• 한국압력기기공학회 논문집
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• 제12권1호
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• pp.70-77
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• 2016

In this paper, the structural design and integrity evaluations for a reactor vessel of PGSFR sodium-cooled fast reactor(150MWe) are carried out in compliance with ASME BPV III, Division 5 Subsection HB. The reactor vessel is designed with a direct contact of primary sodium coolant to its inner surface and has a double vessel concept enclosing by containment vessel. To assure the structural integrity for 60 years design lifetime and elevated operating temperature of $545^{\circ}C$, which can invoke creep and creep-fatigue damage, the structural integrity evaluations are carried out in compliance with the ASME code rules. The design loads considered in this evaluations are primary loads and operation thermal cycling loads of normal heat-up and cool-down. From the evaluations, the PGSFR reactor vessel satisfies the ASME code limits but it was found that there is a little design margin of creep damage for inner surface at the region of cold pool free surface.

• 한국운동역학회지
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• 제23권3호
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• pp.225-233
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• 2013

The purpose of this study was to estimate the potential injury via analyzing ground reaction force components that were resulted from a prolonged-run-induced fatigue. For the present study, passive and active components of the vertical ground reaction force were determined from time and frequency domain. Shear components of GRF also were calculated from time and frequency domain. Twenty subjects with rear foot contact aged 20 to 30, no experience in injuries of the extremities, were requested to run on the instrumented tread-mill for 160 minutes at their preference running speed. GRF signals for 10 strides were collected at 5, 35, 65, 95, 125, and 155 minute during running. In conclusions, there were no significant difference in the magnitude of passive force, impact load rate, frequency of the passive and active components in vertical GRF between running times except the magnitude of active force (p<.05). The magnitude of active force was significantly decreased after 125 minute run. The magnitude of maximum peak and maximum frequency of the mediolateral GRF at heel strike and toe-off have not been changed with increasing running time. The time up to the maximum peak of the anteroposterior at heel-strike moment tend to decrease (p<.05), but the maximum peak and frequency of that at heel and toe-off moment didn't depend significantly on running time.

• 한국기계가공학회지
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• 제20권12호
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• pp.8-15
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• 2021

Cold forging is a method in which molding is performed at room temperature. It has a high material recovery rate and dimensional precision and produces excellent surface quality, and it is mainly used for the production of bolted or housing products. The lifespan of cold forging molds is generally determined by the wear of the mold, plastic deformation of the mold, and fatigue strength. Cold forging molds are frequently damaged due to fatigue destruction rather than wear and plastic deformation in a high-temperature environment as it is molded at room temperature without preheating the raw material and mold. Based on the results analyzed through FEM, an effective mold structure design method was proposed by analyzing the changes in tensile and compressive stresses on molds according to the number of molds and reinforcement rings and comparing the product geometry and mold stress using three existing mold models.

• 대한기계학회논문집A
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• 제41권7호
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• pp.629-634
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• 2017

최근 수요가 급격히 증가하고 있는 고성능 UHP (Ultra High Performance)타이어의 경우 낮은 편평비로 인해 일반 타이어 보다 사이드월 고무에 가혹한 변형이 발생하게 된다. 사이드월 고무의 변형이 지속적으로 발생할 경우 피로손상이 축적되어 피로파괴 현상이 나타날 수 있다. 따라서 차량 주행 중 발생하는 안전사고 예방을 위한 사이드월 고무의 내구성능 평가가 중요한 문제로 대두되고 있다. 그러나 타이어 사이드월 고무의 내구성능에 대한 설계 기준 및 연구는 국내외적으로 잘 알려져 있지 않다. 본 연구에서는 타이어 사이드월 고무 2종에 대하여 인장시험과 피로시험을 수행하여 변형률에너지밀도를 이용한 수명예측식을 제시하였다. 또한, 저연비 타이어의 주행가능 예상거리를 도출하여 내구성능 만족여부를 검토하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• International Journal of Railway
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• 제1권3호
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• pp.83-88
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• 2008

Since the 1990's the fleet of the Dutch Railways showed a dramatic decrease in wheel tyre life. This lifetime reduction led to an unacceptable increase in life cycle costs. Therefore Lloyd's Register Rail has proposed to NedTrain to investigate the possibilities of improving the wheel tyre life. Three improvements were determined as most promising and relatively easy to achieve: - Profile optimisation for Rolling Contact Fatigue (RCF) reduction - a new wheel profile has been developed with a better resistance against rolling contact fatigue of the wheel tread. The profile has been implemented on single deck intercity trains and shows an increase in wheel tyre life of 30%. - Selection of improved wheel tyre materials - combining information from literature and experiences of manufacturers five alternative wheel tyre materials have been selected and are now being tested in practice. - Optimisation of the maintenance strategy - an alternative, preventative maintenance regime has been developed. With this Scraping regime, during short term maintenance every wheel is reprofiled. Higher mileages are reached and savings on life cycle costs up to 50% and more have been achieved. Unplanned maintenance goes down with $30{\sim}60%$. The results from field tests, using a reference group for comparison, and preliminary results after implementation show that the increase in wheel tyre life that is achieved with this project is significant. The results will continue to be monitored using the asset management tool 'Wheel Watch', that was specially developed for this project and is also described in this paper.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.244.1-244.1
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• 2016

Recently, the technology for flexible electronics such as flexible smart phone, foldable displays, and bendable battery is under active development. With approaching the real commercialization of flexible electronics, the electrical and mechanical reliability of flexible electronics have become significantly important because they will be used under various mechanical deformations such as bending, twisting, stretching, and so on. These mechanical deformations result in performance degradation of electronic devices due to several mechanical problems such as cracking, delamination, and fatigue. Therefore, the understanding of relationship between mechanical loading and electrical performance is one of the most critical issues in flexible electronics for expecting the lifetime of products. Here, we have investigated the effect of monotonic tensile and cyclic deformations on metal interconnect to provide a guideline for improving the reliability of flexible interconnect.

• 한국신뢰성학회지:신뢰성응용연구
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• 제10권4호
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• pp.213-235
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• 2010

In this paper, we carried out an accelerated degradation test that is commonly used to predict characteristics life of rubber gaskets for a pole transformer. The potential failure mode applied for the test is rubber elongation and the corresponding failure mechanism is heat. From the result, we found that Weibull distribution is the fatigue life distribution in NBR and H-NBR. After estimating characteristics life in commonly used temperature, the average life span of $B_{50}$ in NBR is 7.7 years under $50^{\circ}C$ and the life span in H-NBR is 28 years.

• 한국고분자학회:학술대회논문집
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• 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
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• pp.256-256
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• 2006

The design and synthesis of novel biomolecular materials, based on mimicking the properties of molecules found in nature, is providing materials with unusual properties. Resilin serves as an energy storage material in insects and facilitates flight, jumping (in fleas, froghoppers etc) and sound production (cicadas, etc). Resilin is initially produced as a soluble protein and in its mature form is crosslinked through formation of dityrosine units into a very large insoluble polymer. In the present study, we have synthesized a recombinant form of resilin that can be photochemically cross-linked into a resilient, rubber-like biomaterial that may be suitable for spinal disc implants. This material is almost perfectly elastic and its fatigue lifetime in insects must be >500 million cycles.