• 제목/요약/키워드: Frit Glass

검색결과 206건 처리시간 0.057초

Glass Frit 및 TiO2 첨가에 따른 LTCC용 마이크로파 유전체의 유전 특성 (Microwave Dielectric Properties of Low Temperature Co-fired Ceramics with Glass Frit and TiO2 Additives)

  • 윤중락;이석원;이헌용
    • 한국전기전자재료학회논문지
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    • 제17권9호
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    • pp.942-946
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    • 2004
  • The crystalline and dielectric properties on Al$_2$O$_3$ filled glass frit (CaO-Al$_2$O$_3$-SiO$_2$-MgO-B$_2$O$_3$) with admixtures of TiO$_2$ have been investigated. The dielectric constant value of 7.5 ∼ 7.8, qualify factor value of 700 were obtained for glass frit : Al$_2$O$_3$(50 : 50 wt%) ceramics. Addition of TiO$_2$ less than 5 wt% slightly increased the dielectric constant from 7.8 to 8.8 due to higher dielectric constant of TiO$_2$. With increasing the amount of TiO$_2$ up to 5 wt%, the temperature coefficient of dielectric properties was improved. When the TiO$_2$ 5 wt% were added, dielectric properties were dielectric constant 8.8, quality factor 840 and the temperature coefficient of dielectric 45 ppm/$^{\circ}C$ at a sintering temperature 920$^{\circ}C$.

PDP용 Ag전극 페이스트의 Bi계 프릿 제조 및 특성 (Preparation and Characterization of Bi based frit for Ag Electrode in PDP Application)

  • 김형수;최정철;이병옥;최승철
    • 마이크로전자및패키징학회지
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    • 제10권4호
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    • pp.47-52
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    • 2003
  • PDP전극용 Ag전극 페이스트의 프릿으로 기존의 Pb-based 프릿을 대신 할 수 있는 Bi-based 조성의 새로운 유리조성의 가능성을 검토하였다. PDP디스플레이 응용을 위해 프릿의 저융점화 및 열팽창계수 제어를 행하였고, 이를 전극 페이스트 제조에 적용하여 스크린 프린팅된 전극을 평가하였다. $Bi_2O_3$를 50-60wt%이상 첨가된 $Bi_2O_3-B_2O_3-Al_2O_3$계 조성의 프릿은 연화점이 400∼$480^{\circ}C$, 열팽창계수가 7.31∼$10.02\times 10^{-6}/^{\circ}C$이며, 전극의 단자저항은 4.1∼4.8$\Omega$ 이었다. 본 연구에서 새로이 개발된 Bi계 프릿조성은 Pb계 조성의 프릿에 상당하는 물성을 얻을 수 있었으며, 이를 전극용 페이스트에 적용한 결과, 전극 프린팅에서 퍼짐성과 균일성이 우수하였다. PDP전극용 무연, 무 알카리 프릿으로 Bi계 조성의 적용가능성을 확인할 수 있었다.

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인덕션 조리용기용 도전성 Paste의 Silver 및 Glass Frit 함량 변화에 따른 미세구조 및 전기적 특성 고찰 (Fabrication of Conductive Pastes for Induction Cookware with the Variation of the Contents of Silver Powder and Glass Frit)

  • 구현호;김봉호;윤영준
    • 한국전기전자재료학회논문지
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    • 제29권11호
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    • pp.690-695
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    • 2016
  • Induction cooktop has a great attention due to its safety, quick heating and cleanness compared to gas oven. However, the materials for induction cookware is limited to steel or stainless-steel which has the magnetic property. Recently, it has been tried to apply various porcelain to induction cookware after printing the silver layer on the bottom of cookware plates and co-firing at high temperature. Glass frits are added in the silver paste to improve an adhesion force between porcelain materials containers and transferred silver layer. The hybrid silver pastes for induction cookware requires the proper electrical resistance and the thermal conductivity with base plates. After sintering process at $800^{\circ}C$, a part of melted glass migrated to the porcelain and the rest of the glass frit was exposed to the surface. It was confirmed that most of the glass frit formed an adhesion layer between the porcelain and transferred silver layer that enhances the adhesion force.

