• Bulletin of the Korean Chemical Society
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• v.30 no.4
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• pp.857-862
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• 2009

We model lattice-mismatched group III-V semiconductor $In_{x}Ga_{1-x}$ alloys with the three-parameter anharmonic Kirkwood-Keating potential, which includes realistic distortion effect by introducing anharmonicity. Although the potential parameters were determined based on optical properties of the binary parent alloys InAs and GaAs, simulated dielectric functions, reflectance, and Raman spectra of alloys agree excellently with experimental data for any arbitrary atomic composition. For a wide range of atomic composition, InAs- and GaAs-bond retain their respective properties of binary parent crystals despite lattice and charge mismatch. It implies that use of the anharmonic Kirkwood-Keating potential may provide an optimal model system to investigate diverse and unique optical properties of quantum dot heterostructures by circumventing potential parameter searches for particular local structures.

• Journal of Power Electronics
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• v.9 no.1
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• pp.36-42
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• 2009

This paper presents a review of an improved high power-high frequency III-V wide bandgap (WBG) semiconductor device, Gallium Nitride (GaN). The device offers better efficiency and thermal management with higher switching frequency. By having higher blocking voltage, GaN can be used for high voltage applications. In addition, the weight and size of passive components on the printed circuit board can be reduced substantially when operating at high frequency. With proper management of thermal and gate drive design, the GaN power converter is expected to generate higher power density with lower stress compared to its counterparts, Silicon (Si) devices. The main contribution of this work is to provide additional information to young researchers in exploring new approaches based on the device's capability and characteristics in applications using the GaN power converter design.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.109-109
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• 2003

III- V ferromagnetic semiconductor has attracted great attention as a potential application for spintronics due to a successful demonstration of spin injection from ferromagnetic GaNnAs into semiconductor. GaMnN may be one of the possible candidates for room temperature operation. Samples were grown on sapphire (0001) substrate at $650^{\circ}C$ via molecular beam epitaxy with a single Precursor of (Et$_2$Ga(N$_3$)NH$_2$$CH_3$) and solid source of Mn at different Mn source temperature. The background pressure is low 10$^{-10}$ Torr and the samples growth pressure was 1.4 $\times$ 10$^{-6}$ Torr.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.154-155
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• 2012

In this work, we report the comprehensive study of performance enhancement of InGaAs n-MOSFET by plasma $PH_3$ p assivation. The calibrated plasma $PH_3$ passivation of the InGaA ssurface before CVD high-k dielectric deposition significantly improves interface quality, resulting in suppressed frequency dispersion in C-V, increase in drive-current with high electron mobility, and excellent thermal stability.

• Applied Science and Convergence Technology
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• v.26 no.4
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• pp.79-85
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• 2017

The crack-free AlGaN template has been successfully grown by using selective area growth with triangular GaN facet. The triangular GaN stripe structure was obtained by vertical growth rate enhanced mode with low growth temperature of $950^{\circ}C$ and high growth pressure of 500 torr. The lateral growth rate enhanced mode of AlGaN for crack-free and flat surface was also investigated. Low pressure of 30 torr and high V/III ratio of 4400 were favorable for lateral growth of AlGaN. It was confirmed that the $4{\mu}m$ -thick $Al_{0.2}Ga_{0.8}N$ was crack-free over entire 2-inch wafer. The dislocation density of $Al_{0.2}Ga_{0.8}N$ was as low as ${\sim}7.6{\times}10^8/cm^2$ measured by cathodoluminescence. Based on the high quality AlGaN with low dislocation density, the ultraviolet laser diode epitaxy with cladding, waveguide and GaN/AlGaN multiple quantum well (MQW) was grown by metalorganic chemical vapor deposition. The stimulated emission at 349 nm with full width at half maximum of 1.8 nm from the MQW was observed through optical pumping experiment with 193 nm KrF laser. We also have fabricated the deep ridge type ultraviolet laser diode (UV-LD) with $5{\mu}m-wide$ and $700{\mu}m-long$ cavity for electrical properties. The turn on voltage was below 5 V and the resistance was ${\sim}55{\Omega}$ at applied voltage of 10 V. The amplified spontaneous emission spectrum of UV-LD was also observed from pulsed current injection.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.183-184
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• 2013

