• Journal of Pharmaceutical Investigation
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• v.37 no.3
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• pp.137-148
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• 2007

Using a strain-controlled rheometer [Rheometrics Dynamic Analyzer (RDA II)], the steady shear flow properties of a semi-solid ointment base (vaseline) have been measured over a wide range of shear rates at temperature range of $25{\sim}60^{\circ}C$. In this article, the steady shear flow properties (shear stress, steady shear viscosity and yield stress) were reported from the experimentally obtained data and the effects of shear rate as well as temperature on these properties were discussed in detail. In addition, several inelastic-viscoplastic flow models including a yield stress parameter were employed to make a quantitative evaluation of the steady shear flow behavior, and then the applicability of these models was examined by calculating the various material parameters (yield stress, consistency index and flow behavior index). Main findings obtained from this study can be summarized as follows : (1) At temperature range lower than $40^{\circ}C$, vaseline is regarded as a viscoplastic material having a finite magnitude of yield stress and its flow behavior beyond a yield stress shows a shear-thinning (or pseudo-plastic) feature, indicating a decrease in steady shear viscosity as an increase in shear rate. At this temperature range, the flow curve of vaseline has two inflection points and the first inflection point occurring at relatively lower shear rate corresponds to a static yield stress. The static yield stress of vaseline is decreased with increasing temperature and takes place at a lower shear rate, due to a progressive breakdown of three dimensional network structure. (2) At temperature range higher than $45^{\circ}C$, vaseline becomes a viscous liquid with no yield stress and its flow character exhibits a Newtonian behavior, demonstrating a constant steady shear viscosity regardless of an increase in shear rate. With increasing temperature, vaseline begins to show a Newtonian behavior at a lower shear rate range, indicating that the microcrystalline structure is completely destroyed due to a synergic effect of high temperature and shear deformation. (3) Over a whole range of temperatures tested, the Herschel-Bulkley, Mizrahi-Berk, and Heinz-Casson models are all applicable and have an almostly equivalent ability to quantitatively describe the steady shear flow behavior of vaseline, whereas the Bingham, Casson,and Vocadlo models do not give a good ability.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.123-131
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• 2018

This study analyzed the collapse course of a mud stone cut slope during the construction of a express and suggested a countermeasure. Experiments were carried out on bedrock mudstone to investigate the engineering characteristics and the slope stability analysis at the time the design was reviewed. In addition, stability analysis, considering the strength softening characteristics of the slope due to the Swelling-Slaking phenomenon, was also performed. As a result of the Swelling-Slaking test, the slake durability was Low-Medium, and the swell potential was Very Low. A review of the stability analysis performed at the time of the design showed different results from the actual results because LEM analysis had been performed without considering the engineering characteristics of mudstone. As a result of additional stability analysis considering the strength softening characteristics, the slope collapse point and the maximum shear strain point of the stability analysis were the same and the standard safety factor was not satisfied. As a countermeasure, a slope mitigation method was found to be most appropriate. The mitigation slope was calculated by Finite element Analysis. A comparison with BIPS to determine the applicability of a mitigation slope revealed most of the unconsolidated mudstone.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Journal of the Korea Concrete Institute
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• v.19 no.2
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• pp.241-250
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• 2007

In case of retrofitting a concrete structure subjected to blast load by using retrofit materials such as FRP (fiber-reinforced polymer), appropriate ductility as well as raising stiffness must be obtained. But the previous approximate and simplified models, which have been generally used in the design and analysis of structures subjected to blast load, cannot accurately consider effects on retrofit materials. Problems on the accuracy and reliability of analysis results have also been pointed out. In addition, as the response of concrete and reinforcement on dynamic load is different from that on static load, it is not appropriate to use material properties defined in the previous static or quasi-static conditions to in calculating the response on the blast load. In this study, therefore, an accurate HFPB (high fidelity physics based) finite element analysis technique, which includes material models considering strength increase, and strain rate effect on blast load with very fast loading velocity, has been suggested using LS-DYNA, an explicit analysis program. Through the suggested analysis technique, the behavior on the blast load of retrofitted concrete walls using CFRP (carbon fiber-reinforced polymer) and GFRP (glass fiber-reinforced polymer) have been analyzed, and the retrofit capacity analysis has also been carried out by comparing with the analysis results of a wall without retrofit. As a result of the analysis, the retrofit capacity showing an approximate $26{\sim}28%$ reduction of maximum deflection, according to the retrofit, was confirmed, and it is judged ate suggested analysis technique can be effectively applicable in evaluating effectiveness of retrofit materials and techniques.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.37-45
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• 2008

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at $250^{\circ}C\;and\;280^{\circ}C$, bump contact resistances were almost same regardless of number of reflows and reflow temperature. In the high temperature storage test, there was no bump contact resistance change at $125^{\circ}C$ up to 2000 hours. However, bump contact resistances slightly increased at $150^{\circ}C$ due to Kirkendall voids formation. In the electromigration test, Cu/SnAg double-bump flip chip assemblies showed no electromigration until about 600 hours due to reduced local current density. Finally, in the thermal cycling test, thermal cycling failure mainly occurred at Si chip/Cu column interface which was found out the highest stress concentration site in the finite element analysis. As a result, Al pad was displaced out under thermal cycling. This failure mode was caused by normal compressive strain acting Cu column bumps along perpendicular direction of a Si chip.

