• 제목/요약/키워드: Feature Profile

검색결과 206건 처리시간 0.022초

사상체질 판별을 위한 측면 얼굴 이미지에서의 특징 검출 (Side Face Features' Biometrics for Sasang Constitution)

  • 장천;이기정;황보택근
    • 인터넷정보학회논문지
    • /
    • 제8권6호
    • /
    • pp.155-167
    • /
    • 2007
  • 사상의학에서는 사람을 네 종류로 구분하며, 한의사들은 종종 이 네 종류에 기반을 두어 특별한 건강 정보와 치료 방법을 제안한다. 얼굴의 특징 비율(표 1)은 사상체질을 판단하는데 있어서 매우 중요한 기준으로 사용되는데, 본 논문에서는 측면얼굴에서 특징 비율을 추출하기 위한 시스템을 제안하였다. 특징 비율을 얻기 위해서는 두 가지를 고려하여야 한다. 하나는 대표 특징들을 선택하는 것이고, 다른 하나는 측면 얼굴 이미지에서 효과적으로 관심 영역을 검출하고, 정확하게 특징 비율을 계산하는 것이다. 논 논문에서 제시한 시스템에서는 적응형 색상 모델을 사용하여 배경에서 측면 얼굴을 분리하였고, 관심 영역 검출을 위해서 기하 모델에 기반한 방법이 사용되었다. 또한 이미지 크기와 머리 포즈에 따른 이미지 변화에 의해서 야기되는 에러 분석을 제시하였다. 제시한 시스템의 성능을 평가하기 위하여 173명의 한국인 왼쪽 얼굴 사진을 이용하여 시스템을 테스트하였고, 정면 사진과 측면 사진을 함께 사용하였을 경우 정면 사진만을 사용한 경우보다 17.99%의 성능 향상을 나타내었다.

  • PDF

GPU Based Feature Profile Simulation for Deep Contact Hole Etching in Fluorocarbon Plasma

  • Im, Yeon-Ho;Chang, Won-Seok;Choi, Kwang-Sung;Yu, Dong-Hun;Cho, Deog-Gyun;Yook, Yeong-Geun;Chun, Poo-Reum;Lee, Se-A;Kim, Jin-Tae;Kwon, Deuk-Chul;Yoon, Jung-Sik;Kim3, Dae-Woong;You, Shin-Jae
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
    • /
    • pp.80-81
    • /
    • 2012
  • Recently, one of the critical issues in the etching processes of the nanoscale devices is to achieve ultra-high aspect ratio contact (UHARC) profile without anomalous behaviors such as sidewall bowing, and twisting profile. To achieve this goal, the fluorocarbon plasmas with major advantage of the sidewall passivation have been used commonly with numerous additives to obtain the ideal etch profiles. However, they still suffer from formidable challenges such as tight limits of sidewall bowing and controlling the randomly distorted features in nanoscale etching profile. Furthermore, the absence of the available plasma simulation tools has made it difficult to develop revolutionary technologies to overcome these process limitations, including novel plasma chemistries, and plasma sources. As an effort to address these issues, we performed a fluorocarbon surface kinetic modeling based on the experimental plasma diagnostic data for silicon dioxide etching process under inductively coupled C4F6/Ar/O2 plasmas. For this work, the SiO2 etch rates were investigated with bulk plasma diagnostics tools such as Langmuir probe, cutoff probe and Quadruple Mass Spectrometer (QMS). The surface chemistries of the etched samples were measured by X-ray Photoelectron Spectrometer. To measure plasma parameters, the self-cleaned RF Langmuir probe was used for polymer deposition environment on the probe tip and double-checked by the cutoff probe which was known to be a precise plasma diagnostic tool for the electron density measurement. In addition, neutral and ion fluxes from bulk plasma were monitored with appearance methods using QMS signal. Based on these experimental data, we proposed a phenomenological, and realistic two-layer surface reaction model of SiO2 etch process under the overlying polymer passivation layer, considering material balance of deposition and etching through steady-state fluorocarbon layer. The predicted surface reaction modeling results showed good agreement with the experimental data. With the above studies of plasma surface reaction, we have developed a 3D topography simulator using the multi-layer level set algorithm and new memory saving technique, which is suitable in 3D UHARC etch simulation. Ballistic transports of neutral and ion species inside feature profile was considered by deterministic and Monte Carlo methods, respectively. In case of ultra-high aspect ratio contact hole etching, it is already well-known that the huge computational burden is required for realistic consideration of these ballistic transports. To address this issue, the related computational codes were efficiently parallelized for GPU (Graphic Processing Unit) computing, so that the total computation time could be improved more than few hundred times compared to the serial version. Finally, the 3D topography simulator was integrated with ballistic transport module and etch reaction model. Realistic etch-profile simulations with consideration of the sidewall polymer passivation layer were demonstrated.