Two main MBE growth techniques have been used: plasma-assisted MBE (PA-MBE), which utilizes a rf plasma to supply active nitrogen, and ammonia MBE, in which nitrogen is supplied by pyrolysis of NH3 on the sample surface during growth. PA-MBE is typically performed under metal-rich growth conditions, which results in the formation of gallium droplets on the sample surface and a narrow range of conditions for optimal growth. In contrast, high-quality GaN films can be grown by ammonia MBE under an excess nitrogen flux, which in principle should result in improved device uniformity due to the elimination of droplets and wider range of stable growth conditions. A drawback of ammonia MBE, on the other hand, is a serious memory effect of NH3 condensed on the cryo-panels and the vicinity of heaters, which ruins the control of critical growth stages, i.e. the native oxide desorption and the surface reconstruction, and the accurate control of V/III ratio, especially in the initial stage of seed layer growth. In this paper, we demonstrate that the reliable and reproducible growth of GaN on Si (110) substrates is successfully achieved by combining two MBE growth technologies using rf plasma and ammonia and setting a proper growth protocol. Samples were grown in a MBE system equipped with both a nitrogen rf plasma source (SVT) and an ammonia source. The ammonia gas purity was ＞99.9999% and further purified by using a getter filter. The custom-made injector designed to focus the ammonia flux onto the substrate was used for the gas delivery, while aluminum and gallium were provided via conventional effusion cells. The growth sequence to minimize the residual ammonia and subsequent memory effects is the following: (1) Native oxides are desorbed at $750^{\circ}C$ (Fig. (a) for [$1^-10$] and [001] azimuth) (2) 40 nm thick AlN is first grown using nitrogen rf plasma source at $900^{\circ}C$ nder the optimized condition to maintain the layer by layer growth of AlN buffer layer and slightly Al-rich condition. (Fig. (b)) (3) After switching to ammonia source, GaN growth is initiated with different V/III ratio and temperature conditions. A streaky RHEED pattern with an appearance of a weak ($2{\times}2$) reconstruction characteristic of Ga-polarity is observed all along the growth of subsequent GaN layer under optimized conditions. (Fig. (c)) The structural properties as well as dislocation densities as a function of growth conditions have been investigated using symmetrical and asymmetrical x-ray rocking curves. The electrical characteristics as a function of buffer and GaN layer growth conditions as well as the growth sequence will be also discussed. Figure: (a) RHEED pattern after oxide desorption (b) after 40 nm thick AlN growth using nitrogen rf plasma source and (c) after 600 nm thick GaN growth using ammonia source for (upper) [110] and (lower) [001] azimuth.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.6
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• pp.282-288
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• 2017

In this paper, GaAs/AlGaAs multi-layer structure was grown by liquid phase epitaxy with graphite sliding boat, which can be used as a device structure of a photocathode image sensor. The multi-layer structure was grown on an n-type GaAs substrate in the sequence as follows: GaAs buffer layer, Zn-doped p-type AlGaAs layer as etching stop layer, Zn-doped p-type GaAs layer, and Zn-doped p-type AlGaAs layer. The Characteristics of GaAs/AlGaAs structures were analyzed by using scanning electron microscope (SEM), secondary ion mass spectrometer (SIMS) and hall measurement. The SEM images shows that the p-AlGaAs/p-GaAs/p-AlGaAs multi-layer structure was grown with a mirror-like surface on a whole ($1.25mm{\times}25mm$) substrate. The Al composition in the AlGaAs layer was approximately 80 %. Also, it was confirmed that the free carrier concentration in the p-GaAs layer can be adjusted to the range of $8{\times}10^{18}/cm^2$ by hall measurement. In the result, it is expected that the p-AlGaAs/p-GaAs/p-AlGaAs multi-layer structure grown by the LPE can be used as a device structure of a photoelectric cathode image sensor.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.115-115
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• 2000

