• Title/Summary/Keyword: Fire-resistive materials

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Physical Properties of Light Weight Foamed Glass Using Waste Glass Powder and Fly Ash (폐유리분말과 플라이애시를 사용한 경량 발포소재의 물리적 특성)

  • Song, Hun;Shin, Hyeon-Uk
    • Journal of the Korean Recycled Construction Resources Institute
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    • v.3 no.4
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    • pp.328-334
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    • 2015
  • Building insulation materials use for the purpose of energy saving. Insulation materials can be classified inorganic and organic insulation materials. Inorganic insulation is used for fire resistive performance parts and organic insulation is used for thermal performance parts. Meanwhile, organic insulation is due to toxic gas emission in fire. Inorganic insulation is too heavy and low thermal performance than organic materials. This study is focused on evaluation of the physical properties of inorganic foam material using industrial by-products such as waste glass powder and fly ash. From the test result, inorganic foam materials for the applicability of fire-resistance and insulation light-weight materials.

Preparation and Characterization of Fire-Resistant Silicone Polymer Composites Containing Inorganic Flame Retardants (무기계 난연제를 첨가한 실리콘 고분자 내화재료의 제조 및 특성분석)

  • Yoon, Chang-Rok;Lee, Jong-Hyeok;Bang, Dae-Suk;Won, Jong-Pil;Jang, Il-Young;Park, Woo-Young
    • Elastomers and Composites
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    • v.45 no.2
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    • pp.87-93
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    • 2010
  • The fire resistive materials are used to resist from fire accidents in the building. In this study silicone rubber/inorganic flame retardant composites were prepared by mechanical stirring method, using aluminium trihydroxide(ATH, $Al(OH)_3$) and magnesium dihydroxide(MDH, $Mg(OH)_2$) as synergistic fire-resistant additives. The thermal properties of the fire resistant composites were characterized by thermogravimetric analysis(TGA). In addition, rheological properties were observed by rheometer and fire-resistant properties were tested by gas torch. Through this study, we realized that the silicone rubber containing ATH, MDH increased the performance of fire-resistance.

AN INTRODUCTION TO SEMICONDUCTOR INITIATION OF ELECTROEXPLOSIVE DEVICES

  • Willis K. E.;Whang, D. S.;Chang, S. T.
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 1994.11a
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    • pp.21-26
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    • 1994
  • Conventional electroexplosive devices (EED) commonly use a very small metal bridgewire to ignite explosive materials i.e. pyrotechnics, primary and secondary explosives. The use of semiconductor devices to replace “hot-wire” resistance heating elements in automotive safety systems pyrotechnic devices has been under development for several years. In a typical 1 amp/1 watt electroexplosive devices, ignition takes place a few milliseconds after a current pulse of at least 25 mJ is applied to the bridgewire. In contrast, as for a SCB devices, ignition takes place in a few tens of microseconds and only require approximately one-tenth the input energy of a conventional electroexplosive devices. Typically, when SCB device is driven by a short (20 $\mu\textrm{s}$), low energy pulse (less than 5 mJ), the SCB produces a hot plasma that ignites explosive materials. The advantages and disadvantages of this technology are strongly dependent upon the particular technology selected. To date, three distinct technologies have evolved, each of which utilizes a hot, silicon plasma as the pyrotechnic initiation element. These technologies are 1.) Heavily doped silicon as the resistive heating initiation mechanism, 2.) Tungsten enhanced silicon which utilizes a chemically vapor deposited layer of tungsten as the initiation element, and 3.) a junction diode, fabricated with standard CMOS processes, which creates the initial thermal environment by avalanche breakdown of the diode. This paper describes the three technologies, discusses the advantages and disadvantages of each as they apply to electroexplosive devises, and recommends a methodology for selection of the best device for a particular system environment. The important parameters in this analysis are: All-Fire energy, All-Fire voltage, response time, ease of integration with other semiconductor devices, cost (overall system cost), and reliability. The potential for significant cost savings by integrating several safety functions into the initiator makes this technology worthy of attention by the safety system designer.

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Experimental Study on the Thermal Properties of Materials for Fire Resistive Ceiling Structure at High Temperature (내화천장구조 재료의 고온 열특성 실험 연구)

  • Yeo, In-Hwan;Cho, Bum-Yean;Min, Byung-Yeol;Kim, Heung-Youl
    • Proceedings of the Korea Institute of Fire Science and Engineering Conference
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    • 2011.04a
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    • pp.334-339
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    • 2011
  • 이 연구에서는 내화천장구조 재료의 고온 열특성을 파악하여, 건축물 화재시 천장구조에 대한 보다 정확한 화재성상예측을 위한 실험적 자료로 제시하고자 한다. 건축물의 화재성상 예측은 내화설계 시 반드시 필요하며, 화재성상예측을 위해서는 화재하중, 작용외력, 안전계수 및 설계용 정수의 합리적인 설정이 중요하다. 화재하중 및 작용외력 등은 건축물의 부재가 지니는 하중조건에 대한 화재시의 부재 안정성 예측에 관계되는 부분이며, 설계 시 필요한 데이터 중 내화천장구조 재료의 고온 열특성 값은 화재발생 구획의 화재온도가 주요 구조부재에 전달되는 정도를 예측할 수 있는 인자로 볼 수 있다. 따라서 내화천장구조 재료의 고온 열특성 값 설정은 화재발생 공간의 온도범위($20{\sim}1000^{\circ}C$)에 걸쳐 평가 및 분석되어야만 정확하고 신뢰성 있는 화재발생 예상 공간의 부재 온도 및 안전성 분석이 가능하다. 이에 국내 건축구조물에 사용되고 있는 대표적인 내화피복 재료인 방화석고보드, 텍스, 암면에 대해서 $20^{\circ}C{\sim}900^{\circ}C$까지의 열전도율을 측정하였다. 실험결과 방화석고보드와 텍스의 경우 약 0.15 W/m K까지 일정하게 증가하였다. 암면의 경우 약 $700^{\circ}C$까지는 방화석고보드나 텍스에 비해 열전도율이 낮게 나타났지만, $800^{\circ}C$ 지점부터 용융 및 탄화가 진행되면서 열전도율이 급격히 상승하는 것으로 나타났다.

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