• Title/Summary/Keyword: Focal Contact

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Analysis of Subwavelength Metal Hole Array Structure for the Enhancement of Quantum Dot Infrared Photodetectors

  • Ha, Jae-Du;Hwang, Jeong-U;Gang, Sang-U;No, Sam-Gyu;Lee, Sang-Jun;Kim, Jong-Su;Krishna, Sanjay;Urbas, Augustine;Ku, Zahyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.334-334
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    • 2013
  • In the past decade, the infrared detectors based on intersubband transition in quantum dots (QDs) have attracted much attention due to lower dark currents and increased lifetimes, which are in turn due a three-dimensional confinement and a reduction of scattering, respectively. In parallel, focal plane array development for infrared imaging has proceeded from the first to third generations (linear arrays, 2D arrays for staring systems, and large format with enhanced capabilities, respectively). For a step further towards the next generation of FPAs, it is envisioned that a two-dimensional metal hole array (2D-MHA) structures will improve the FPA structure by enhancing the coupling to photodetectors via local field engineering, and will enable wavelength filtering. In regard to the improved performance at certain wavelengths, it is worth pointing out the structural difference between previous 2D-MHA integrated front-illuminated single pixel devices and back-illuminated devices. Apart from the pixel linear dimension, it is a distinct difference that there is a metal cladding (composed of a number of metals for ohmic contact and the read-out integrated circuit hybridization) in the FPA between the heavily doped gallium arsenide used as the contact layer and the ROIC; on the contrary, the front-illuminated single pixel device consists of two heavily doped contact layers separated by the QD-absorber on a semi-infinite GaAs substrate. This paper is focused on analyzing the impact of a two dimensional metal hole array structure integrated to the back-illuminated quantum dots-in-a-well (DWELL) infrared photodetectors. The metal hole array consisting of subwavelength-circular holes penetrating gold layer (2DAu-CHA) provides the enhanced responsivity of DWELL infrared photodetector at certain wavelengths. The performance of 2D-Au-CHA is investigated by calculating the absorption of active layer in the DWELL structure using a finite integration technique. Simulation results show the enhanced electric fields (thereby increasing the absorption in the active layer) resulting from a surface plasmon, a guided mode, and Fabry-Perot resonances. Simulation method accomplished in this paper provides a generalized approach to optimize the design of any type of couplers integrated to infrared photodetectors.

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System for Measuring the Welding Profile Using Vision and Structured Light (비전센서와 구조화빔을 이용한 용접 형상 측정 시스템)

  • Kim, Chang-Hyeon;Choe, Tae-Yong;Lee, Ju-Jang;Seo, Jeong;Park, Gyeong-Taek;Gang, Hui-Sin
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 2005.11a
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    • pp.50-56
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    • 2005
  • The robot systems are widely used in the many industrial field as well as welding manufacturing. The essential tasks to operate the welding robot are the acquisition of the position and/or shape of the parent metal. For the seam tracking or the robot tracking, many kinds of contact and non-contact sensors are used. Recently, the vision is most popular. In this paper, the development of the system which measures the shape of the welding part is described. This system uses the line-type structured laser diode and the vision sensor. It includes the correction of radial distortion which is often found in the image taken by the camera with short focal length. The Direct Linear Transformation (DLT) method is used for the camera calibration. The three dimensional shape of the parent metal is obtained after simple linear transformation. Some demos are shown to describe the performance of the developed system.

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Cross Talk among Pyroelectric Sensitive Elements in Thermal Imaging Device

  • Bang Jung Ho;Yoon Yung Sup
    • Proceedings of the IEEK Conference
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    • 2004.08c
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    • pp.780-783
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    • 2004
  • The two-dimensional modeling of the non-stationary thermal state and voltage responsivity of the sensitive elements usually used in solid-state pyroelectric focal plane arrays are presented. Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, which is composed of the pyroelectric sensitive elements mounted on a single silicon substrate, are numerically calculated. The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column and the bulk silicon readout. The results of the numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f < 10Hz) of periodically modulated light. It is also shown that the use of our models gives the possibility to improve the design, operating regimes and sensitivity of the device.

