• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.10
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• pp.1644-1652
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• 2003

The monitor product is packed by cushioning materials because the monitor can be broken during transportation. However, the addition of the cushioning material increased the volume of the product. Therefore, it is required that the usage of cushioning material be minimized. In practice, design engineers have followed the ad hoc design with experiences of predecessors. Automation of the design process is very important for the reduction of engineering cost, and can be achieved by an excellent design process and software development. According to Axiomatic design, a design flow is defined and a software system is developed for automated design. At first, a basic model is defined. A user can modify the model from menus and design is carried out according to the input from the user. Finite element models are automatically generated based on the design. A nonlinear finite element analysis program called LS/DYNA3D is linked for the impact analysis. The process of Design of Experiments using orthogonal array is installed to minimize the maximum acceleration in drop test. Therefore, a new design can be proposed by the system. The program is designed according to the Independence Axiom of Axiomatic design. FRs and DPs of the software system are defined and decomposed by zigzagging process. Independent modules can be generated by analysis of the full design matrix and each module is coded as class in Object Oriented Programming (OOP). Design results are discussed.

• Journal of the Korean Geotechnical Society
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• v.39 no.1
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• pp.27-38
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• 2023

In this study, the impact of pile tip geometry, including shape, size, and angle, on the drivability and stress concentration during pile driving was investigated using 3D printing technology and finite element numerical analysis. A series of field loading tests were conducted on a test pile with various pile tip conditions, including width, angle, and shape. The changes in settlement were quantified as a ratio to the settlement of a conventional pile tip case and large deformation finite element analysis was used to investigate the maximum stress on a pile tip and the location of possible damage during pile driving. The results showed that by modifying the shape, size, and angle of the pile tip, the drivability of the pile could be improved and the maximum stress concentration around the pile tip could be significantly reduced, thereby ensuring the structural integrity of the pile during pile driving.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.95-99
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• 2017

The recent development of core techniques in the IT industry can be summarized as a technical advancement for safety and convenience, and mechanical technology for being "eco-friendly" and lightweight. Under these circumstances, research of lightweight material has become attractive. In this study, CFRP (Carbon Fiber Reinforced Plastic) laminate specimens are subjected to a tensile test using the UTM(Universal Testing Machine, AG-IS 100 kN) to estimate their mechanical properties in terms of the Hole machining impact evaluation. The FEM (Finite Elements Method) analysis method is applied and the material properties obtained from basic experiments such as the Tensile test, the compressive test, and the shear test. CFRP materials properties from a previous study, as well as a finite element analysis program for Hole machining CFRP was compared with the experiments.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.24 no.2
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• pp.79-86
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• 2014

This paper describes an integrity evaluation method for emergency diesel generator(EDG) and rotor part of EDG. EDG is a very important equipment in the nuclear power plant(NPP). EDG supplies electricity to the safety-related equipments for the safety shut down of NPP in an emergency situation of earthquake. The safety of the rotor part of EDG is also important during seismic impact from earthquake. The finite element modelling of the EDG including rotor part was constructed. The modal analysis of EDG was firstly performed. The first natural frequency was calculated and revealed higher than the cutoff frequency of seismic spectrum. Then the stress analysis was done to compare with the allowable stress. The safety of the rotor part was investigated by the finite element analysis of the rotor and journal bearing interaction to find film thickness and critical speed. The seismic load was applied to rotor part in a manner that the load was a weighted static load. Analysis results showed that the maximum stress was within the range of allowable stress and the film thickness is larger than the permissible minimum thickness, and the critical speed was out of the operating speed. Hence, the structural and dynamic integrity of EDG could be confirmed by the numerical analysis method used in this paper. However, dynamic analysis of a rotating rotor and supporting bearing with the seismic impact needs to be investigated in a more rigorous method since the seismic load to the rotating part complicates the behavior of rotating system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.44-51
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• 2016

This paper presents the characteristics of the energy absorption in an expansion tube type impact absorber that is applied to a high weight drop tester and the use of a response surface methodology to predict the impact energy absorption. In order to identify the characteristics of the energy absorption, a set of finite element analysis was conducted with Abaqus Explicit. Moreover, the ISCD-II sampling method and a first order polynomial were used to build a response surface. As a result, we demonstrated that the impact energy could be controlled by four main design variables, namely an expansion pipe's thickness, inner radius, pressing die's expansion angle and expansion ratio. Additionally, we observed the relationship between the four main design variables and the impact energy absorbing time, displacement, and maximum impact force.

• Journal of the Society of Naval Architects of Korea
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• v.36 no.4
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• pp.77-86
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• 1999

The bow flare structure of a ship is designed considering wave impact loads largely caused by relative motion of the ship and wave at rough sea. Empirical design is still used because impact phenomenon and structural behaviour due to wave impact load can not examined accurately. The objective of this study is, as the first step, to predict wave impact loads giving the structural damages to the bow flare structure from the damage data inversely, using dynamic nonlinear finite element code LS/DYNA3D, and to perform various parametric studies of wave impact pressure curve for its characteristics, such as peak height, duration time, tail height, rise time, etc.. The followings were obtained from this study: Dynamic structural responses against wave impact loads are largely affected by impact pressure impulse whose amount during duration time until peak deformation is very important.

• Transactions of the Korean Society of Automotive Engineers
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• v.24 no.5
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• pp.566-574
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• 2016

Fiber metal laminates, which are hybrid materials consisting of metal sheets and composite layers, have contributed to aerospace and automotive industries due to their reduced weight and improved damage tolerance characteristics. In this study, the impact performance of the laminates, which are comprised of a self-reinforced polypropylene and two aluminum sheets, and the pure aluminum alloy sheet material were investigated experimentally via numerical simulation. In order to compare the impact performance, the laminates and aluminum alloy were examined by assessing the impact force, energy time histories, and specific energy absorption. ABAQUS is a commercial software that is used to simulate the actual drop-weight tests. Based on this study, it is noted that the impact performance of the laminates was superior to that of the aluminum alloy. In addition, a good agreement between the experimental and numerical results can be achieved when the impact force and energy time histories from the experiments and the numerical simulations are compared.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.2
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• pp.3-9
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• 2006

HSM(High-speed Machining) is widely used in rapid manufacturing of precision products and molds of various materials. Improvement in cutting efficiency is one of the important subjects in the HSM process. To analyse the dynamic behavior during a very short cutting time, the computational analysis code, LS-DYNA3D, was employed for the simulation of the mechanism of HSM for aluminium 7075. This cutting mechanism includes some difficult points in simulation, for example, material and geometrical non-linearity, high-speed dynamic impact, contact with friction, etc. In this paper, a finite element model considering the strain rate effect is proposed to predict the cutting phenomena such as chip deformation, strain and stress distributions, which will help us to design the HSM process.