  • PDF

Design and Evaluation of a Rough Set Based Anomaly Detection Scheme Considering the Age of User Profiles

  • Bae, Ihn-Han
    • 한국멀티미디어학회논문지
    • /
    • 제10권12호
    • /
    • pp.1726-1732
    • /
    • 2007
  • The rapid proliferation of wireless networks and mobile computing applications has changed the landscape of network security. Anomaly detection is a pattern recognition task whose goal is to report the occurrence of abnormal or unknown behavior in a given system being monitored. This paper presents an efficient rough set based anomaly detection method that can effectively identify a group of especially harmful internal attackers - masqueraders in cellular mobile networks. Our scheme uses the trace data of wireless application layer by a user as feature value. Based on this, the used pattern of a mobile's user can be captured by rough sets, and the abnormal behavior of the mobile can be also detected effectively by applying a roughness membership function with the age of the user profile. The performance of the proposed scheme is evaluated by using a simulation. Simulation results demonstrate that the anomalies are well detected by the proposed scheme that considers the age of user profiles.

  • PDF

자동차용 축대칭 형상 부품 외경 자동측정시스템에 관한 연구 (A Study on Automated Outer Diameter Measurement System for Axisymmetric Automotive Part)

  • 반갑수;배준영
    • 한국기계가공학회지
    • /
    • 제12권3호
    • /
    • pp.61-68
    • /
    • 2013
  • Automatic measurement system is required since cycle time and cost of production are increased by various factors in manual systems. This paper presents a machine vision based prototype measurement system for the automotive axisymmetric shape parts which are generally measured by a manual system that is required the tolerance of the part is very small on each machined surface. This measurement system adopts a method in which optical lens is transferred along the profile of the part to minimize measurement cycle time. The main interest of this paper is a development of an optimum measurement algorithm to the outside diameter of the parts that can be applied to various combinations of hardware. The operating system used to implement the whole system is Window XP and corresponding environment.

SVM을 이용한 웨이블릿기반 프로파일분류에 관한 연구 (A Wavelet-based Profile Classification using Support Vector Machine)

  • 김성준
    • 한국지능시스템학회:학술대회논문집
    • /
    • 한국지능시스템학회 2008년도 춘계학술대회 학술발표회 논문집
    • /
    • pp.3-6
    • /
    • 2008
  • 베어링은 각종 설비에서 활용하는 중요한 기계요소 중 하나이다. 설비고장의 상당수는 베어링의 결함이나 파손에 기인하고 있다. 따라서 베어링에 대한 온라인모니터링기술은 설비의 정지를 예방하고 손실을 줄이는 데 필수적이다. 본 논문은 진동신호를 이용하여 베어링의 상태를 예측하기 위한 온라인모니터링에 대해 연구한다. 프로파일로 주어지는 진동신호는 이산웨이블릿변환을 통해 분석되고, 분해수준별 웨이블릿계수로부터 얻은 통계적 특징 중 유의한 것을 선별하고자 분산분석 (ANOVA)을 이용한다. 선별된 특징벡터는 Support Vector Machine (SVM)의 입력이 되는 데, 본 논문에서는 다중클래스 분류문제를 다루기 위한 계층적 SVM 네트워크를 제안한다.

  • PDF

증기터빈 날개의 성능해석에 대한 연구 (A Study of Performance Analysis for a Steam Turbine Blade)

  • 정경남;김양익;성주헌;정인호
    • 유체기계공업학회:학술대회논문집
    • /
    • 유체기계공업학회 2004년도 유체기계 연구개발 발표회 논문집
    • /
    • pp.119-124
    • /
    • 2004
  • In this study, a rotor blade of a Curtis turbine is investigated. Bezier curve is generally used to define the profile of turbine blades. However, this curve gives a feature of global control, which is not proper to a supersonic impulse turbine blade. Thus, a blade design method is developed by using B-spline curve so that local control is possible to obtain an optimized blade section. To design a Curtis turbine blade section systematically, the blade section has been changed by varying three design parameters using central composite design method. Flow analyses have been carried out for the blade sections, and the effects of design parameters are evaluated.

