• 제목/요약/키워드: Film cracks

검색결과 169건 처리시간 0.023초

휴대폰 글라스 보호필름 자동 박리장치 개발에 관한 연구 (A Study on the Development of an Automatic Strip Machine for Removing Mobile Phone Glass Protective Films)

  • 최왕국;허장욱;김동욱
    • 한국기계가공학회지
    • /
    • 제15권6호
    • /
    • pp.9-15
    • /
    • 2016
  • Due to material-specific vulnerabilities, the surfaces of the liquid crystal glasses used in mobile phones can crack easily, with even the smallest cracks undergoing propagation. To protect the glass surfaces, films are attached to the surfaces during the mobile phone production process. However, after machining the liquid crystal, removal of the film on the liquid crystal surface using chemical and mechanical methods is required. In this research, a peeling apparatus was developed for removing the films attached to liquid crystal surfaces during the production process. Mechanical attachment and design automation through experimentation and finite element modelling were performed to confirm the validity of the design.

ATOS 80 고장력강의 용접 패스에 따른 용접부 방사선검사에 관한 연구 (A Study on the Radiograph Inspection of Specimen in Welding Pass Using ATOS 80 High-strength Steel)

  • 백정환;최병기
    • 한국생산제조학회지
    • /
    • 제21권6호
    • /
    • pp.915-919
    • /
    • 2012
  • In constructing all kinds of equipment and steel structure, parts with discontinuities such as weld defects formed in the welded structure can generate fatigue cracks that results in damage or accidents. In this study, weld zones are investigated with X-rays and the latent images are put on film. Weld zone defects can be verified by developing the film. As weld defects are investigated by radiographic testing and correlated with the welding condition, more appropriate welding conditions can be found. According to the result of X-ray radiographic inspection of butt welding ATOS 80 high-strength steel with a thickness of 12mm, the best conditions for welding without creating weld defects are 4 weld-passes, a protective gas of 20% $CO_2$ and 80% Ar, a protective gas flow of 20L/min, a welding current of 200A, an arc voltage of 24V, a welding speed of 14.4cm/min, a welding rod angle of $50^{\circ}$, a welding gap of 5 mm with a ceramic base, and sand pre-heating to $160^{\circ}$ Celsius prior to welding.

Corrosion Behavior and Oxide Film Formation of T91 Steel under Different Water Chemistry Operation Conditions

  • Zhang, D.Q.;Shi, C.;Li, J.;Gao, L.X.;Lee, K.Y.
    • Corrosion Science and Technology
    • /
    • 제16권1호
    • /
    • pp.8-14
    • /
    • 2017
  • The corrosion behavior of a ferritic/martensitic steel T91 exposed to an aqueous solution containing chloride and sulfate ions is investigated depending on the stimulated all-volatile treatment (AVT) and under oxygenated treatment (OT) conditions. The corrosion of T91 steel under OT condition is severe, while the corrosion under AVT condition is not. The co-existence of chloride and sulfate ions has antagonistic effect on the corrosion of T91 steel in both AVT and OT conditions. Unlike to corrosion resistance in the aqueous solution, OT pretreatment provides T91 steel lower oxidation-resistance than VAT pretreatment. From scanning electron microscopy/energy dispersive X-ray spectroscopy (SEM/EDS) and X-ray diffraction (XRD) analysis, the lower corrosion resistance in the aqueous solution by VAT conditions possibly is due to the formation of pits. In addition, the lower oxidation resistance of T91 steel pretreated by OT conditions is explained as follows: the cracks formed during the immersion under OT conditions accelerated peeling-off rate of the oxide film.

Fracture toughness of amorphus SiC thin films using nanoindentation and simulation

  • Mamun, M.A.;Elmustafa, A.A.
    • Advances in materials Research
    • /
    • 제9권1호
    • /
    • pp.49-62
    • /
    • 2020
  • Fracture toughness of SiC on Si thin films of thicknesses of 150, 750, and 1500 nm were measured using Agilent XP nanoindenter equipped with a Dynamic Control Module (DCM) in Load Control (LC) and Continuous Stiffness Method (CSM) protocols. The fracture toughness of the Si substrate is also measured. Nanovision images implied that indentations into the films and well deep into the Si caused cracks to initiate at the Si substrate and propagate upward to the films. The composite fracture toughness of the SiC/Si was measured and the fracture toughness of the SiC films was determined based on models that estimate film properties from substrate properties. The composite hardness and modulus of the SiC films were measured as well. For the DCM, the hardness decreases from an average of 35 GPa to an average of 13 GPa as the film thick increases from 150 nm to 1500 nm. The hardness and moduli of the films depict the hardness and modulus of Si at deep indents of 12 and 200 GPa respectively, which correlate well with literature hardness and modulus values of Si. The fracture toughness values of the films were reported as 3.2 MPa√m.

