• Magazine of the Korean Society of Agricultural Engineers
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• v.36 no.1
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• pp.116-127
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• 1994

A reliability analysis model for the frame structure which grafts the discretized ideal plastic method to the stochastic finite element method is introduced. The proposed method simmulates realistically the sequencial occurrence of plastic hinges and yields the probability of failure directly from the geometrical and material properties of a frame structure. The presented method can also take into account the uncertainties inherent in loads and resisten- ces through the stochastic finite element technique. The analysis results are compared with those of the Monte Carlo Simmulation, the Bound Theory, and the fs-unzipping method, and show good agreement.

• Smart Media Journal
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• v.6 no.2
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• pp.9-14
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• 2017

A packet loss in wireless environments causes a severe degradation of video quality in video communications. In this paper, a novel video error concealment algorithm is presented by combining boundary errors and a block reliability measure. The block reliability measure decides the reliability of a block by checking residual errors of a block. In the proposed approach, a motion vector of a missing unreliable block in an inter coded frame is obtained initially based on the motion vector of the same block in the reference frame. Furthermore, if the block in the reference frame is unreliable according to the reliability measure, a new motion vector is decided based on block boundary errors around the initial motion vector. According to our simulations, the proposed approach shows promising results for error concealment in error-prone wireless environments.

• The Journal of the Korea Contents Association
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• v.13 no.5
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• pp.28-36
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• 2013

Motion-compensated frame interpolation (MCFI) techniques in video signal processing have many application areas. Frame rate up-conversion (FRUC) or distributed video coding (DVC) technique needs an effective MCFI algorithm. For these applications, it is necessary to develop an effective post-processing technique to improve visual qualities or to reduce virtual channel noises, resulting in the reduced channel bit rate. This paper proposes a reliability evaluation method based on spatio-temporal characteristics for motion-compensated interpolated blocks. The proposed algorithm investigates the temporal matching characteristics for current frame and then is designed in such a way that it can measure temporal characteristics as well as the spatial ones. Through computer simulations, it is shown that the proposed method outperforms the conventional temporal matching method.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.161-165
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• 2001

Bogie frame of the electric car is an important structural member for the support of vehicle loading. In general, more than 25 years' durability is necessary. Much study has been carried out for the prediction of the structural integrity of the bogie frame in experimental and theoretical domains. One of the useful methods is reliability-based approach. The objective of this paper is to estimate the structural integrity of the bogie frame of an electric car, which is under the running test. We used two approachs. In the first approach probabilistic distribution of S-N curve is used. In the second approach, limit state function is used.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.139-143
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• 2017

Finite element analysis was performed for a split-type CFRP bicycle frame, which was designed to apply a compression molding process with carbon fiber prepreg for a conventional bicycle. An epoxy adhesive material for joining the frames was selected by the extent of stress at joint interfaces. The split-type bicycle frame was then formed and its weak parts examined by the boundary conditions according to reliability tests. The results verified the reliability of the bicycle frame after modification of these weak parts. The finished product was manufactured by using this developed split-type bicycle frame.

• Journal of The Korean Society of Agricultural Engineers
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• v.64 no.5
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• pp.67-77
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• 2022

Recently, the trend in structural analysis and design is moving towards the development of reliable system. The reliability-based method defines various limit states related to usability and failure, thereby enabling multiple levels of design according to the importance of a structure. Meanwhile, an actual structure is composed of a set of several elements, and particularly, a frame type is composed of a system in which the members are connected each other. At this time, the actual connection between members is in a semi-rigid condition, not in complete rigid or hinged. This semi-rigid is found in several structures, especially in agricultural facilities designed with lightweight materials. In this study, a system reliability analysis technique for frame structure was established, and applied to an analysis of the semi-rigid connection. Various conditions of correlation were applied to reflect the connectivity between members, and through this, the limitations of existing structural analysis method and the behavioral characteristics of structure were analyzed. The failure probability of the frame member component and the overall structure system was significantly different in consideration of the semi-rigid connection. In addition, it was evaluated that the behavior of structure can be more accurately analyzed if the correlation according to the position of members in a system is further investigated.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Journal of the Society of Naval Architects of Korea
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• v.28 no.2
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• pp.251-267
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• 1991

Plastic strength analysis using plastic failure mode as a limit state is adopted instead of a conventional elastic structural analysis to predict the ultimate strength of Web frame idealized by a plane frame. Linear programming arid Compact procedure are developed for determining the collapse load factor. It is found that the final results are good agreement with the results of Elasto-plastic analysis. Besides, the redundant structures like Web frame is known to have multiple failure modes. Web frame may collapse under any of the possible failure modes. Thus, the identification of these possible failure modes is necessary and very important in the reliability analysis of Web frame. In order to deal with multiple failure modes, automatic generation method of all failure modes and basic failure modes is used for selecting the dominant failure modes. The probability of failure pastic collapse of Web frame is calculated using these dominant failure modes. The safety of Web frame is asscssed and compared by performing the deterministic and probabilistic analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.6
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• pp.197-204
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• 2003

This paper develops a computer model for estimating the handling of a cabover type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using ADAMS. A shock absorber, a rubber bush, and a leaf spring aunt a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC/PATRAN. A mode analysis is performed with the frame model using MSC/NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double lane change test is performed with an actual vehicle. In the double lane change, lateral acceleration, yaw rate, and roll angle are measured. Those test results are compared with the simulation results.