• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1461-1466
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• 2003

This paper presents the effects of the fin array and pitch on the frost layer growth of a heat exchanger. The numerical results are compared with experimental data of a cold plate to validate the present model, and agree well with experimental data within a maximum error of 8%. The characteristics of the frost formation on staggered fin array are somewhat different from those of in-line array. The frost layer at the first fin of the in-line array grows rapidly, compared to second fin, whereas the difference of the frost layer growth between the fins of the staggered array is small. For fin pitch below 10 mm, the frost layer growth of second fin in the staggered array is affected by that of first fin. The frost layer growth and heat transfer of single fin deteriorate with decreasing fin pitch regardless of fin array, however, the thermal performance of a heat exchanger, considering increase of heat surface area, becomes better.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.9
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• pp.711-717
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• 2003

This paper presents the effects of the fin array and pitch on the frost layer growth of a heat exchanger. The numerical results are compared with experimental data of a cold plate to validate the present model, and agree well with experimental data within a maximum error of 8%. The frost behaviors of the staggered fin array are somewhat different from those of in-line array. The frost layer formed on the first fin of the in-line array grows rapidly, compared to second fin, whereas the difference of the frost layer growth between the fins of the staggered array is small. For fin pitch below 10 m, the frost layer growth of second fin in the staggered array is affected by that of first fin. The thickness of the frost layer and heat transfer of single fin are reduced with decreasing fin pitch regardless of fin array. However, the thermal performance of a heat exchanger is enhanced due to the increase of heat transfer surface area.

• The KSFM Journal of Fluid Machinery
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• v.16 no.6
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• pp.40-47
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• 2013

In this paper, a numerical study was performed to investigate the performance characteristics of a pre-heater. The effects of fin pitch and fin array type(in-line, staggered, leaned array) were reported in terms of Colburn j-factor and Fanning friction factor f, as a function of Re. Three-dimensional numerical simulation has been performed by using flow analysis program, FLUENT 13.0. The results show that Colburn j-factor decreases with the decrease of fin pitch attached in the annular tube. But the fin pitch has little effect on f-factor. The staggered array and leaned array show improved heat transfer performance compared with in-line array, so that Colburn j-factor was increased. It also shows that the f-factor of leaned array is the highest in the studied range of Reynolds number.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.5
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.6
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• pp.440-447
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• 2001

This study investigate experimentally the effect of in height, thickness, and clearance on the boiling heat transfer. The heat surfaces having copper fin array is tested for pool boiling. The gas-liquid exchange interference is investigated based on fin array clearance. These test results can be applied to the design of tube bundle system. The fin height of 2 mm is found to be effective. Effects of heat transfer promotion reaches the highest level when the fin clearance is 0.5mm. Also, heat flux is increased when the fin thickness is smaller. But0.2 mm fin thickness is highly recommended.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• Journal of Institute of Convergence Technology
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• v.5 no.1
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• pp.27-31
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• 2015

A Pin-fin array is widely used to enhance the heat transfer in the internal cooling passage. The heat transfer distribution around the pin-fin is varied by the horseshoe vortex and flow separation. The difference of heat transfer coefficient induces the large thermal stress, which is one of the major reasons to break of hot components. So, it is required to enhance the heat transfer on the back side of pin-fin to solve the thermal stress problem. This study suggests the pin-fin with inclined jet hole and complex pin-fin/dimple array to enhance the heat transfer on the back side of pin-fin. The heat transfer coefficient is predicted by the numerical analysis, which is performed by CFX 14.0. The numerical results are obtained at Reynolds number, 10,000. The results show that the heat transfer on the back side of pin-fin is increased in both cases. Beside, the wake, which comes from dimple and jet, helps to develop the horseshoe vortex and increase the heat transfer on the next row pin-fin.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.1
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• pp.62-70
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• 2005

In this study, the air-side heat transfer coefficients of several types of evaporators in the household freezer/refrigerators are investigated. The types considered in this work are: discrete flat plate fin-and-tube type(in-lined tube array), continuous flat plate fin-and-tube type(staggered tube array), and spine fin-and-tube type(in-lined tube array). The heat transfer correlations obtained from this study for each heat exchangers could expect heat transfer coefficients less than $5\%$ of errors. The result indicates that the air-side heat transfer performance of spine fin-and-tube type evaporator shows the highest value under dry conditions, but discrete flat plate fin-and-tube type evaporator shows the highest value among these three evaporators under frosting conditions.