• Title/Summary/Keyword: Flexible glass

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Fabrication of Flexible Surface-enhanced Raman-Active Nanostructured Substrates Using Soft-Lithography

  • Park, Ji-Yun;Jang, Seok-Jin;Yeo, Jong-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.411-411
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    • 2012
  • Over the recent years, surface enhanced Raman spectroscopy (SERS) has dramatically grown as a label-free detecting technique with the high level of selectivity and sensitivity. Conventional SERS-active nanostructured layers have been deposited or patterned on rigid substrates such as silicon wafers and glass slides. Such devices fabricated on a flexible platform may offer additional functionalities and potential applications. For example, flexible SERS-active substrates can be integrated into microfluidic diagnostic devices with round-shaped micro-channel, which has large surface area compared to the area of flat SERS-active substrates so that we may anticipate high sensitivity in a conformable device form. We demonstrate fabrication of flexible SERS-active nanostructured substrates based on soft-lithography for simple, low-cost processing. The SERS-active nanostructured substrates are fabricated using conventional Si fabrication process and inkjet printing methods. A Si mold is patterned by photolithography with an average height of 700 nm and an average pitch of 200 nm. Polydimethylsiloxane (PDMS), a mixture of Sylgard 184 elastomer and curing agnet (wt/wt = 10:1), is poured onto the mold that is coated with trichlorosilane for separating the PDMS easily from the mold. Then, the nano-pattern is transferred to the thin PDMS substrates. The soft lithographic methods enable the SERS-active nanostructured substrates to be repeatedly replicated. Silver layer is physically deposited on the PDMS. Then, gold nanoparticle (AuNP) inks are applied on the nanostructured PDMS using inkjet printer (Dimatix DMP 2831) to deposit AuNPs on the substrates. The characteristics of SERS-active substrates are measured; topology is provided by atomic force microscope (AFM, Park Systems XE-100) and Raman spectra are collected by Raman spectroscopy (Horiba LabRAM ARAMIS Spectrometer). We anticipate that the results may open up various possibilities of applying flexible platform to highly sensitive Raman detection.

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Metal Grids Embedded Transparent Conductive Electrode with Flexibility and Its Applications

  • Jung, Sunghoon;Lee, Seunghun;Kim, Jong-Kuk;Kang, Jae-Wook;Kim, Do-Geun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.314-314
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    • 2013
  • Recently, flexibility is one of the hottest issues in the field of electronic devices. For flexible displays or solar cells, a development of transparent conductive electrodes (TCEs) with flexibility, bendability and foldability is an essential element. Hundreds of nanometers indium-tin-oxide (ITO) films have been widely used and commercialized as a transparent electrode, but their brittleness make them difficulty to apply flexible electronics. Many researchers have been studying for flexible TCEs such as a few layers of graphene sheets, carbon nanotube networks, conductive polymer films and combinations among them. Although gained flexibility, their transmittance and resistivity have not reached those of commercialized ITO films. Metal grids electrode cannot act as TCEs only, but they can be used to lower the resistance of TCEs with few losses of transmittance. However, the possibility of device shortage will be rise at the devices with metal grids because a surface flatness of TCEs may be deteriorated when metal grids are introduced using conventional methods. In our research, we have developed hybrid TCEs, which combined tens of nanometers ITO film and metal grids which are embedded in flexible substrate. They show $13{\Omega}$/${\Box}f$ sheet resistance with 94% of transmittance. Moreover, the sheet resistance was maintained up to 1 mm of bending radius. Also, we have verified that flexible organic light emitting diodes and organic solar cells with the TCEs showed similar performances compared to commercial ITO (on glass substrate) devices.

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Study on the thermal expansion properties of Fe alloys for the flexible substrate of CIS thin film solar cell (CIS 박막태양전지용 철계 연성 기판재의 열팽창 특성 연구)

  • Han, Yoonho;Lim, Minsu;Song, Youngsik;Cho, Yongki;Yim, Taihong
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.44.2-44.2
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    • 2010
  • 차세대 태양전지로써 플렉서블 태양전지에 대한 연구가 활발하다. CIS 박막태양전지의 경우도 Glass base 태양전지 시스템 연구와 더불어 금속과 플라스틱 등 연성 기판재를 이용한 전지 시스템에 관한 연구가 진행 되고 있다. 그러나 태양전지의 핵심 부자재라고 할 수 있는 기판재에 대한 체계적인 연구는 미흡한 실정이다. 특히 플렉서블 박막태양전지용 기판재와 그 위에 적층되어 태양전지를 구성하는 박막 소재의 열팽창 거동들 사이에 차이가 있어 태양전지 시스템에 결함을 야기할 수 있다. 본 연구에서는 플렉서블 태양전지용으로 적용되거나 연구되고 있는 SUS 300 계열과 SUS 400번 계열을 중심으로 철계 연성 기판재의 열팽창 거동을 비교 분석하였다. 그리고 CIS 박막태양전지 제조 공정인 고온 박막 생성 공정의 열분석을 통해 기판재의 성능을 평가 하였다.

