• Ceramist
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• v.21 no.1
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• pp.4-11
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• 2018

Display is an essence in human-machine communication interface. As mobile environment such as internet of things (IOT) and Artificial Intelligence (AI) progress, importance of display increases. Here we review research trend in flexible organic light emitting displays (OLEDs). This review article covers all the components consisting of flexible OELDs and shows direction of the recent research. This paper would be helpful for readers and researchers working in this field and provide perspective for future displays.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.168-169
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• 2007

Organic transistors are promising in the future development of active devices for flexible, low-cost and large-area photoelectric devices. However, conventional organic field-effect transistors have lowspeed, low-power, and relatively high operational voltage. Vertical type transistors show high-speed and high-current characteristics and are suitable for driver elements of flexible displays.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.305-308
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• 2006

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED $(FOLED^{TM})$ display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies. The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED $(PHOLED^{TM})$ device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.51.1-51.1
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• 2015

OLED commercialization has been led in mobile market by Samsung since 2007, but more suppliers in Korea, China and Japan are joining the market. However, there remain some challenges in expanding its application to large size TV and flexible displays, especially in competition with dominant LCD products. This talk will discuss future prospects of the OLED technology after brief review of the progress.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.578-578
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• 2012

Graphene, a flat one-atom-thick two-dimensional layer of carbon atoms, is considered to be a promising candidate for nanoelectronics due to its exceptional electronic properties. Most of all, future nanoelectronics such as flexible displays and artificial electronic skins require low cost manufacturing process on flexible substrate to be integrated with high resolutions on large area. The solution based printing process can be applicable on plastic substrate at low temperature and also adequate for fabrication of electronics on large-area. The combination of printed electronics and graphene has allowed for the development of a variety of flexible electronic devices. As the first step of the study, we prepared the gate electrodes by printing onto the gate dielectric layer on PET substrate. We showed the performance of graphene field-effect transistor with electrohydrodynamic (EHD) inkjet-printed Ag gate electrodes.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.3.2-3.2
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• 2009

Development of printed electronics, which is occasionally referred to as 'flexible' or 'polymer' electronics, has attracted considerable world wide attention in recent years. Printed (or flexible) electronics is currently expected to represent a new form of electronics and open up wide ranging applications in displays, electron devices for medical use, sensors, and other areas. This presentation aims to provide a strategy for scalable and viable paths to accomplish flexible, printable, large area circuits displaying high performance. Novel approaches evolving from system on package (SoP) to system on flex (SoF) technology will allow the integration of heterogeneous materials platforms into a system which is needed to enhance the functionality of the system. The talk also includes speculations about areas on which future advances in printed electronics could have a substantial impact along with a brief introduction of the Korea Printed Electronics Association (KoPEA).

• Current Optics and Photonics
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• v.3 no.1
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• pp.66-71
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• 2019

Application of liquid crystal (LC) materials to a flexible device is challenging because the bending of LC displays easily causes change in thickness of the LC layer and orientation of LCs, resulting in deterioration in a displayed image quality. In this work, we demonstrate a prototype device combining a flexible polymer substrate and an optically isotropic LC-polymer composite in which the device consists of interdigitated in-plane switching electrodes deposited on a flexible colorless polyimide substrate and the composite consisting of nano-sized LC droplets in a polymer matrix. The device can keep good electro-optic characteristics even when it is in a bending state because the LC orientation is not disturbed in both voltage-off and -on states. The proposed device shows a high potential to be applicable for future flexible LC devices.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.5
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• pp.533-538
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• 2011

A plastic-compatible low-temperature metal deposition and patterning process is essential for the fabrication of flexible electronics because they are usually built on a heat-sensitive flexible substrate, for example plastic, fabric, paper, or metal foil. There is considerable interest in solution-processible metal nanoparticle ink deposition and patterning by selective laser sintering. It provides flexible electronics fabrication without the use of conventional photolithography or vacuum deposition techniques. We summarize our recent progress on the selective laser sintering of metals and metal oxide nanoparticles on a polymer substrate to realize flexible electronics such as flexible displays and flexible solar cells. Future research directions are also discussed.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.10-17
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• 2024

This paper discusses Chip On Film (COF) technology, one of the key technologies in flexible packaging to enable miniaturization and flexibility of electronic devices. COF attaches Display Driver IC (DDI) directly to a flexible polyimide substrate, enabling lightweight and reduced thickness for high-resolution displays. COF technology is primarily used in high-performance display panels, such as organic light emitting diode (OLED) displays, and plays a key role in portable electronic devices, such as smartphones and wearable devices. This study analyzes the key components of COF and advances in bonding technology. In particular, the introduction of modern bonding techniques, such as thermo-compression bonding and thermo-sonic bonding, has led to significant improvements in bonding reliability and electrical performance. These bonding techniques enhance the mechanical stability of COF packages while maintaining high electrical connectivity in fine-pitch structures. This paper will discuss the future development of COF bonding technology and its challenges and explore its potential as a next-generation display and advanced packaging technology.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.166-168
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• 2009

We proposed a transflective liquid crystal display (LCD) with high aperture ratio using an electrophoretic particle layer (EPL). The transflective LCD consisted of the stacked LC layer and EPL which was acted as a switchable mirror under in-plane electrode structure. Without separation of reflective part and transmissive part in one pixel, a modeselectable display device can be obtained.