• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1999년도 제29회 춘계학술대회
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• pp.265-271
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• 1999

The effects of solid lubricants on wear and friction characteristics of friction materials were studied using a pad-on-disk type friction tester. Friction materials with four different formulations containing different relative amounts of solid lubricants(graphite, MoS$_2$, and Sb$_2$S$_3$) were investigated. Results of this work showed that each formulation with different lubricants had unique friction characteristics. Friction material containing rich MoS$_2$ showed excellent friction stability at different friction conditions. However friction material containing rich Sb$_2$S$_3$revealed high wear of friction materials.

• Tribology and Lubricants
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• 제15권4호
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• pp.314-320
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• 1999

Friction and wear characteristics of phenolic resin-based friction materials reinforced with aramid pulp and potassium titanate were investigated using a pad-on-disk type friction tester. Friction characteristics such as friction stability, thermal stability, and wear rate varied according to the type of phenolic resins and the relative amount of aramid pulp and potassium titanate. The modified novolac resin-based friction materials showed better heat resistance and friction stability than those with the unmodified(straight) novolac resin. Compared with friction materials filled with potassium titanate or aramid pulp only, the friction materials reinforced with both aramid pulp and potassium titanate showed good friction stability and wear resistance. Increment of aramid pulp from 10 to 20 vol.% however, showed little difference in friction stability.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.310-317
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• 2000

Tribological properties of friction materials containing different volume ratios of solid lubricants (graphite and MoS$_2$) were studied using a pad-on-disk type friction tester. Morphology and thickness of the friction film were carefully examined to correlate the friction performance with the property of the friction film. Results showed that the friction materials containing 16vo1. % of graphite and 5 vol. % of MoS$_2$exhibited best friction stability among others. In particular, the thickness of the friction film decreased as the amount of MoS$_2$increased and severe friction oscillation was observed when the friction material contained MoS$_2$only (21 vol. %). Microscopic observations and friction tests suggested that the coherent thick transfer film improved the friction stability.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1998년도 제28회 추계학술대회
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• pp.323-329
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• 1998

The effect of humidity on friction characteristics of friction materials were studied using a pad-on-disk type friction tester. Three different friction materials containing simplified ingredients were investigated by changing the solid lubricant, graphite, MoS$_2$, and $Sb_2S_3$. A friction material without solid lubricant was also examined to study the effect of ingredients in the matrix on humidity. Friction material containing graphite showed lower friction coefficient at high humidity level than other conditions, however, friction material containing MoS$_2$ indicated higher friction coefficient at initial stage under high humidity level. Friction materials without solid lubricant and with $Sb_2S_3$ were little affected by humidity conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• Tribology and Lubricants
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• 제38권1호
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• pp.1-7
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• 2022

Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1999년도 제30회 추계학술대회
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• pp.225-232
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• 1999

The effect of manufacturing parameters such as molding and curing conditions on friction characteristics of friction materials was studied using a pad-on-disk type friction tester. Friction materials containing 15 ingredients were investigated for an optimal manufacturing condition for the best friction characteristics employing Taguchi robust experimental design. The main effects were different for mechanical properties and friction characteristics and were strongly influenced by manufacturing conditions. An optimum manufacturing condition was obtained to achieve the best friction characteristics concerning mechanical properties(hardness, porosity, wear resistance), friction stability, and change of rotor temperature.

• Tribology and Lubricants
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• 제25권1호
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• pp.49-55
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• 2009

The frictional properties of automotive brake pads with four different ceramic materials such as magnesia, hematite, alumina, and zircon were investigated. A Krauss type friction tester using gray iron disks was used to examine the friction coefficient, intensity of friction force oscillation, and the tribe-surfaces. Results showed that the friction coefficient increased as the hardness of abrasives increases. Friction oscillation was also increased with hardness of the abrasives. However, the friction materials containing less abrasive particles produced stable friction films on the sliding surface. The transition between two-body and three body abrasion during sliding also played a crucial role in destructing the friction film on the pad surface and in determining various frictional properties.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.972-975
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• 2002

An understanding of tribological behavior in CMP(Chemical Mechanical Polishing) is one of the most important things to reveal the mechanism of material removal. In CMP, the contact type is thought to be semi-direct, elastohydrodynamic contact type from the Stribeck diagram, which is a combination of solid-solid direct contact and hydrodynamic lubrication with thin liquid film. This study is focused on the decay of friction force during CMP from two points of view, one of which is change of the real contact area and the other is the decrease of the elastic modulus of the pad caused by the increase of the temperature during CMP Experiments are implemented with elastic modulus measuring system and tool dynamometer. Results show that the decay of friction force during CMP results from the decrease of the real contact pressure working on an abrasive, which is induced by the decrease of elastic modulus of pad caused by the increase of temperature. And, the phenomenon is thought to be happen specially in the case that the weight concentration of abrasive in slurry is small enough.

• 한국정밀공학회지
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• 제26권12호
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• pp.117-122
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• 2009

The hexagonal network-type PDMS microstructures were fabricated and they were employed to low-friction drag surfaces. While the lowest contact angle measured from the smooth surface was $108^{\circ}$ the highest contact angle measured from the microstructured surfaces was $145^{\circ}$ The moving speed of bullet-type capsule attached with a PDMS pad of smooth surface ($CA=108^{\circ}$) was 0.1261 m/s and that with a PDMS pad of microstructured surface ($CA=145^{\circ}$) was 0.1464 m/s. Compared with the smooth surface, the microstructured surface showed 16.1% higher moving speed. The network-type microstructures have a composite surface that is composed with air and PDMS solid. Therefore, the surface does not wet: rather water is lifted by the microstructures. Because of the composite surface, water shows slip-flow on the microstructures, and thus friction drag can be reduced.