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플라즈마 처리를 통한 Flexible ZnO nanowire 발전기 제작 및 효율향상 연구

  • Park, Seong-Hwak;Lee, Gyeong-Il;Lee, Cheol-Seung;Park, Ji-Seon;Kim, Seon-Min;Kim, Seong-Hyeon;Jo, Jin-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.424-424
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    • 2012
  • ZnO는 수열합성법을 통해 저온에서 단결정으로 성장할 수 있기 때문에 광전소자 및 압전소자로 응용되고 있으나, 성장된 ZnO nanowire 내부 산소 결함 및 표면에 OH기의 흡착에 의해 소자특성 저하를 발생시킨다. 본 연구에서는 ZnO의 결함의 최소화를 위해 Glass 기판에 수열합성법으로 성장된 ZnO nanowire를 ICP 플라즈마 장치를 이용하여 O2 25 sccm, Base Pressure $1.5{{\times}}10^{-3}$ Torr을 기준으로 파워와 시간에 따라 표면처리 하였다. 플라즈마 처리된 ZnO nanowire의 결함특성과 형상을 XPS와 FE-SEM를 통하여 분석하였으며, ZnO nanowire의 소자특성을 평가를 위해 Kapton Film/AZO/ZnO nanowire/PMMA/Au 구조의 발전기를 제작하였다. 150 W, 10 min에서 532.4 eV의 -OH결합이 최소화됨을 확인하였으며, 이를 이용하여 Flexible ZnO nanowire 발전기 제작 했을 경우 최대 Voltage 5 V, Current 156 nA 전기적 특성을 확인하였다.

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The Physical Properties and Dyeability of Poly(trimethylene terephthalate) Fibers (Poly(trimethylene terephthalate) 섬유의 물성과 염색성)

  • 윤석한;김태경;임용진;조규민
    • Textile Coloration and Finishing
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    • v.13 no.3
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    • pp.197-202
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    • 2001
  • The mechanical properties and dyeability of Poly(trimethylene terephthalate)(PTT) were investigated and compared to PET. Glass transition temperature of PTT was lower than that of PET, because amorphous region of PTT is mote flexible. n has smaller molecular and specific stress and larger strain than those of PET, due to the difference of molecular structure. Dyeing transition temperature of PTT was lower by $20^\circ{C}$ than that of PET. Because PTT has flexible chain and zigzag structure, dyeing Fate of PTT is faster than PET and dyeing of PTT is begun at lower temperature. As the hydrophobicity of disperse dyes increased, the ratio of equilibrium dye uptake on PTT to that on PET was increased.

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Flexible Display ; Low Temperature Processes for Plastic LCDs

  • Han, Jeong-In
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.185-189
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    • 2002
  • Flexible displays such as plastic based LCDs and organic light-emitting diodes for mobile communication devices have been researched and developed at KETI in KOREA since 1997. The Plastic film substrate has so poor thermal tolerance and non-rigidness that the fabrication of active devices and panel assembly have to perform at low temperature and pressure. In addition, high thermal expansion of the substrate is also a serious problem for reliable metallic film deposition. In this paper, we investigated particularly on the fundamental characteristics of various plastic substrates and then, suggested novel methods that improve the fabrication processes of plastic LCD panel. In order to maintain stable substrate surface and uniform cell gap during panel assembly, we utilized newly-invented iii and vacuum chuck. Electro-optical characteristics of fabricated plastic LCD are better than or equivalent to those of typical glass based LCDs though it is thinner, lighter-weight and more robust.

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Linux/RTAI-based Input Shaping Implementation for Suppressing Residual Vibrations (Linux/RTAI기반의 잔류진동 억제 입력성형 구현)

  • Woo, Kyo-Sik;Kim, Jin-Woo;Kang, Chul-Goo;Lee, Dong-Je;Park, Kyung-Hee;Kim, Hyung-Chul
    • The Journal of Korea Robotics Society
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    • v.4 no.3
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    • pp.250-256
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    • 2009
  • Suppressing residual vibrations of flexible materials cheaply is an important issue to increase productivity of automated factory using wafer or glass handling robots. In this paper, we present Linux/RTAI-based implementation of input shaping control for reducing residual vibrations of a mechanical system. Experimental results show that residual vibrations of the mechanical system are reduced up to 82% at a point-to-point linear motion.

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Growth of Aluminum Doped Zinc Oxide Films on Polymer Substrates for Flexible Display Applications

  • Lee, Jae-Hyeong;Lee, Jong-In
    • Journal of information and communication convergence engineering
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    • v.5 no.3
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    • pp.219-222
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    • 2007
  • Highly conductive and transparent aluminum doped ZnO thin films (AZO) films have been prepared by r.f. magnetron sputtering processes on poly carbonate (PC) and onto glass as reference. In addition, the electrical, optical properties of the films prepared at various sputtering powers were investigated. The XRD measurements revealed that all of the obtained films were polycrystalline with the hexagonal structure and had a preferred orientation with the c-axis perpendicular to the substrate. The ZnO:Al films were increasingly dark gray colored as the sputter power increased, resulting in the loss of transmittance. High quality films with the resistivity as low as $9.7{\times}10^{-4}\;{\Omega}-cm$ and transmittance over 90% have been obtained by suitably controlling the r.f. power.

Novel Backplane for AM-OLED Device

  • Sung, Myeon-Chang;Lee, Ho-Nyun;Kim, Chang Nam;Kang, Sun Kil;Kim, Do Youl;Kim, Seong-Joong;Kim, Sang-Kyoon;Kim, Sung-Kab;Kim, Hong-Gyu;Kim, Sung-Tae
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.133-136
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    • 2007
  • IGZO TFTs were fabricated by conventional photolithography and wet-etching processes on metal substrates for the flexible display. The characteristics of TFTs on metal substrates were comparable to those of TFTs on glass substrates. Moreover, AM-OLED panels based on IGZO TFT arrays on metal substrates were successfully driven, for the first time.

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Electric Circuit Fabrication Technology using Conductive Ink and Direct Printing

  • Jeong, Jae-U;Kim, Yong-Sik;Yun, Gwan-Su
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.12.1-12.1
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    • 2009
  • For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

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