Wide band gap을 갖는 III-V족 반도체인 GaN는 파란색에서 자외선영역에 이르는 발광소자용으로, 그리고 최근에는 전자소자로도 가장 유망한 반도체 중의 하나이다. 하지만 격자상수가 일치하는 적당한 기판이 존재하지 않아 성장된 GaN 박막 내에는 많은 결함들이 존재하게 된다. 일반적으로 가장 널리 쓰이는 기판은 사파이어 기판이 주로 이용되고 있는데 사파이어는 GaN와 격자상수 불일치가 16%에 이르므로 고품질의 GaN 박막을 성장시키기 위해서는 격자상수 불일치를 어느 정도 완화시키면서 초기성장과정의 컨트롤이 매우 중요하다. 이러한 방법들로는 GaN박막 성장 전에 사파이어 기판 질화처리를 하거나 buffer 층을 도입하는 것인데, 이에 관한 많은 연구들이 보고되고 있다. 하지만 각각 두 공정에 관한 연구는 많이 되어 있지만 두 공정사이를 연결해 주는 공정처리법에 관한 연구는 보고되고 있지 않다. 따라서 본 연구에서는 사파이어기판 질화처리를 한 후 buffer 층을 성장시키기 전까지 chamer 내부의 분위기 가스가 GaN 박막성장 거동에 어떤 영향을 주는지에 관해 연구하였다. 질화처리 후 chamber 내부의 분위기 가스가 GaN 박막 성장 거동에 미치는 영향을 연구하기 위하여 두 개의 시편 A,B를 준비하였다. 시편 A는 먼저 사파이어 기판을 유기용매를 이용하여 cleaning 한 후 장비에 장입되었다. 수소분위기하에서 10nsrks 104$0^{\circ}C$에서 가열한 후 30초간 암모니아 유속을 900sccm으로 유지하며 사파이어 기판 질화처리를 수행하였다. GaN buffer 층을 성장하기 위하여 104$0^{\circ}C$에서 56$0^{\circ}C$로 온도를 내리는 과정중 질화처리를 위하여 흘려주었던 암모니아 유속을 차단한 채 수소분위기에서만 온도를 내렸다. 56$0^{\circ}C$에서 GaN buffer 층을 300 성장시킨 후 102$0^{\circ}C$의 고온에서 2$\mu\textrm{m}$ 두께로 GaN 박막을 성장하였다. 시편 B는 질화처리 후 단계부터 GaN 박막성장 단계에 이르기까지 AFM을 이용하여 두 시편의 성장거동을 비교 분석하였다. 두 시편의 표면을 관찰한 결과 시편 A는 2차원적 성장을 하며 매우 매끄러운 표면을 갖는데 반해, 시편 B는 3차원적 성장을 하며 매우 거친 표면을 보였다. 또한 두 시편 A, B를 XRD, PL, Hal 측정으로 분석한 결과 시편 A가 시편 B보다 우수한 구조적, 광학적, 전기적 특성을 보였다.

• Journal of the Korean Vacuum Society
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• v.3 no.1
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• pp.94-102
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• 1994

x- 0.51인 GaxIn1-x-P 에피층을 저압 MOCVD 성장법으로 TEGa(triethylgallium) TmIn(trimethylindium)등의 MO(metalorganic) 원료와 PH3(phosphine)를 사용하여 GaAs(100) 기판위에 성장하였다. 성장조건에 의한 표면 morphology 결정결함 성분비 PL spectra 운반자 농도와 이동도 및 DLTS spectra와 같은 성장층의 특성을 관찰하였다, $650^{\circ}C$의 성장온도와 V/III비, 즉 TEGa와 TMIn 두 원료의 유량에 대한 PH3 의유량변화에 아무런 영향을 받지 않음을 알 수 있었다. Ga0.51In0.49P에피층과 기판의 격자상수 차에 의한 격자 부정합 $\Delta$a /a0은 약 (3.7~8.9)x10-4 이었으며 실온과 5Kd서 에피층의 PL 피크 에너지는 각각 1.85eV와 1.9eV였다. 성장층의 운반자 농도와 이동도는 V/III 비에 따라 달라지 는데 그비가 120에서 220으로 증가함에 따라 농도는 1.8x1016cm-3에서 8.2x1016cm-3로 증가하였고 이동도 는 1010cm/V.sec에서 366cm/V.sec로 감소하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1096-1099
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• 2006

$II-III_2-(S,Se)_4$ structured of phosphor have been used at various field because those have high luminescent efficiency and broad emission band. Among these phosphors, europium doped $BaGa_2S_4$ was prepared by solid-state method and we try to look into an application possibility due to an emissive property of UV region. Also, general sulfide phosphors were synthesized by using injurious $H_2S\;CS_2$ gas. However, this study prepared $BaGa_2S_4:Eu^{2+}$ phosphor is addition to excess sulfur under 5% $H_2/95%\;N_2$ reduction atmosphere. So, this process could large scale synthesis because of non-harmfulness and simple process. The photo-luminescence efficiency of the prepared $BaGa_2S_4:Eu^{2+}$ phosphor increased 20% than commercial $SrGa_2S_4:Eu^{2+}$ phosphor. The prepared $BaGa_2S_4:Eu^{2+}$ could apply to green phosphor for white LED of three wavelengths.