• Journal of Ocean Engineering and Technology
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• v.23 no.4
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• pp.1-5
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• 2009

A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.

• 전기의세계
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• v.29 no.8
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• pp.524-531
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• 1980

In order to investigate the effect of inorganic dielectric fine particle mixed in Low Density Polyethylene on the deterioration by treeing, a comparative study for initiation and development of the tree has been carried out between the pure thin film specimen and the same geometrical specimen mixed with a constant weight percent by a defiend particle size of $Al_{2}$O$_{3}$ and SiO$_{2}$, having larger dielectric constants than that of the base material. According to the results, it has been observed that as increasing dielectric constant, the initiation of tree is expedited, however, the development of the tree reached at the surface of filler particles shows the suppressive trends. From these facts, a reasonable interpretation may be possible by considering the effect of intensified electrical field around the tip in the presence of filler particles, that the initiation and the development of tree are a mechanical break down process caused by Maxwell stress due to the concentration of electrical field at the tip. This suppressive effect is specifically suggestive for the reason that a discharge route must be constructed around the particle surface because of the intensified field strength near filler, which, in turn, reduces the geometrical curvature of the tip so that the local intensity of electrical field can be relaxed. Further more an experimental evidence for this assumption was able to observe in this investigation.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.119-119
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• 2005

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.17-19
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• 1999

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.169-171
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• 2003

• Proceedings of the Safety Management and Science Conference
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• 2002.11a
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• pp.269-271
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• 2002

• Journal of the Korean Wood Science and Technology
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• v.34 no.2
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• pp.10-21
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• 2006

Recycled polypropylene (RPP) - Wood Saw Dust (WSD) composites with and without acetylation of filler were produced at different filler loading (15%, 25%, 35% and 45% w/w) and filler size (300, 212 and $100{\mu}m$). The RPP-WSD was compounded using a Haake Rheodrive 500 twin screw compounder at $190^{\circ}C$ at 8 MPa for 30 minutes. The mechanical properties and water absorption properties of modified and unmodified WSD-PP composites were investigated. Acetylation of WSD improved the mechanical and water absorption characteristic of composites. The decrease of filler size (300 to $100{\mu}m$) of the unmodified and acetylated WSD showed increase of tensile strength and impact properties. The composites exhibited higher tensile modulus properties as the filler loading increased (15% to 45%). However tensile strength, elongation at break and impact strength showed the opposite phenomenon. Water absorption increased as the mesh number and filler loading increased. With acetylation, lower moisture absorption was observed as compared to unmodified WSD. The failure mechanism from impact fracture of the filler-matrix interface with and without acetylation was analyzed using Scanning Electron Microscope (SEM).

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.06a
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• pp.79-84
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• 2006

In order to improve filler-fiber bonding in paper, starch-filler composites were prepared by a starch-fatty acid complex formation method. These composites were used as a papermaking filler to improve the physical properties of the paper, filler retention and the sizing effect. The solubility of the starch-fatty acid complex in water at different temperatures was measured. The results indicated that the starch-fatty acid complexes have very low solubility in water below $70^{\circ}C$, which can be easily coated on clay surface to modify clay-fiber bonding ability. The clay-starch composite filled handsheets showed that paper strength could increase more than $100{\sim}200%$ compared to untreated clay. It was found that ZDT of the handsheet decreased as the clay content increased when unmodified clay was used, but it increased when the starch-fatty acid composite modified filler was used. It was also found that the presence of fatty acide in the complex increased the water-repellant property of the handsheet, which can be used to aid in sizing during papermaking. Filler distribution and bonding characteristics between the composite and fiber were investigated using Scanning Electron Microscopy(SEM).

• Journal of the Korean Wood Science and Technology
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• v.26 no.3
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• pp.48-52
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• 1998

Residues such as walnut, pinenut and peanut shells were used as a filler in adhesive for bonding radiata pine plywood. The nutshell residues were prepared by simply drying to 8% moisture content and grinding the dry material using a laboratory Wiley mill with a $75{\mu}m$ (200 mesh) screen. The nutshells residues were compared to a commercial filler commonly used in adhesives by the structural plywood and laminated veneer lumber industry in the United States. The adhesive mixes were made by following the recommended procedure of Georgia-Pacific Resins, Inc., using phenol-formaldehyde resin. For each filler type, three-ply plywoods, 6 mm nominal thickness and 30 by 30 cm in size, were fabricated at two press times (4 and 5 min) and around 30 minute assembly time. Evaluations of the nutshell residues were carried out by tension shear tests after cyclic boil tests on plywood. The results of the performance test included tension shear strength and wood failure. All plywoods made with the nutshell fillers were comparable to those made with the control filler. These results indicate that nutshell residues would be suitable as filler for plywood adhesives.

• Journal of Welding and Joining
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• v.34 no.2
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• pp.46-53
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• 2016

Effect of heating rate on microstructure of brazed joints with STS 304 Printed Circuit Heat Exchanger (PCHE),which was manufactured as large-scale($1170(L){\times}520(W)){\times}100(T)$, mm), have been studied to compare bonding phenomenon. The specimens using MBF 20 was bonded at $1080^{\circ}C$ for 1hr with $0.38^{\circ}C/min$ and $20^{\circ}C/min$ heating rate, respectively. In case of a heating rate of $20^{\circ}C/min$, overflow of filler metal was observed at the edge of a brazed joints showing the height of filler metal was decreased from $100{\mu}m$ to $68{\mu}m$. At the center of the joints, CrB and high Ni contents of ${\gamma}$-Ni was existed. For the joints brazed at a heating rate of $0.38^{\circ}C/min$, the height of filler was decreased from $100{\mu}m$ to $86{\mu}m$ showing the overflow of filler was not appeared. At the center of the joints, only ${\gamma}$-Ni was detected gradating the Ni contents from center. This phenomenon was driven from a diffusion amount of Boron in filler metal. With a fast heating rate $20^{\circ}C/min$, diffusion amount of B was so small that liquid state of filler metal and base metal were reacted. But, for a slow heating rate $0.38^{\circ}C/min$, solid state of filler metal due to low diffusion amount of B reacted with base metal as a solid diffusion bonding.