• Composites Research
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• v.29 no.2
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• pp.53-59
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• 2016

Aircraft wing structure is used as a fuel tank containing the fluid. Fuel tank and joint parts are consists of composite structure. Hydrodynamic Ram(HRAM) effect occurs when the high speed object pass through the aircraft wing or explosion and the high pressure are generated in the fuel tank by HRAM effect. High pressure can cause failure of the fuel tank and the joint parts as well as the aircraft wing structure. To ensure the aircraft survivability design, we shall examine the behavior of the joint parts in HRAM effect. In this study, static tensile tests were conducted on four kind of the composite T-Joints. The failure behavior of the composite T-joint was examined by strain gauges and high speed camera. We examine the validity of the Finite Element Modeling by comparing the results of FEA and static tensile tests. The failure stresses and failure pressure of the composite T-Joint were calculated by FEA.

• Korean Journal of Agricultural Science
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• v.23 no.1
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• pp.25-38
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• 1996

To investigate the stability problem of irrigation-drainage channel excavation slope on soft ground, analyzed the behavior of the soft ground with excavation slope by the limit equilibrium method and the finite element method, and compared with field tests. The results of this study were summarized as follows; 1. When rapid drawdown the water level, the crack was occurred by the effect of the excess pore water pressure, and the pore water pressure was decreased slowly. 2. As the width of excavation was larger, the crack width was larger. And, excavated depth was deeper, the progressive failure was appeared. 3. When the soft ground excavation was small-scale, the minimum safety factor was more effected by cohesion(1.0, 1.5, 2.0, 2.5, 3.0) than excavated slope inclination(1:l, 1:1.5, 1:2). 4. As excavation was progressed, the settlement occurred on the top-slope due to plastic domain, and heaving was occurred at the bottom of excavation. 5. The maximum shear stress was appeared greatly as the base part of slope went down. Because of the increase of the maximum shear stress, tension area occurred and local failure possibility was increased. 6. As the excavation depth was increased, the maximum shear strain was appeared greatly at the base of slope and distribution pattern was concentrated beneath the middle of slope.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.22 no.5
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• pp.463-474
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• 2009

Double symmetric patch repair of existing structures always causes membrane action only, however, in many cases this technique is not practical. On the other hand, the bending stiffness of the patch and the skin increases as tensile loading is increased and affects the bending deformation significantly in the case of single-sided patch repair. In this study, the p-convergent full layerwise model has been proposed to determine the stress concentration factor in the vicinity of a circular hole as well as across the thickness of plates with single-sided patch repair. In assumed displacement field, the strain-displacement relations and 3-D constitutive equations of a layer are obtained by the combination of 2-D and 3-D hierarchical shape functions. The transfinite mapping technique has been used to represent a circular boundary and Gauss-Lobatto numerical integration is implemented in order to directly obtain stresses occurred at the nodal points of each layer without other extrapolation techniques. The accuracy and simplicity of the present model are verified with comparison of the previous results in literatures using experiment and conventional 3-D finite element. Also, the bending effect has been investigated with various patch types like square, circular and annular shape.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.3
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• pp.89-94
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• 2019

Among the many packaging materials used in cushion packaging, there is a lack of optimum design for the tray cup pad used in fruit packaging for export and domestic distribution. It causes over-packaging due to excessive material input, and this could be solved by applying various parameters needed to optimize the design of the tray cup pad considering the packaging material and the quantity of fruits in the box. In the case of a tray cup for fruits, the economic efficiency of material and thickness should be considered. Therefore, it is possible to design a tray cup pad depending on the packaging material used by applying appropriate design parameters. The static and dynamic characteristics of the materials used for packaging of pears were analyzed by using the FEM (finite element Method) simulation technique to derive the optimal design parameters. And by applying the appropriate design parameters considering the quantity of fruit and distribution environment, it is possible to design an appropriate fruit tray cup pad. In this study, as a result of simulating the contact stresses between the fruit and the tray cup for the PP, PE, and PS materials used in the fruit tray cup, the material with the lowest contact stress was PP and the value was found to be 398 Pa. The contact displacement between fruit and tray cup using this material was about 0.0463 mm, which was the lowest value compared with other materials. Also the resonance frequency band of tray cup made of PP material was below 36.81 Hz, and the strain energy was below 12.20 J. The resonant frequency band of the pear is more than 80 Hz and it could be applied to all the tray cup materials as compared with the resonance band of 38.81 Hz or less which is the resonance band of all tray cup pads for packaging. Finally, PP is the most suitable material for the tray cup pad.

• Journal of the Korean Geotechnical Society
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• v.19 no.4
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• pp.145-153
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• 2003

The resonant column testing determines the shear modulus and material damping factor dependent on the shear strain magnitude, based on the wave-propagation theory. The determination of the dynamic soil properties requires the theoretical formulation of the dynamic behavior of the resonant column testing system. One of the theoretical formulations is the use of the wave equation for the soil specimen in the resonant column testing device. Wood, Richart and Hall derived the wave equation by assuming the linear elastic soil, and didn't take the material damping into consideration. Hardin incorporated the viscoelastic damping of soil in the wave equation, but he had to assume the material damping factor for the determination of the shear modulus. For the better theoretical formulation of the resonant column testing, this study derived a new wave equation to include the viscosity of soil, and proposed an approach for the solution. Also, in this study, the equation of motion for the testing system, which is another approach of the theoretical formulation of the resonant column testing, was also derived. The equation of motion leads to the better understanding of the resonant column testing, which includes the dynamic magnification factor and the phase angle of the response. For the verification of the proposed equation of motion for the resonant column testing, the finite element analysis was performed for the resonant column testing. The comparison of the dynamic magnification factors and the phase angles far the system response were performed.