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A Study on Measuring the Shape of Transparent Objects using the Focal Area of Hologram Optical System (홀로그램 광학계의 초점영역을 이용한 투명 물체의 형상 측정에 관한 연구)

  • Byun, Jong-Hwan;Ryu, Young-Kee;Oh, Choon-Suk
    • Proceedings of the KIEE Conference
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    • 2005.10b
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    • pp.600-602
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    • 2005
  • Recently image display devices have become large and high quality. To control the qualities of the component, measurements of the shape and thickness of a plate glass has been required. In order to measure the shape of the specular objects, Non-Contact Optical Sensor using Hologram laser unit was proposed. The sensor has a optical system that is composed of a Hologram laser and objective lens used for CD Player, and the sensor showed high performance for measuring the shape and thickness of transparent plates. In the sensor, the temperature of the sensor body is controlled by TEC(Thermoelectric Cooler). In this paper, we proposed the measuring method to make better performance of sensor using focus error signal of a hologram laser unit. It can measure the shape and the thickness of transparent objects with the s-type focus error signal which is generated by the sensor while it goes to the object.

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Displacement measurement sensor using astigmatic confocal technology

  • J.W. Seo;D.K. Kang;Lee, J.H.;Kim, D.M.;D.G. Gweon
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.163.2-163
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    • 2001
  • Confocal scanning microscopy (CSM) has been reported as an excellent method using the optical probe in scanning probe microscopy (SPM). Transmission or reflection confocal scanning microscopy (TCSM, RCSM) has been used in the three-dimensional reconstruction of specimen or the non-destructive measurement in vivo. The axial movement of the primary focal point having the information of specimen gives a good measurement performance with the great sensitivity. Application of the confocal theory and astigmatism to displacement measurement sensor uses the aperture as the pinhole or slit after collecting lens relating to confocal response in non-contact measurement; and astigmatic lens using four-segments detector as short-range sensor, long-range one combining the grating and rotary one hating the rotary directional grating. The aperture type can play an ...

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Early Intervention for Low-Temperature Burns: Comparison between Early and Late Hospital Visit Patients

  • Choi, Matthew Seung Suk;Lee, Ho Joon;Lee, Jang Hyun
    • Archives of Plastic Surgery
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    • v.42 no.2
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    • pp.173-178
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    • 2015
  • Background Various focal heating devices are popular in Korea under the cultural influence of the traditional ondol under-floor method of home heating. These devices can cause severe burn-like injuries resulting from device malfunction or extended with low heat contact. In addition to injuries under these high heat contact, burns can be occurred by low heat exposure with prolonged periods despite the devices are properly functioning. In order to develop strategies to reduce the duration of periods of illness due to low-temperature burns, we analyzed and compared treatment methods and therapeutic periods for this type of injury. Methods This retrospective study included 43 patients burned under low heat conditions. Patients were divided into an operative group and a conservative group. The patients in the operative group underwent at least one surgical excision, and were further subdivided into early and late visit groups. The conservative group was treated only with dressings. We compared the treatment periods between the operative group and the conservative group, and also compared the preparation periods and treatment periods between the two operative groups. Results The average treatment period was significantly shorter in the operative group (P=0.02). In the early visit operative group, both wound preparation and treatment were briefer than in the late visit group. Conclusions We recommend that early proper burn care and early surgical intervention, including appropriate excision, are feasible ways to reduce the treatment period of lowtemperature burn patients.