A Study on Electric Properties of Polyamide Film due to Temperature Change

  • Lee, Sung Ill
    • Elastomers and Composites
    • /
    • 제54권1호
    • /
    • pp.1-6
    • /
    • 2019
  • In this study, we measured the leakage current at $30{\sim}80^{\circ}C$ and $90{\sim}170^{\circ}C$ under a voltage of 200~980 V applied to samples (ordinary temperature) and polyamide film specimens degraded at $170^{\circ}C$ for 20 minute respectively. After the specimen was degraded at $130^{\circ}C$ and $50^{\circ}C$, a voltage of 200 to 800 V was applied for 10 to 60 minutes. The measurement of the leakage current resulted in the following conclusions. In the case of using Al and Cu as the main electrode, it was confirmed that the leakage current also increased in high temperatures as the voltage increased. Regardless of the type of main electrode, when the temperature was constant at $130^{\circ}C$ and $50^{\circ}C$, the leakage current increased as the voltage increased, and gradually decreased with time. As a result of the FTIR measurement, the main absorption of the infrared absorption spectrum was C=O at about $1650cm^{-1}$ and N-H diagonal vibration occurred at around $1550cm^{-1}$. There was no change in the material, so no effect of temperature was observed. By the results of SEM measurements, as the temperature of degradation increases, cracks in the specimen disappear. This may be because the amide bond (-CO-NH-) is absorbed by the material.

저온 소성용 SiO$_2$-TiO$_2$-Bi$_2$O$_3$-RO계(RO :BaO-CaO-SrO) Glass/ceramic 유전체 재료의 B$_2$O$_3$첨가에 따른 Ag 후막과의 동시 소결시 정합성 밀 유전 특성에 관한 연구 (A Study on the Co-firing Compatibility with Ag-thick film and Dielectric Characteristics of Low Temperature Sinterable SiO$_2$-TiO$_2$-Bi$_2$O$_3$-RO system (RO :BaO-CaO-SrO) Glass/Ceramic Dielectric Material with the Addition of B$_2$O$_3$)

  • 윤장석;이인규;유찬세;이우성;강남기
    • 마이크로전자및패키징학회지
    • /
    • 제6권3호
    • /
    • pp.37-43
    • /
    • 1999
  • 고주파에서 사용하기 위한 $SiO_2-TiO_2-Bi_2O_3$-RO계(RO:BaO-CaO-SrO)를 주성분으로 하는 결정화 유리와 세라믹 충진재로서 $Al_2O_3$를 혼합하여 제조한 저온 소성용 Glass/Ceramic 유전체 모재와 Ag-thick film의 동시 소결시 발생할 수 있는 소결 부정합과 그 해소 방안을 연구하였다. 적층된 Glass/Ceramic 유전체 sheet와 Ag-thick film의 동시 소결시에 소결체는 sheet와 film의 densification rate 차 등에 의해 큰 camber 현상과 그로 인해 Ag-film에 crack이 발생하였다. 이를 교정하기 위해 유리 성분과 $Al_2O_3$성분이 혼합된 유전체 분말에 $B_2O_3$를 6, 8, 10, 12, 14 vol% 첨가한 결과를 보면 $B_2O_3$첨가량이 증가함에 따라 소결체의 camber 현상은 점점 크게 줄어들었으며 14 vol% 첨가된 경우에는 거의 관찰되지 않았다. 또한 $BaO_3$첨가량이 증가함에 따라 유전율($varepsilon_{r}$)은 점점 감소하였고 Q$\times$f 값은 크게 증가하는 경향을 나타내었으며 $\tau_{f}$ 값은 양(+)의 값으로 점점 크게 변하였다.

