• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Structural Engineering and Mechanics
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• v.65 no.5
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• pp.573-585
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• 2018

This article presents strain gradient elasticity-based procedures for static bending, free vibration and buckling analyses of functionally graded rectangular micro-plates. The developed method allows consideration of smooth spatial variations of length scale parameters of strain gradient elasticity. Governing partial differential equations and boundary conditions are derived by following the variational approach and applying Hamilton's principle. Displacement field is expressed in a unified way to produce numerical results in accordance with Kirchhoff, Mindlin, and third order shear deformation theories. All material properties, including the length scale parameters, are assumed to be functions of the plate thickness coordinate in the derivations. Developed equations are solved numerically by means of differential quadrature method. Proposed procedures are verified through comparisons made to the results available in the literature for certain limiting cases. Further numerical results are provided to illustrate the effects of material and geometric parameters on bending, free vibrations, and buckling. The results generated by Kirchhoff and third order shear deformation theories are in very good agreement, whereas Mindlin plate theory slightly overestimates static deflection and underestimates natural frequency. A rise in the length scale parameter ratio, which identifies the degree of spatial variations, leads to a drop in dimensionless maximum deflection, and increases in dimensionless vibration frequency and buckling load. Size effect is shown to play a more significant role as the plate thickness becomes smaller compared to the length scale parameter. Numerical results indicate that consideration of length scale parameter variation is required for accurate modelling of graded rectangular micro-plates.

• Journal of Welding and Joining
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• v.30 no.2
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• Nuclear Engineering and Technology
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• v.53 no.7
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• pp.2184-2194
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• 2021

The Free-Piston Stirling engine (FPSE) is of interest for many research in aerospace due to its advantages of long operating life, higher efficiency, and zero maintenance. In this study, a 1-kW FPSE was proposed by analyzing the requirements of Space Reactor Power Systems (SRPS), of which performance was evaluated by developing a code through the Simple Analysis Method. The results of SAM showed that the critical parameters of FPSE could satisfy the designed requirements. The heater of the FPSE was designed with the copper rectangular fins to enhance heat transfer, and the parametric study of the heater was performed with Computational Fluid Dynamics (CFD) software STAR-CCM⁺. The Performance Evaluation Criteria (PEC) was used to evaluate the heat transfer enhancement of the fins in the heater. The numerical results of the CFD program showed that pressure drop and Nusselt number ratio had a linear growth with the height of fins, and PEC number decreased as the height of fins increased, and the optimum height of the fin was set as 4 mm according to the minimum heat exchange surface area. This paper can provide theoretical supports for the design and numerical analysis of an FPSE for SRPSs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.11 s.254
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• pp.1408-1416
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• 2006

A mathematical knee model was constructed using MADYMO. The purpose of this study is to present a more realistic model of the human knee to reproduce human knee motion. Knee ligaments were modeled as line elements and the surrounding muscles were considered as passive restraint elements. A calf-free-drop test was performed to validate the suggested model. A calf was dropped from the rest at about 65 degree flexed posture in the prone position. The motion data were recorded using four video cameras and then three dimensional data were acquired by Kwon3D motion analysis software. The results showed that general shapes of angular quantities were similar in both the experiment and computer simulation. Functional stability of the anterior cruciate ligament was explicitly revealed through this model.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.441-446
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• 2004

Mechanical systems with rubber parts have been used widely in industry fields. The evaluation of the physical characteristics of rubber is important in rubber application. Rubber material is useful to machine component for excellent shock absorbing characteristics. The impact characteristics of rubber were examined by experimental and finite element method. The impact test was conducted with a free-drop type impact tester. The ABAQUS/Explicit was used for finite element analysis. The effects of thickness and diameter of the cylindrical rubber structures were investigated. The impact absorbing ratio of the rubber material was studied order to compare the peak reaction force of the specimen which only contained aluminum against the specimen with the inserted rubber part.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.2
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• pp.143-150
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• 2001

원자력발전소의 1차 계통에서 오염된 장비들을 취급이 용이하고 안전하게 운반하기 위한 운반용기는 내부의 방사성 물질에 대한 방사능 평가에 의하여 방사성물질 A형 운반용기로 분류된다. 방사성물질 A형 운반용기는 IAEA Safety Standard Series No. ST-1 및 국내 원자력법 등 관련규정의 기술기준을 만족하여야 하는데, 운반용기는 중량에 따라 0.3∼1.2m의 높이에서 소성이 일어나지 않는 단단한 바닥면으로 가장 심각한 손상을 주는 방향으로 낙하시키는 정상운반조건(normal transport conditions)에 대하여 구조적 건전성을 유지하여야 한다. 여기서는 ABAQUS/Explicit 코드를 이용하여 컨테이너형태의 A형 운반용기에 대하여 최대손상이 야기되는 0.9m 경사낙하조건에 대한 3차원 충격해석을 수행하고 구조적 건전성을 평가하였는데, 운반용기는 경사낙하시 코너피팅(corner fitting)의 분쇄(crush)에 의하여 대부분의 충격을 흡수하였으며 운반용기의 격납경계는 구조적 건전성을 유지하였다.

• Journal of Korean Neurosurgical Society
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• v.58 no.6
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• pp.557-559
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• 2015

Medulloblastoma is a common pediatric tumor typically diagnosed before the age of fifteen. Initial therapy includes surgical resection and radiation of the entire neuro-axis. Recurrence is common and typically occurs within 2 years of initial diagnosis. Those fitting Collin's Law is considered tumor-free. We report a case of single supratentorial recurrence 13 years after initial diagnosis. Here we present a 22 year old male presenting 13 years after initial diagnosis with isolated septum pellucidum recurrence. He underwent complete resection of the tumor. Medulloblastoma is a common in the pediatric population. Late recurrence to the ventricular system is uncommon. Long term follow-up is recommended in these patients.

• Structural Engineering and Mechanics
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• v.10 no.1
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• pp.81-92
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• 2000

This study is an investigation of the effect of cracks on the dynamical characteristics of a cantilever beam, having multiple open-edge transverse cracks. The flexibilities due to crack have been identified for several crack depths and locations. In the study the finite element method and component mode synthesis methods are used. Coupling the components is performed by a flexibility matrix taking into account the interaction forces. Each component is modelled by cantilever beam finite elements with two nodes and three degrees of freedom at each node. The results obtained lead to conclusion that, by using the drop in the natural frequencies and the change in the mode shapes, the presence and nature of cracks in a structure can be detected. There is some counter-evidence, however, that the effects due to multiple cracks may interact to make detection more difficult than for isolated cracks.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.