• 한국농공학회지
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• 제36권1호
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• pp.116-127
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• 1994

A reliability analysis model for the frame structure which grafts the discretized ideal plastic method to the stochastic finite element method is introduced. The proposed method simmulates realistically the sequencial occurrence of plastic hinges and yields the probability of failure directly from the geometrical and material properties of a frame structure. The presented method can also take into account the uncertainties inherent in loads and resisten- ces through the stochastic finite element technique. The analysis results are compared with those of the Monte Carlo Simmulation, the Bound Theory, and the fs-unzipping method, and show good agreement.

• 스마트미디어저널
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• 제6권2호
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• pp.9-14
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• 2017

무선 환경에서의 패킷 손실은 비디오 통신과정에서 심각한 비디오 품질 저하를 초래한다. 이 논문에서는 블록의 신뢰도와 블록 경계면 매칭을 기반으로 한 비디오 에러 은닉 기술에 대해서 제안한다. 손실된 블록의 모션 정보를 참조 프레임의 동일한 위치에 존재하는 블록의 모션 정보를 복사하여 사용함으로써 임시로 손실된 블록의 잡음을 은닉하고, 블록의 신뢰도를 기준으로 블록의 신뢰도가 낮은 경우에는 추가적으로 블록의 경계면 매칭을 이용하여 모션 벡터를 재탐색하여 잡음 은닉에 대한 정확도를 높이도록 하였다. 실험을 통해서 제안된 기법이 다양한 패킷 손실 환경에서 우수한 에러 은닉 성능을 보임을 확인하였다.

• 한국콘텐츠학회논문지
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• 제13권5호
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• pp.28-36
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• 2013

비디오 신호에서 움직임 보상 보간 기술은 다양한 응용 분야를 갖는다. 프레임율 증가 변환이나 분산 비디오 부호화 기술에서는 효과적인 움직임 보상 보간 알고리즘을 필요로 한다. 이러한 응용 분야에서는 움직임 보상 보간 프레임에 대한 효과적인 후처리 기술을 통하여 화질을 개선하거나 또는 가상 채널 잡음을 줄임으로써 채널 전송 비트율을 줄이기 위해 각 블록 단위의 신뢰도 측정이 요구된다. 본 논문에서는 움직임 보상 보간 블록에 대한 시공간적 통계특성에 기초한 블록 기반의 신뢰도 평가방법을 제안한다. 제안한 방법은 현재 보간 프레임의 시간적 정합척도를 조사하고, 이 결과를 시간적 통계특성 뿐만 아니라, 공간적 통계특성을 조사하는 방법으로 설계된다. 모의실험을 통하여 제안한 방식은 기존의 단순한 시간적 정합 비용에 의한 방식에 비해 우수한 성능을 보인다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.161-165
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• 2001

Bogie frame of the electric car is an important structural member for the support of vehicle loading. In general, more than 25 years' durability is necessary. Much study has been carried out for the prediction of the structural integrity of the bogie frame in experimental and theoretical domains. One of the useful methods is reliability-based approach. The objective of this paper is to estimate the structural integrity of the bogie frame of an electric car, which is under the running test. We used two approachs. In the first approach probabilistic distribution of S-N curve is used. In the second approach, limit state function is used.

• 한국정밀공학회지
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• 제34권2호
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• pp.139-143
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• 2017

Finite element analysis was performed for a split-type CFRP bicycle frame, which was designed to apply a compression molding process with carbon fiber prepreg for a conventional bicycle. An epoxy adhesive material for joining the frames was selected by the extent of stress at joint interfaces. The split-type bicycle frame was then formed and its weak parts examined by the boundary conditions according to reliability tests. The results verified the reliability of the bicycle frame after modification of these weak parts. The finished product was manufactured by using this developed split-type bicycle frame.

• 한국농공학회논문집
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• 제64권5호
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• pp.67-77
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• 2022

Recently, the trend in structural analysis and design is moving towards the development of reliable system. The reliability-based method defines various limit states related to usability and failure, thereby enabling multiple levels of design according to the importance of a structure. Meanwhile, an actual structure is composed of a set of several elements, and particularly, a frame type is composed of a system in which the members are connected each other. At this time, the actual connection between members is in a semi-rigid condition, not in complete rigid or hinged. This semi-rigid is found in several structures, especially in agricultural facilities designed with lightweight materials. In this study, a system reliability analysis technique for frame structure was established, and applied to an analysis of the semi-rigid connection. Various conditions of correlation were applied to reflect the connectivity between members, and through this, the limitations of existing structural analysis method and the behavioral characteristics of structure were analyzed. The failure probability of the frame member component and the overall structure system was significantly different in consideration of the semi-rigid connection. In addition, it was evaluated that the behavior of structure can be more accurately analyzed if the correlation according to the position of members in a system is further investigated.

• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• 대한조선학회논문집
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• 제28권2호
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• pp.251-267
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• 1991

평면 골조 구조물로 이상화된 Web frame의 최종강도를 합리적으로 추정하기 위해 기존의 탄성해석 방법 대신에 구조물의 소성붕괴를 최종상태로 가정하여 구조해석을 수행하는 소성 해석 방법으로 선형 계획법과 Compact procedure를 정식화 하였고, 그 결과를 탄소성 해석과 비교하여 Web frame의 안전성 평가에 있어서 소성강도 해석 방법의 유용성을 검토하였다. 또한 구조해석에 사용되는 변수들의 확률적 특성을 고려하여 구조물의 안전성 평가를 하는 신뢰성 해석을 위해 소성붕괴 해석에서 얻어지는 구조물이 소성 파괴모드를 신뢰성 모델로서 사용 하였으나, 선체와 같이 과잉 구속되어 있는 부정정 구조물이 갖는 다수의 파괴모드 문제를 처리 하기 위해 기본 파괴모드 해석 방법과 자동 파괴모드 해석 방법을 이용하였고, 얻어진 파괴 모드로 부터 Web frame의 파괴확률을 계산하여 구조물의 안전성 평가에 있어서 확정론적인(deterministic)방법과 확률론적인(probabilistic)방법을 비교 검토하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 한국자동차공학회논문집
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• 제11권6호
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• pp.197-204
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• 2003

This paper develops a computer model for estimating the handling of a cabover type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using ADAMS. A shock absorber, a rubber bush, and a leaf spring aunt a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC/PATRAN. A mode analysis is performed with the frame model using MSC/NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double lane change test is performed with an actual vehicle. In the double lane change, lateral acceleration, yaw rate, and roll angle are measured. Those test results are compared with the simulation results.