  • PDF

박막형 태양전지 응용을 위한 ITZO 박막의 기판 종류에 따른 특성 분석 (Characteristics of ITZO Thin Films According to Substrate Types for Thin Film Solar Cells)

  • 정양희;강성준
    • 한국전자통신학회논문지
    • /
    • 제16권6호
    • /
    • pp.1095-1100
    • /
    • 2021
  • 본 연구에서는 고주파 마그네트론 스퍼터링 법으로 유리, 사파이어, PEN 기판 위에 ITZO 박막을 증착하여 전기적 및 광학적 특성을 조사하였다. 유리와 사파이어 기판위에 증착한 ITZO 박막의 비저항은 각각 3.08×10-4 과 3.21×10-4 Ω-cm로 큰 차이를 보이지 않은 반면 PEN 기판위에 증착한 ITZO 박막의 비저항은 7.36×10-4 Ω-cm로 다소 큰 값이 측정되었다. 기판의 종류와 무관하게 ITZO 박막의 평균 투과도의 차이는 크지 않았다. 유리 기판위에 증착한 ITZO 박막의 비정질 실리콘 박막 태양전지의 흡수영역에서의 평균 투과도와 P3HT : PCBM 유기물 활성층의 흡수영역에서의 평균 투과도를 이용하여 구한 재료평가지수는 각각 10.52와 9.28×10-3 Ω-1로 가장 우수한 값을 나타내었다. XRD와 AFM 측정을 통해, 기판의 종류에 상관없이 모든 ITZO 박막이 비정질 구조를 나타내며 핀홀이나 크랙 같은 결함이 없는 표면을 가짐을 확인할 수 있었다.

PbSCC of Ni-base Alloys in PbO-added Pure Water

  • Kim, Joung Soo;Yi, Yong-Sun;Kwon, Oh Chul;Kim, Hong Pyo
    • Corrosion Science and Technology
    • /
    • 제6권6호
    • /
    • pp.316-321
    • /
    • 2007
  • The effect of annealing on the pitting corrosion resistance of anodized Al-Mg alloy (AA5052) processed by equal-channel angular pressing (ECAP) was investigated by electrochemical techniques in a solution containing 0.2 mol/L of $AlCl_3$ and also by surface analysis. The Al-Mg alloy was annealed at a fixed temperature between 473 and 573 K for 120 min in air after ECAP. Anodizing was conducted for 40 min at $100-400A/m^2$ at 293 K in a solution containing 1.53 mol/L of $H_2SO_4$ and 0.0185 mol/L of $Al_2(SO_4)_3$. The internal stress generated in anodic oxide films during anodization was measured with a strain gauge to clarify the effect of ECAP on the pitting corrosion resistance of anodized Al-Mg alloy. The time required to initiate the pitting corrosion of anodized Al-Mg alloy was shorter in samples subjected to ECAP, indicating that ECAP decreased the pitting corrosion resistance. However, the pitting corrosion resistance was greatly improved by annealing after ECAP. The time required to initiate pitting corrosion increased with increasing annealing temperature. The strain gauge attached to Al-Mg alloy revealed that the internal stress present in the anodic oxide films was compressive stress, and that the stress was larger with ECAP than without. The compressive internal stress gradually decreased with increasing annealing temperature. Scanning electron microscopy showed that cracks occurred in the anodic oxide film on Al-Mg alloy during initial corrosion and that the cracks were larger with ECAP than without. The ECAP process of severe plastic deformation produces large internal stresses in the Al-Mg alloy; the stresses remain in the anodic oxide films, increasingthe likelihood of cracks. It is assumed that the pitting corrosion is promoted by these cracks as a result of the higher internal stress resulting from ECAP. The improvement in the pitting corrosion resistance of anodized AlMg alloy as a result of annealing appears to be attributable to a decrease in the internal stresses in anodic oxide films

Effect of Annealing on the Pitting Corrosion Resistance of Anodized Aluminum-Magnesium Alloy Processed by Equal Channel Angular Pressing

