system were presented.

Development of the Scaled Vehicle of Smart UAV (스마트무인기 축소형 비행체 개발)

  • Chang, Sung-Ho;Choi, Seong-Wook;Koo, Sam-Ok
    • Aerospace Engineering and Technology
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    • v.6 no.2
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    • pp.236-244
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    • 2007
  • The 40% scaled vehicle of Smart UAV has been developed for the investigation of basic flight characteristics and the verification of flight control algorithm. The similar gimbal hub and drive train with the full scale UAV were implemented and a forced air cooling reciprocating engine was installed. The various kind of tests were conducted for the major components of the vehicle. The important performance and mechanical endurance of the fabricated vehicle were identified by ground and hovering test.

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Baseplate Design to Improve Swaging Performance of Actuator in a HDD (HDD 액추에이터의 스웨이징성능향상을 위한 베이스플레이트 최적설계)

  • Lee, Haeng-Soo;Hong, Eo-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.8
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    • pp.760-766
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    • 2009
  • In the manufacturing process of HDD, ball swaging method is commonly used to joint the Head Gimbal Assembly(HGA) with the arm of the actuator. The hub on the HGA is placed into the hole of the actuator arm, and the hub and arm is bonded by the pressure of steel ball. The pressure for plastic deformation on the baseplate causes the undesirable deformation on HGA, such as tilting, flying height change of head. After obtaining the key parameters that have large sensitivity on the swaging process, the optimal shape of baseplate is proposed to increase the static performance during swaging process. Contribution of the proposed design for the swaging performance is verified by contact simulation with elasto-plastic deformation.

Pitch Angle Rigging, Tracking and Balancing of Smart UAV Rotor System (스마트무인기 로터 피치각 리깅, 트랙킹 및 밸런싱)

  • Lee, Myeong Kyu;Kim, Yusin;Choi, Seong Wook
    • Journal of Aerospace System Engineering
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    • v.3 no.3
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    • pp.17-23
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    • 2009
  • KARI SUAV (Smart Unmanned Aerial Vehicle) program is currently on the phase of ground and flight test. SUAV is a tilt rotor aircraft having the capability of vertical take-off/landing and high speed forward flight. The SUAV rotor system is 3-bladed, gimbaled hub type, which is not common for conventional helicopter configuration. In this paper, detailed procedure and method of rotor pitch rigging, tracking and balancing were described based on the experience of SUAV ground test.

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A Study on Pressure Distribution for Uniform Polishing of Sapphire Substrate

  • Park, Chul jin;Jeong, Haedo;Lee, Sangjik;Kim, Doyeon;Kim, Hyoungjae
    • Tribology and Lubricants
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    • v.32 no.2
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    • pp.61-66
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    • 2016
  • Total thickness variation (TTV), BOW, and surface roughness are essential characteristics for high quality sapphire substrates. Many researchers have attempted to increase removal rate by controlling the key process parameters like pressure and velocity owing to the high cost of consumables in sapphire chemical mechanical polishing (CMP). In case of the pressure approach, increased pressure owing to higher deviation of pressure over the wafer leads to significant degradation of the TTV. In this study, the authors focused on reducing TTV under the high-pressure conditions. When the production equipment polishes multiple wafers attached on a carrier, higher loads seem to be concentrated around the leading edge of the head; this occurs because of frictional force generated by the combination of table rotation and the height of the gimbal of the polishing head. We believe the skewed pressure distribution during polishing to be the main reason of within-wafer non-uniformity (WIWNU). The insertion of a hub ring between the polishing head and substrate carrier helped reduce the pressure deviation. Adjusting the location of the hub ring enables tuning of the pressure distribution. The results indicated that the position of the hub ring strongly affected the removal profile, which confirmed that the position of the hub ring changes the pressure distribution. Furthermore, we analyzed the deformation of the head via finite element method (FEM) to verify the pressure non-uniformity over the contact area Based on experiment and FEM results, we determined the optimal position of hub ring for achieving uniform polishing of the substrate.