• Journal of the Korean institute of surface engineering
• /
• v.26 no.6
• /
• pp.327-333
• /
• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

• Archives of Pharmacal Research
• /
• v.26 no.11
• /
• pp.973-978
• /
• 2003

A polymeric film composed of Carbopol, Poloxamer and hydroxypropyl methylcellulose was prepared to develop a buccal patch and the effects of composition of the film on adhesion time, swelling ratio, and dissolution of the film were studied. The effects of plasticizers or penetration enhancers on the release of triamcinolone acetonide (TAA) were also studied. The hydrogen bonding between Carbopol and Poloxamer played important role in reducing swelling ratio and dissolution rate of polymer film and increasing adhesion time. The swelling ratio of the composite film was significantly reduced and the adhesion time was increased when compared with Carbopol film. As the ratio of Poloxamer to hydroxypropyl methylcellulose increased from 0/66 to 33/33, the release rate of TAA decreased. However, no further significant decrease of release rate was observed beyond the ratio of 33/33. The release rate of TAA in the polymeric film containing polyethylene glycol 400, a plasticizer, showed the highest release rate followed by triethyl citrate, and castor oil. The release rate of TAA from the polymeric film containing permeation enhancers was slower than that from the control without enhancers. Therefore, these observations indicated that a preparation of a buccal patch is feasible with the polymeric film composed of Cabopol, Poloxamer and hydropropyl methylcellulose.

• Journal of the Korean institute of surface engineering
• /
• v.28 no.4
• /
• pp.219-224
• /
• 1995

The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.

• KSTLE International Journal
• /
• v.9 no.1_2
• /
• pp.31-35
• /
• 2008

DLC (Diamond Like Carbon) films have predominant tribological properties like a high hardness, low friction and high chemical resistance; therefore, DLC films are applied in a wide range of industrial fields. This paper evaluated the characteristics of DLC films deposited on bearing steel with different hardness by RF-PECVD (Radio Frequency - Plasma Enhanced Chemical Vapor Deposition) method. Si-interlayer was deposited on bearing steel to improve adhesion strength by RF-Sputtering method. The DLC film structures were analyzed with Raman spectra and Gaussian function. Adhesion strength of DLC films was measured with a scratch tester. Friction and wear test were carried out with a ball-on -disc type to investigate the tribological characteristics. Experimental results showed that DLC films deposited on bearing steel under same deposition condition have typical structure DLC films regardless of hardness of bearing steel. Adhesion strength of DLC film is increased with a hardness of bearing steel. Friction coefficient of DLC film showed lower at the high hardness of bearing steel.

• Journal of the Korean institute of surface engineering
• /
• v.49 no.6
• /
• pp.575-579
• /
• 2016

The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

• Proceedings of the IEEK Conference
• /
• 2002.06b
• /
• pp.225-228
• /
• 2002

The adhesion effect between the oxide layer and the metal layer has been studied by RTP anneal. Two types of oxides, BPSG and P-TEOS, were used as a bottom layer under multi-layered metal film. We observe the interface between oxide and metal layer using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Adhesion failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal film at 650"C RTP anneal. The phosphorus rich layer was observed at interface between BPSG oxide and metal layer by AES and TEM measurements. On the other hand adhesion was a)ways good in the sample used P-TEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal film was improved when the sample was annealed below $650^{\circ}C$.TEX>.

• Polymer(Korea)
• /
• v.25 no.4
• /
• pp.594-601
• /
• 2001

Direct thermal lamination of polyethylene film on aluminum plate without using adhesive was tried by modifying their surfaces to have polar groups. Polyethylene film was modified by treating with oxygen or acrylic acid plasma. Aluminum plate was modified by treating with boiling water or diaminocyclohexane plasma. Fairly high adhesion strength was obtained even in the case when only the polyethylene film was modified, and adhesion strength was so high that film was broken during the adhesion test if both the film and the aluminum plate were modified. Even chemical bonding seemed to be possible when the film treated with acrylic acid was laminated on the plate treated with diaminocyclohexane plasma by forming amide linkage through the reaction between COOH groups on the film surface and NH$_2$ groups on the plate surface.

• Journal of Welding and Joining
• /
• v.5 no.2
• /
• pp.17-26
• /
• 1987

In this study, the experiments were carried out for the purpose of establishment of the arc sparing method which reducing oxides or oxide film by using the inert gas as the carrier gas of atomizing particles. Main results obtained are as follows; 1. Oxides and oxide film which lower the adhesion strength are largely reduced by using the inert gas as the carrier gas of atomizing particles, and adhesion strength of coating film are improved. 2. The coating film characteristics appear to be no difference between the inert gas arc spraying in air environment and that in argon gas environment. 3. Inert gas arc spraying using argon as the carrie gas has higher reduction rate of composition element in coating film than compressed air spraying does.

• Journal of the Korean Society for Heat Treatment
• /
• v.4 no.1
• /
• pp.19-29
• /
• 1991

This study was to investigate the influence of the substrate hardness on the hardness and adhesion of TiN thin film deposited by R.F. PACVD. Although the substrate hardness changed, chemical composition, stoichiometry and structure of TiN thin film did not change. ISE index was 1.96-1.99 for the substrate and was 1.57-1.79 for TiN thin film. And ISE index of TiN thin film was inverse proportion to the substrate hardness. When the substrate hardness was low, TiN thin film had many cracks around the indentation. But as the substrate hardness increased, TiN thin film had a few cracks and the deformation was limited within indentation. In having measured the adhesion of TiN thin film by SAT, the critical load (Lc) generally increased as the substrate hardness decreased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.61-62
• /
• 2006

In this paper, it was demonstrated that organic thin- film transistors (OTFTs) were fabricated with the organic adhesion layer between an organic semiconductor and a gate insulator by vapor deposition polymerization (VDP) processing. In order to form polymeric film as an adhesion layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing. The saturated slop in the saturation region and the subthreshold nonlinearity in the triode region were c1early observed in the electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure. Field effect mobility, threshold voltage, and on-off current ratio in 15-nm-thick organic adhesion layer were about $0.5\;cm^2/Vs$, -1 V, and $10^6$, respectively. We also demonstrated that threshold voltage depends strongly on the delay time when a gate voltage has been applied to bias stress.