  • Son, In-Joon;Nakano, Hiroaki;Oue, Satoshi;Kobayashi, Shigeo;Fukushima, Hisaaki;Horita, Zenji
    • Corrosion Science and Technology
    • /
    • 제6권6호
    • /
    • pp.275-281
    • /
    • 2007
  • The effect of annealing on the pitting corrosion resistance of anodized Al-Mg alloy (AA5052) processed by equal-channel angular pressing (ECAP) was investigated by electrochemical techniques in a solution containing 0.2 mol/L of $AlCl_3$ and also by surface analysis. The Al-Mg alloy was annealed at a fixed temperature between 473 and 573 K for 120 min in air after ECAP. Anodizing was conducted for 40 min at $100-400A/m^2$ at 293 K in a solution containing 1.53 mol/L of $H_2SO_4$ and 0.0185 mol/L of $Al_2(SO_4)_3$. The internal stress generated in anodic oxide films during anodization was measured with a strain gauge to clarify the effect of ECAP on the pitting corrosion resistance of anodized Al-Mg alloy. The time required to initiate the pitting corrosion of anodized Al-Mg alloy was shorter in samples subjected to ECAP, indicating that ECAP decreased the pitting corrosion resistance. However, the pitting corrosion resistance was greatly improved by annealing after ECAP. The time required to initiate pitting corrosion increased with increasing annealing temperature. The strain gauge attached to Al-Mg alloy revealed that the internal stress present in the anodic oxide films was compressive stress, and that the stress was larger with ECAP than without. The compressive internal stress gradually decreased with increasing annealing temperature. Scanning electron microscopy showed that cracks occurred in the anodic oxide film on Al-Mg alloy during initial corrosion and that the cracks were larger with ECAP than without. The ECAP process of severe plastic deformation produces large internal stresses in the Al-Mg alloy; the stresses remain in the anodic oxide films, increasingthe likelihood of cracks. It is assumed that the pitting corrosion is promoted by these cracks as a result of the higher internal stress resulting from ECAP. The improvement in the pitting corrosion resistance of anodized AlMg alloy as a result of annealing appears to be attributable to a decrease in the internal stresses in anodic oxide films

In-situ spectroscopic studies of SOFC cathode materials

  • 주종훈
    • 한국재료학회:학술대회논문집
    • /
    • 한국재료학회 2012년도 춘계학술발표대회
    • /
    • pp.70.1-70.1
    • /
    • 2012
  • In-situ X-ray photoelectron spectroscopy (XPS) and infrared (IR) spectroscopy studies of SOFC cathode materials will be discussed in this presentation. The mixed conducting perovskites (ABO3) containing rare and alkaline earth metals on the A-site and a transition metal on the B-site are commonly used as cathodes for solid oxide fuel cells (SOFC). However, the details of the oxygen reduction reaction are still not clearly understood. The information about the type of adsorbed oxygen species and their concentration is important for a mechanistic understanding of the oxygen incorporation into these cathode materials. XPS has been widely used for the analysis of adsorbed species and surface structure. However, the conventional XPS experiments have the severe drawback to operate at room temperature and with the sample under ultrahigh vacuum (UHV) conditions, which is far from the relevant conditions of SOFC operation. The disadvantages of conventional XPS can be overcome to a large extent with a "high pressure" XPS setup installed at the BESSY II synchrotron. It allows sample depth profiling over 2 nm without sputtering by variation of the excitation energy, and most importantly measurements under a residual gas pressure in the mbar range. It is also well known that the catalytic activity for the oxygen reduction is very sensitive to their electrical conductivity and oxygen nonstoichiometry. Although the electrical conductivity of perovskite oxides has been intensively studied as a function of temperature or oxygen partial pressure (Po2), in-situ measurements of the conductivity of these materials in contact with the electrolyte as a SOFC configuration have little been reported. In order to measure the in-plane conductivity of an electrode film on the electrolyte, a substrate with high resistance is required for excluding the leakage current of the substrate. It is also hardly possible to measure the conductivity of cracked thin film by electrical methods. In this study, we report the electrical conductivity of perovskite $La_{0.6}Sr_{0.4}CoO_{3-{\delta}}$ (LSC) thin films on yttria-stabilized zirconia (YSZ) electrolyte quantitatively obtained by in-situ IR spectroscopy. This method enables a reliable measurement of the electronic conductivity of the electrodes as part of the SOFC configuration regardless of leakage current to the substrate and cracks in the film.

  • PDF