• Journal of Adhesion and Interface
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• v.22 no.1
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• pp.29-29
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• 2021

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.53-59
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• 2001

Surfaces of PTFE and PVDF were modified by ion-assisted reaction (IAR) in which 1 keV $Ar^{+}$ ions were irradiated on the surface of the polymer with varying ion dose in an oxygen gas environment, and Cu, Pt, Al and Ag thin films were deposited on the modified polymers. Wettability of the modified polymers was largely improved by the formation of hydrophilic groups due to chemical reaction between polymer surface and the oxygen gas during IAR. The change in wettability in the modified polymers was also related to the change in surface morphology and roughness. Adhesion between metal films and polymers modified by IAR was significantly improved, so that no detachment was possible in the $Scotch^{TM}$ tape test. The increase of adhesion strength between the metal film and the modified PVDF was mainly attributed to the formation of hydrophilic groups, which interacted with the metal film. In the case of the modified PTFE, the enhanced adhesion to metal film could be explained by the change in surface morphology together with the formation of hydrophilic groups. The electrical properties of the metal films on the modified polymers were also investigated.

• Corrosion Science and Technology
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• v.3 no.4
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• pp.172-177
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• 2004

Biaxially oriented polyethylene terephthalate copolymer(BO - PET)film laminated aluminiums have been applied for chip condenser case. The BO PET film is characterized by high molecular which gives high corrosion resistance, good adhesion and high heat resistance. The higher orientation lowers formability of the film. So, optimum orientation has to be controlled during the laminating process. And to confirm the adhesion between BO PET and aluminium and to guarantee the formability of PET laminated aluminums, we have controlled the chromium oxides weight on the aluminium and laminating condition ( laminating temperature, soaking temperature and lag time after nip roll and quenching conditions) This paper discusses the effect of the laminating conditions on the formability of laminated aluminums. As results, it is clear that the orientation of the BO PET film decreased with an increase in the strip temperature. When the film temperature is over the melting point of the film, its orientation drastically decreased.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.540-544
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• 1996

To apply the CVD diamond film to coated tools, it is necessary to make adhesion strength between diamond film and substrate stronger. So adhesion strength of diamond coated WC-Co tools using Microwave Plasma CVD and cutting test of Al-18mass%Si alloy using diamond cutting tools were studied. Diamond coating was carried out using Microwave Plasma CVD apparatus. Reaction gas was used mixture of methane and hydrogen. Substrate temperature were varied from 673K to 1173K by control of microwave output power and reaction pressure. By observation of SEM, grain size became larger and larger as substrate temperature became higher and higher. Also all deposits were covered with clear diamond crystals. XRD results, the deposits were identified to cubic diamond. An analysis using Raman spectroscopy, the deposit synthesized at lower substrate temperature (673K) showed higher quality than deposit synthesized at higher substrate temperature (1173K). As a result of scratch adhesion strength test, from 873K to 1173K adhesion strength decreased by rising of substrate temperature. The deposit synthesized at 873K showed best adhesion strength. In the cutting test of Al-18mass%Si alloy using diamond coated tools and the surface machinability of Al-Si works turned with diamond coating tools which synthesized at 873K presented uniform roughness. Cutting performance of Al-18mass%Si alloys using diamond coated WC-Co tools related to the adhesion strength.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.188-194
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• 2016

We propose an acousto-optic technique for the nondestructive evaluation of adhesion properties of a Pt/Ti thin-film interface. Since there are some problems encountered when using prevailing techniques to nondestructively evaluate the interfacial properties of micro/nano-scale thin-films, we applied an interferometer that combined the acoustic and optical methods. This technique is based on the Michelson interferometer but the resultant surface of the thin film specimen makes interference instead of the mirror when the interface is excited from the acoustic transducer at the driving frequency. The thin film shows resonance-like behavior at a certain frequency range, resulting in a low-contrast fringe pattern. Therefore, we represented quantitatively the change in fringe pattern as a frequency spectrum and discovered the possibility that the interfacial adhesion properties of a thin film can be evaluated using the newly proposed technique.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.496-502
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• 1999

Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associated with process control for uniform thickness on selected area. Sputtering was employed to investigate the adhesion between substrate Alloy42 and Ag film as a new candidate process alternative to conventional electroplating. Coating thickness of Ag film was controlled to 3.5$\mu\textrm{m}$ at room temperature as a reference. The deposition of film was optimized to ensure the adhesion by process parameters of substrate heating temperature at $100~300^{\circ}C$, sputter etching time at -300V for 10~30min, bias voltage of -100~-500V, and existence of Cr interlayer film of $500\AA$. The critical $load L_{c}$ /, defined as the minimum load at which initial damage occurs, was the highest up to 29N at bias voltage of -500V by scratch test. AFM surface image and AES depth profile were investigated to analyze the interface. The effect of bias voltage in sputtering was to improve the surface roughness and remove the oxide on Alloy42.

• Korean Journal of Materials Research
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• v.30 no.3
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• pp.105-110
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• 2020

Cu/PET composite films are widely used in a variety of wearable electronics. Lifetime of the electronics is determined by adhesion between the Cu film and the PET substrate. The formation of an anisotropic nanostructure on the PET surface by surface modification can enhance Cu/PET interfacial adhesion. The shape and size of the anisotropic nanostructures of the PET surface can be controlled by varying the surface modification conditions. In this work, the effect of Cu/PET interface nanostructures on the failure mechanism of a Cu/PET flexible composite film is studied. From observation of the morphologies of the anisotropic nanostructures on plasma-treated PET surfaces, and cross-sections and surfaces of the fractured specimens, the Cu/PET interface area and nanostructure width are analyzed and the failure mechanism of the Cu/PET film is investigated. It is found that the failure mechanism of the Cu/PET flexible composite film depends on the shape and size of the plasmatreated PET surface nanostructures. Cu/PET interface nanostructures with maximal peel strength exhibit multiple craze-crack propagation behavior, while smaller or larger interface nanostructures exhibit single-path craze-crack propagation behavior.

• Korean Journal of Materials Research
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• v.14 no.3
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• pp.203-210
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• 2004

Effects of various pretreatments on the adhesion of copper-coated polymer films were investigated. Copper-coated polymer films were prepared by an electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a DC bias system at room temperature. PET(polyethylene terephthalate) film was employed as a substrate material and it was pretreated by industrially feasible methods such as chromic acid, sand-blasting, oxygen plasma and ion-implantation treatment. Surface characterization of the copper-coated polymer film was carried out by AFM(Atomic Force Microscopy) and FESEM(Field Emission Scanning Electron Microscopy). Surface energy was calculated by based on the value of the contact angle measured. The adhesion of copper/PET films was determined by a pull-off test according to ASTM D-5179. It was found that suitable pretreatment of the PET substrate was required for obtaining good adhesion property between copper films and the substrate. In this study the highest adhesion was observed in sand-blasting, and then followed by those of acid and oxygen plasma treatment. However, the effect of surface energy was insignificant in our experimental range. This is probably due to compensating the difference in surface energy from various pretreatments by exposing substrate to ECR plasma for 5 min or longer at the early stage of the copper deposition. Therefore, it can be concluded that surface roughness of the polymer substrate plays an important role to determine the adhesion of copper-coated polymer for the deposition of copper by ECR-MOCVD.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.171-177
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• 2001

The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.

• Tribology and Lubricants
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• v.19 no.2
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• pp.109-115
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• 2003

Nanotribological characteristics between a Si$_3$N$_4$ AFM tip and hydrophobic thin films were experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM (atomic force microscope) and LFM (lateral force microscope) modes in various .ranges of normal load. Plasma-modified thin polymeric films were deposited on Si-wafer (100). Results showed that wetting angle of plasma-modified thin polymeric film increased with the treating time, which resulted in the hydrophobic surface and the decrease of adhesion and friction. Nanotribological characteristics of these surfaces were compared with those of other hydrophobic surfaces, such as DLC, OTS and IBAD-Ag coated surfaces. Those of OTS coated surface were superior to those of others, though wetting angle of plasma-modified thin polymeric film is higher.