• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.8
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• pp.888-892
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• 2004

It is necessary to develop soft magnetic layer with high saturation magnetization 4 $\pi{M}_s$ and in-plane magnetic anisotropy field Hk for soft magnetic underlayer of perpendicular magnetic recording media with high signal to noise ratio. Fe-Co-B layer with high 4 $\pi$Ms of about 23 kG deposited on Ni-Fe and Ni-Fe/Si seedlayer exhibited very high in-plane magnetic anisotropy filed Hk of about 280 and 380 Oe, respectively, In-plane XRD studies clarified that the lattice spacing of planes along the easy axis direction was longer than that along the hard axis direction in the Fe-Co-B layers with high Hk. These results indicate that high Hk of Fe-Co-B/Ni-Fe and Fe-Co-B/［Ni-Fe/si］ layers were resulted from magnetoelastic anisotropy owing to a residual stress. Moreover, the high Hk in the Fe-Co-B/Ni-Fe layer was maintained until 30$0^{\circ}C$ annealing temperature.

• Proceedings of the Korean Magnestics Society Conference
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• 2004.06a
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• pp.200-200
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• 2004

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.214-214
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• 2014

Computational analysis of aqueous solution stability of Fe-Cr-Ni system to find an electroplating condition of Fe-Cr-Ni layer. Aqueous sulfate solution with iron, chromium and nickel ions was selected by using a numerical S/W with which aqueous solution stability was analyzed. Several possible conditions to perform electro-forming of Fe-Cr-Ni were selected with thermo-dynamical data. The Fe-Cr-Ni system was electro-formed which composition and microstructure of the electroplated Fe-Cr-Ni significantly depended on the solution temperature and electro-potential. The final composition of Fe-3%Cr-48%Ni with less than $30{\mu}m$ thick was well electroplated.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.125-130
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• 2002

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.

• Journal of the Korean Magnetics Society
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• v.13 no.2
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• pp.53-58
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• 2003

Annealing effects of exchange bias fields ($H_{2ex}$(top), $H_{lex}$ (bottom)) on composite type NiFe/[FeMn/Mn]$_{80}$/NiFe multilayers have been studied. Three samples with ultra-thin Mn inserted layers on glass/Ta(50 $\AA$)/NiFe(150 $\AA$)/[F $e_{53}$M $n_{47}$(1.25 $\AA$)/Mn(0 $\AA$, 0.11 $\AA$, 0.3 $\AA$)]$_{80}$/NiFe(90 $\AA$)/Ta(50 $\AA$) were prepared by ion beam sputtering. The average x-ray diffraction peak ratios NiFe(111) of FeMn (111) fcc textures for the Mn inserted total thicknesses of 0 $\AA$, 9 $\AA$, and 24 $\AA$ were about 0.65, 0.90, and 1.5, respectively. For the sample without Mn inserted layer, the $H_{2ex}$ of 260 Oe up to 300 $^{\circ}C$ disappeared at 350 $^{\circ}C$. For two multilayer samples with ultra-thin Mn layers of 0.11 $\AA$ and 0.3 $\AA$, the $H_{2exs}$ of 310 Oe and 180 Oe up to 300 $^{\circ}C$ endured of 215 Oe and 180 Oe at 350 $^{\circ}C$, respectively. The $H_{ex}$ (bottom)s of three samples decreased from 100 Oe to 70 Oe up to 250 $^{\circ}C$, while these values increased beyond 300 $^{\circ}C$. This observation can be attributed to less diffusive path of Mn atoms in bottom NiFe than top NiFe layer. The top and bottom coercive fields slightly varied about 5 Oe∼10 Oe. From these results, we could obtain the enhancement of exchange coupling intensity and thermal stability by an ultra-thin Mn inserted layer on NiFe/[FeMn/Mn]$_{80}$/NiFe Multilayers.

• Journal of the Korean Magnetics Society
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• v.11 no.4
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• pp.146-150
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• 2001

The effect of H$_2$ content in Ar sputtering gas on exchange coupling field(H$_{ex}$) for NiFe/FeMn interface was studied. When NiFe layer of Si(100)/Ta(50 $\AA$)/NiFe(60 $\AA$)/FeMn(250 $\AA$)Ta(50 $\AA$) was deposited at 8% H$_2$ in sputtering gas, the maximum exchange coupling field(H$_{ex}$) and minimum coercivity(H$_{c}$) were obtained. When Si(100)/Ta(50 $\AA$)/NiFe(60 $\AA$)/FeMn(250 $\AA$)/NiFe(70 $\AA$)/Ta(50 $\AA$) was deposited at 5% H$_2$ in sputtering gas, the maximum exchange coupling field(H$_{ex}$) of 148 Oe was obtained. The (111) preferred orientation and grain size of underlayer NiFe were increased and the internal stress was reduced by H$_2$ in sputtering gas. And the (111) preferred orientation and grain size of FeMn layer were also increased.d.ased.

• Proceedings of the Korean Magnestics Society Conference
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• 1998.10a
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• pp.22-23
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• 1998

• Proceedings of the Korean Magnestics Society Conference
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• 1997.11a
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• pp.32-33
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• 1997

• Journal of the Korean institute of surface engineering
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• v.35 no.2
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• pp.107-112
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• 2002

We have studied diffusion behavior of NiFe/Ag bilayer deposited by on silicon Ion Beam Sputtering methods. The diffusion behavior of NiFe and Ag in NiFe/Ag thin film is analyzed by Medium Energy Ion Scattering Spectroscopy. For samples without Ta underlayer, silicides such as Ni-Si or Fe-Si were formed at Si substrate and NiFe interface. In contrast, Ag predominantly diffused into the NiFe layer probably through their grain boundaries for Ta underlayered samples.

• Proceedings of the Korean Magnestics Society Conference
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• 1998.05a
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• pp.50-51
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• 1998