Uncooled Microbolometer FPA Sensor with Wafer-Level Vacuum Packaging (웨이퍼 레벨 진공 패키징 비냉각형 마이크로볼로미터 열화상 센서 개발)

  • Ahn, Misook;Han, Yong-Hee
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.300-305
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    • 2018
  • The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

Adhesion of Human Osteoblasts Cell on TiN Thin Film Deposited by Cathodic Arc Plasma Deposition

  • Pham, Vuong Hung;Kim, Sun-Kyu;Le, Vinh Van;Kwon, Byoung-Se
    • Journal of the Korean institute of surface engineering
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    • v.41 no.6
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    • pp.264-268
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    • 2008
  • Interaction between human osteoblast and TiN films was conducted in vitro. TiN films were produced by cathodic arc plasma deposition. The surface was characterized by atomic force microscopy (AFM). TiN films, glass substrates and Ti films were cultured with human osteoblasts for 48 and 72 h hours. Actin stress fiber patterns and microtubules of osteoblasts were found slightly more organized and distributed on TiN films compared to those on the Ti films and the glass substrates. Human osteoblasts also showed slightly higher cell attachment, proliferation, and focal contact adhesion on TiN films compared to those on Ti films and glass substrates. Our results demonstrated that TiN films showed slightly better cellular adhesion of osteoblasts than Ti films and glass substrates in a short-time culture period.

A Survey on Security Schemes based on Conditional Privacy-Preserving in Vehicular Ad Hoc Networks

  • Al-Mekhlafi, Zeyad Ghaleb;Mohammed, Badiea Abdulkarem
    • International Journal of Computer Science & Network Security
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    • v.21 no.11
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    • pp.105-110
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    • 2021
  • Contact between Vehicle-to-vehicle and vehicle-to-infrastructural is becoming increasingly popular in recent years due to their crucial role in the field of intelligent transportation. Vehicular Ad-hoc networks (VANETs) security and privacy are of the highest value since a transparent wireless communication tool allows an intruder to intercept, tamper, reply and erase messages in plain text. The security of a VANET based intelligent transport system may therefore be compromised. There is a strong likelihood. Securing and maintaining message exchange in VANETs is currently the focal point of several security testing teams, as it is reflected in the number of authentication schemes. However, these systems have not fulfilled all aspects of security and privacy criteria. This study is an attempt to provide a detailed history of VANETs and their components; different kinds of attacks and all protection and privacy criteria for VANETs. This paper contributed to the existing literature by systematically analyzes and compares existing authentication and confidentiality systems based on all security needs, the cost of information and communication as well as the level of resistance to different types of attacks. This paper may be used as a guide and reference for any new VANET protection and privacy technologies in the design and development.

Exploration of temperature effect on videogrammetric technique for displacement monitoring

  • Zhou, Hua-Fei;Lu, Lin-Jun;Li, Zhao-Yi;Ni, Yi-Qing
    • Smart Structures and Systems
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    • v.25 no.2
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    • pp.135-153
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    • 2020
  • There has been a sustained interest towards the non-contact structural displacement measurement by means of videogrammetric technique. On the way forward, one of the major concerns is the spurious image drift induced by temperature variation. This study therefore carries out an investigation into the temperature effect of videogrammetric technique, focusing on the exploration of the mechanism behind the temperature effect and the elimination of the temperature-caused measurement error. 2D videogrammetric measurement tests under monotonic or cyclic temperature variation are first performed. Features of measurement error and the casual relationship between temperature variation and measurement error are then studied. The variation of the temperature of digital camera is identified as the main cause of measurement error. An excellent linear relationship between them is revealed. After that, camera parameters are extracted from the mapping between world coordinates and pixels coordinates of the calibration targets. The coordinates of principle point and focal lengths show variations well correlated with temperature variation. The measurement error is thought to be an outcome mainly attributed to the variation of the coordinates of principle point. An approach for eliminating temperature-caused measurement error is finally proposed. Correlation models between camera parameters and temperature are formulated. Thereby, camera parameters under different temperature conditions can be predicted and the camera projective matrix can be updated accordingly. By reconstructing the world coordinates with the updated camera projective matrix, the temperature-caused measurement error is eliminated. A satisfactory performance has been achieved by the proposed approach in eliminating the temperature-caused measurement error.