• Transactions of Materials Processing
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• v.19 no.5
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• pp.320-324
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• 2010

Multi-Layer Ceramic Circuit(MLCC) in the face of thousands of fine pitch multi hole is processed. However, the fine pitch multi hole has a size of only a few micrometers. Therefore, in order to curtail the measurement time and reduce error, the image processing measurement method is required. So, we proposed an image processing measurement algorithm which is required to accurately measure the fine pitch multi hole. The proposed algorithm gets image of the fine pitch multi hole, extracts object from the image by morphological process, and extracts the parameters of its position and feature by edge detecting process. In addition, we have used the sub-pixel algorithm to improve accuracy. As a result, the proposed algorithm shows 97% test-retest measurement reliability within 2 ${\mu}m$. We found that the algorithm was wellsuited for measuring the fine pitch multi hole.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.5
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• pp.1147-1154
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• 1990

Micro-hole drilling by EDM and production of fine rods for the tool electrode or other purpose have become very important in industry. This paper suggests a new method for production of very fine rods by ultrasonic-assisted chemical machining and describes the machining characteristics of micro-hole drilling by EDM. For fine rods, copper wires of initial diameter of 250.mum are used and successfully machined into a diameter of less than 30.mum with good repeatability. The ultrasonic agitation not only accelerated the material removal rate uniformly, but also produced smooth surfaces of fine rods. To drill the micro-hole, kerosene and pure water is used as a dielectric. From the experiment, water is superior to kerosene with respect to surface roughness of inlet and outlet of hole and machined surface as well as electrode wear. However, due to the electrochemical reaction of water, small pits are remained on the workpiece surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.202-205
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• 2002

The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\Phi$ 50${\mu}{\textrm}{m}$ micro-drill which is coated with diamond is used for drilling of super micro-hole sues. For the machining of taper parts of entrance and exit, drill having $\Phi$ 9mm inclination angle 20$^{\circ}$ is used. This is useful for anti tool-breakage in drilling process. After micro-drilling, the polishing process by abrasive is carried out for increasing surface roughness.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.91-94
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• 2011

This paper presents light transmission efficiency by optical adhesive thickness between MLA and aperture layer and by aperture hole size. The gap between MLA and Aperture layer is adjusted by the shim. The more optical adhesive thickness increases, the better light transmission efficiency increases up to a point. After that, the light transmission efficiency decreases because stray lights cannot transmit through the aperture layer owing to cut-off by aperture layer. And as a result of light transmission efficiency with changing aperture hole size, the light transmission efficiency is proportional to area of aperture hole. The more specified process is made, the better data and sample will be got.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.786-790
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• 2016

Hole explosion behaviors were observed during drilling fine holes with laser beam on the LTCC green bar of $320{\mu}m$ thick after lamination of green sheets prepared by tape casting of thick film process. The incidence of these hole explosions was inversely proportional to hole sizes. The incidence of hole explosion was 20 % number of hole with the size of $60{\mu}m$ exploded for the UV radiation, while the explosion did not appear for hole sizes over $100{\mu}m$. To prevent hole explosion behavior during laser-drilling of fine holes, carbon black powder was added as an additive in the LTCC composition, which has superior thermal durability. As a consequence, hole explosion rate was suppressed to 0.8 % for the hole size of $50{\mu}m$ green sheet with the carbon black amount of 10 weight % and the laser power of 3 watt. Added carbon is thought to reduce the heat-affected region during laser drilling.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.161-166
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• 2003

The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\phi50\mu m$ micro-drill which is coated with diamond is used for drilling of super micro-hole sizes. For the machining of taper parts of entrance and exit, drill having $\phi50\mu\textrm{mm}$ inclination angle $20^{\circ}$and angle $30^{\circ}$ is used. This is useful for anti tool-breakage and excessive too-wear in drilling process. After micro-drilling, the polishing process by diamond abrasive and polishing wood s carried out for increasing surface roughness.

• Journal of the Society of Naval Architects of Korea
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• v.54 no.6
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• pp.476-484
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• 2017

The purpose of this paper is to verify the structural integrity of a region with numerous penetration-holes in offshore structures such as semi-submersible rig and FPSO. In order to effectively check the yielding and buckling strength of plate members with penetration-holes, a screening analysis program was developed with the FE analysis tool to generate fine meshed model using the theoretical and analysis methods. When a hole is appeared in the plate structure members, the flow of stress is altered such that concentrations of stress form near the hole. Stress concentrations are of concern during both preliminary and detail design and need to be addressed from the perspectives of strength. To configure the geometrical shape, very fine meshed FE analysis is needed as the most accurate method. However, this method is practically impossible to apply for the strength verifications for all perforated plates. In this paper, screening analysis method was introduced to reduce analysis tasks prior to detailed FE analysis. This method is applied to not only the peak stress calculation combined stress concentration factor with nominal stress but also nominal equivalent stress calculation considering cutout effects. The areas investigated by very fine meshed analysis were to be chosen through screening analysis without any reinforcements for penetration-holes. If screening analysis results did not satisfy the acceptance criteria, direct FE analysis method as the 2nd step approach were applied with one of the coarse meshed model considering hole or with the very fine meshed model considering the hole shape and size. In order to effectively perform the local fine meshed analysis, automatic model generating program was developed based on the MSC/PATRAN which is pre-post FE analysis program. Buckling strength was also evaluated by Common Structure Rule (CSR) adopted by IACS as the stress obtained from very fine meshed FE analysis. Due to development of the screening analysis program and automatic FE modeling program, it was able to reduce the design periods and structural analysis costs.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.160-163
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• 2004

The hub hole in a wheel of vehicles usually formed with hole expansion process. Formability of material, especially the hole expansion ratio, is important to produce a fine hub hole. The hub hole expansion process is different from general forming process or bore expansion process in the viewpoint of forming a thick plate. In the hole expansion process of the plate with a hole, as the hole being expanded, the crack is occurred to outward direction at the boundary of a hole. Therefore, it is need to apply the fracture criterion in the hub hole expansion process. In this paper, the hub hole expansion process is simulated with commercial elasto-plastic finite element code, LS-DYNA3D considering some ductile fracture criteria. Fracture mode and hole expansion ratio is compared with respect to the fracture criteria. Analysis results demonstrate that only the effective plastic strain is not adequate to predict the fracture mode in the hub hole. And the analysis results also indicate that the ductile fracture criteria properly predict the fracture mode but hole expansion ratio is different with the result of each other because of their different characteristics.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.36-40
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• 2013

Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.123-128
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• 2005

A novel tri-mode ultraprecision positioning system for machine tools and measuring machine is proposed. The basic coarse mode uses a Twist-roller Friction Drive (abbr. TFD), and controls several tens of millimeters of the machine-table travel with nanometer order of positioning resolution. The fine mode also utilizes the TFD with a fine adjusting mechanism. The resolution of the fine mode is in the range of sub-nanometer. For realizing picometer positioning, the ultra-fine mode is executed by using an active aerostatic guideway. On the bearing surface of this active guideway, several Active Inherent Restrictors (abbr. AIRs) are embedded for controlling the table position. An AIR unit consists of a piezoelectric actuator having a through hole, one end of the hole on the bearing surface acts as an inherent restrictor. Owing to the aerostatic mechanism of the AIR, the deformation of the piezoelectric actuator in the AIR unit causes much reduced table displacement. Such motion reduction is effective for ultraprecision positioning. Current positioning resolution of the ultra-fine mode is 50pm, however the final goal of the positioning resolution is expected to be in the order of picometer.