  • PDF

TAB 테이프 제조를 위한 구리 도금 및 에칭에 관한 연구 (Cu Electroplating on Patterned Substrate and Etching Properties of Cu-Cr Film for Manufacturing TAB Tape)

  • 김남석;강탁;윤일표;박용수
    • 한국표면공학회지
    • /
    • 제27권3호
    • /
    • pp.158-165
    • /
    • 1994
  • Cu-Cr alloy thin film requires good quality of etching be used for TAB technology. The etched cross sec-tion was clean enough when the etching was performed in 0.1M $FeCl_3$ solution at $50^{\circ}C$. The etching rate was increased with the amount of $KMnO_4$. For enhanced profile of cross section and rate, the spray etchning was found to be superior compared to the immersion etching. A series of experiments were performed to improve the uniformity of the current distribution in electrodeposition onto the substrate with lithographic patterns. Copper was electrodeposited from quiescent-solution, paddle-agitated-solution, and air-bubbled-solution to in-vestigate the effect of the fluid flow. The thickness profile of the specimen measured by profilmetry has the non uniformity at feature scale in quiescent-solution, because of the longitudinal vortex roll caused by the natural convection. However, uniform thickness profile was achieved in paddle-agitated or air bubbled solu-tion.

  • PDF

Stromelysin-1에 의한 펩타이드 가수분해에서 pH와 기질특이성 연구 (Distinctive pH Dependence and Substrate Specificity of Peptide Hydrolysis by Human Stromelysin-1)

  • 차재호
    • 생명과학회지
    • /
    • 제10권2호
    • /
    • pp.210-217
    • /
    • 2000
  • A kinetic profile of the catalytic domain of stromelysin-1 (SCD) using the fluorescent peptide substrate has been determined by the stopped-flow technique. The pH profile has a pH optimum of about 5.5 with an extended shoulder above pH 7. Three pKa values, 5.0, 5.7, and 9.8 are found for the free enzyme state and two pH independent Kcat/Km values of 4.1$\times$104 M-1 s-1 and 1.4$\times$104 M-1 s-1 at low and high pH, respectively. The profile is quite different in shape with other MMP family which has been reported, having broad pH optimum with two pKa values. The substrate specificity of SCD towards fluorescent heptapeptide substrates has been also examined by thin layer chromatography. The cleavage sites of the substrates have been identified using reverse-phase HPLC method.SCD cleaves Dns-PLA↓L↓WAR and Dns-PLA↓L↓FAR at two positions. However, the Dns-PLA↓LRAR, Dns-PLE↓LFAR, adn Dns-PLSar↓LFAR are cleaved exclusively at one bond. The double cleavages of Dns-PLALWAR and Dns-PLALFAR by SCD are in marked contrast to the close structurally related matrilysin. A notable feature of SCD catalysis agrees with the structural data that the S1' pocket of SCD is deeper than that of matriysin. The differences observed between SCD and matrilysin may form the basis of understanding the structural relationships and substrate specificities of the MMP family in vivo.

  • PDF

변분근사법을 이용한 FAM 과정의 접촉응력 해석 (A Contact Stress Analysis in a FAM Process Using Variational Approximation Procedure)

  • 석종원
    • 대한기계학회논문집A
    • /
    • 제28권9호
    • /
    • pp.1255-1261
    • /
    • 2004
  • A variational approximation procedure is introduced to study the contact stresses between a representative asperity and a feature generally happening in superfinishing processes such as FAM. After a description of the model under consideration is presented, a system of governing equation for the model is derived fullowed by the assumptions made in order to make progress in model development. Final computation is made to evaluate contact stresses on an elastic asperity tip in small scale in size and a computer simulation is performed for detailed surface profile variations on a representative feature. Numerical results are presented along with a discussion of the conclusions that can be drawn from this analysis.

Feature Scale Simulation of Selective Chemical Vapor Deposition Process

  • Yun, Jong-Ho
    • 한국진공학회지
    • /
    • 제4권S1호
    • /
    • pp.190-195
    • /
    • 1995
  • The feature scale model for selective chemical vapor deopsition process was proposed and the simulation was performed to study the selectivity and uniformity of deposited thin film using Monte Carlo method and string algorithm. The effect of model parameters such as sticking coefficient, aspect ratio, and surface diffusion coefficient on the deposited thin film pattern was improved for lower sticking coefficient and higher aspect ratio. It was revealed that the selectivity loss ascrives to the surface diffusion. Different values of sticking coefficients on Si and on SiO2 surface greatly influenced the deopsited thin film profile. In addition, as the lateral wall angle decreased, the selectively deposited film had improved uniformity except the vicinity of trench wall. The optimum eondition for the most flat selective film deposition pattern is the case with low sticking coefficient and slightly increased surface diffusion coefficient.

  • PDF