Lead free, Low temperature sealing materials for soda lime glass substrates in Plasma Display Panel (PDP)

  • Lee, Heon-Seok;Hwang, Jong-Hee;Lim, Tae-Young;Kim, Yoon-Hee;Lee, Suk-Hwa;Kim, Il-Won;Lee, Jong-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.373-376
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    • 2008
  • New glass compositions for lead free, low temperature sealing glass frit was examined in $ZnO-V_2O_5-P_2O_5$ glass system which can be used sealing material for PDP to be made of soda lime glass substrates. Among many glass compositions, KFS-C glass showed low glass transition point (Tg) and good fluidity and adhesion characteristics when it was tested by flow button method at low temperature of $420^{\circ}C$. Its Tg was $317^{\circ}C$ and thermal expansion coefficient (CTE) was $70{\times}10^{-7}/K$. The glass frit was mixed with an organic vehicle to make a paste and it was dispensed and sealed with soda lime glass substrates at $420^{\circ}C$ for 10min. Sealed glass panels also showed good adhesion strength even sealed at low temperature of $420^{\circ}C$.

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저온소성 프릿이 첨가된 MnWO4의 소결체의 습도특성 (Humidity Properties of Sintered MnWO4 with a Low Temperature Firing Frit)

  • 정병해;소지영;김형순
    • 한국재료학회지
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    • 제13권2호
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    • pp.120-125
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    • 2003
  • A low melting borosilicate glass frit was used as an adhesion promoter, which enables $MnWO_4$to be sintered with in a reasonable sintering temperature range ($800∼1000^{\circ}C$). The glass was evaluated for glass transition temperature ($Τ_{g}$ X) and thermal expansion coefficient($\alpha$). Mechanical property (Vickers hardness), grain growth, the comparison of lattice parameter and pore distribution of sintered $MnWO_4$ with the frit were methodically discussed. As sintering temperature increased, a typical liquid phase sintering showed the rapid grain growth and high densification of X$MnWO_4$grain, improvement of hardness (until $920^{\circ}C$) and different pore size distribution. Resistance of sintered $MnWO_4$varied from 450k$\Omega$ to 8.8M$\Omega$ under the measuring humidify ranging from 30 to 90%. Thus, the results will contribute to the application of glass frit containing sensor materials and their future use.

Effect of Binder Glass Crystallization on Electrical Properties in $RuO_2$-Thick Film Resistor

  • Sungmin Kwon;Kim, Cheol-Young
    • The Korean Journal of Ceramics
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    • 제2권1호
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    • pp.33-38
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    • 1996
  • In thick film resistors, the characteristics of the frit and the reaction between glass frit and conductor material play an important role for their electrical properties. In this study, various glass frits in the system of $60RO{\cdot}20SiO_2$ $15B_2O_3{\cdot}5Al_2O_3$(RO=PbO, ZnO, CdO; mole%) were mixed with $RuO_2$ and coated on 96% alumina substrate. Only the glass frit containing PbO was reacted with $RuO_2$in$RuO_{2+}$-thick film resistor and produced the new crystalline phase of $Pb_2Ru_2O_{65}$. Their electrical resistivities strongly depend on the amount of $Pb_2Ru_2O_{65}$ crystalline phase obtained, which varied with firing temperature. The sheet resistivities of these resistors were varied from $10^3\; to\; 10^6\;{\Omega}/{\Box}$ depending on heat treatment, and the absolute value of TCR was decreased as the heat treatment temperature increaed. However, $RuO_2$ did not reacted with the glass frits containing ZnO nor CdO, and the resulting showed very high sheet resistivities.

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중금속 창연산화납계 저온유리 분말을 이용한 세라믹스/금속의 접합거동 (Joining Behavior of Ceramics to Metal by Using Lead-bismate Heavy Metal Glass Frit)

  • 최진삼
    • 한국세라믹학회지
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    • 제51권4호
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    • pp.312-316
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    • 2014
  • The joining behavior of forsterite ceramics to SUS304 alloy using $8PbO-78Bi_2O_3-8B_2O_3-4ZnO-2SiO_2$ (wt%) system glass frit was investigated. The contact angle was smaller than $90^{\circ}$ at a temperature of $460^{\circ}C$. Redox reaction at the interface between forsterite and SUS304 was found to appear when the electrons in the metal part moved toward the glass part and the oxygen ions in glass moved to the metal side. The decrease of the surface tension due to the PbO solubility on the forsterite side contributed to the better wetting behavior at low temperature.