• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.3
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• pp.225-230
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• 2006

The overall performance and local flow fields of the fan, heat sink, and fan-sink were experimentally and numerically studied to investigate the flow characteristics of a fan-sink. The flow resistance of the heat sink was measured by small fan tester based on AMCA standards and compared with the CFD results to select available cooling fan for the fan-sink. The nonuniform velocity profile behind the fan outlet was shown by the flow visualization. The effects of nonuniform velocities on the performance of heat sink were discussed. To validate the commercial CFD code CFX-5.6, the predicted performance curve was compared with that of fan testing. The local flow fields of the fan-sink were analyzed by CFD results. MFR (multiple frame of reference) was used as a computational model combining rotating fan and stationary heat sink. Through the CFD results of the fan-sink, the flow patterns behind the fan outlet influenced the flow resistance and overall performance of the heat sink.

• 유체기계공업학회:학술대회논문집
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• 2004.12a
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• pp.83-88
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• 2004

In this study, the flow and thermal performance of the heat sink and fan-sink were experimentally studied to predict the operating condition of the fan-sink. The experiments of the flow and thermal resistance of the heat sink with various inlet blockage, which were occurred by the shapes of the axial fans, were conducted for the proof of the effects of the inlet blockages. The greater the inlet blockage of the heat sink, the higher the pressure drop and lower the thermal resistance of the heat sink will be. The operating point of the fan-sink was predicted by the pressure drop curve with the inlet blockage, which was corresponded to the selected fan and the fan performance curve, and verified by the performance test of the fan-sink. The predicted operating point of the fan-sink had good agreement with the result of the performance test of the fan-sink within $0.7\%$ of the volume flow rates. Measured thermal resistance of the fan-sink was equivalent to that of the heat sink with the same inlet blockage of the fan-sink. It was shown that the heat transfer characteristics of the heat sink were influenced by the flow interaction between the selected fan and the heat sink. To improve the thermal resistance of the heat sink, it is necessary to consider appropriate flow patterns of the fan outlet entering into the heat sink.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.8
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• pp.1055-1061
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• 2002

A numerical and experimental study on the flow fields behind the fan outlet was carried out to improve the performance of a conventional fan-sink(fan and heat sink). Conventional fan-sinks have a heat sink of which fin configurations tend to increase the flow resistance, thus decreasing the performance and the cooling capabilities of a fan-sink. Lifting surface method is used for the prediction of flow fields behind the fan outlet. Oil-dot flow visualization technique is applied for the validation of numerical results. The numerical results and experimental data show agreement each other. A conventional heat sink is modified and redesigned using flow patterns behind the fan outlet. The newly designed heat sink has the configuration of curved fins which minimize flow resistance. It showed improvements in both cooling: capabilities and volumetric flow rate compared to the conventional one.

• Proceeding of EDISON Challenge
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• 2015.03a
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• pp.500-509
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• 2015

This paper presents the single objective design optimization of plate-fin heat sink equipped with fan cooling system using Genetic Algorithm. The proper heat sink and fan model are selected based on the previous studies. And the thermal resistance of heat sinks and fan efficiency during operation are calculated according to specific design parameters. The objective function is combination of thermal resistance and fan efficiency which have been taken to measure the performance of the heat sink. And Decision making procedure is suggested considering life time of semiconductor and Fan Operating cost. And also Analytical Model used for optimization is validated by Fluent, Ansys 13.0 and this model give a quite reasonable and reliable design.

• CDE review
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• v.21 no.2
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• pp.39-49
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• 2015

This paper presents the single objective design optimization of plate-fin heat sink equipped with fan cooling system using Genetic Algorithm. The proper heat sink and fan model are selected based on the previous studies. And the thermal resistance of heat sinks and fan efficiency during operation are calculated according to specific design parameters. The objective function is combination of thermal resistance and fan efficiency which have been taken to measure the performance of the heat sink. And Decision making procedure is suggested considering life time of semiconductor and Fan Operating cost. And also Analytical Model used for optimization is validated by Fluent, Ansys 13.0 and this model give a quite reasonable and reliable design.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.3
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• pp.417-422
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• 2002

The experiments have been carried out to evaluate the cooling performance of a fan-aluminum foam heat sink assembly in comparison with a conventional CPU cooler. In terms of the dimensionless surface temperature of the heater, the cooling performance of the aluminum foam heat sink is similar to that of the conventional one with much reduced weight. The optimum fin height is found to be strongly dependent on the fin height of the heat sink and flow characteristics of the cooling fan.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2012.06a
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• pp.130-132
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• 2012

In this paper, a temperature control for LED(Light Emitting Diode) lamp using a cooling fan is studied. An efficient temperature control scheme for the LED lamp using the fan wind at the lowest sound noise is studied. For the study, after measurement of the minimum sound noise of the fan and related temperature of the LED lamp through tests, experiments on temperature control of the LED lamp using the fan with various size of heat sinks was performed. To minimize the fan sound noise, optimal size of the heat sink was studied. Also, a teleoperting control of LED lamps using RF communication was studied.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1472-1475
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• 2004

Current processor power consumption has dramatically increased and already reached 115 Watts. Therefore, Heat sink design needs more high accuracy in 1U server. The target performance of heat sink is very dependent of fin geometry and it is also seriously affected by design conditions such as fan type, air duct shape and heatsink design parameters. The present paper investigates the behavior of heat sink performance under various conditions. The present work addresses pressurized type plane fin heat sinks having dimension of 40 mm by 40 mm by 56 mm fan.

• Korean Journal of Materials Research
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• v.14 no.7
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• pp.522-528
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• 2004

Heat analysis of the plate type and wave type heat sink were carried out by using computational simulation. The heat resistance and air flow of two heat sink models were analysed according to natural and forced convection condition and positions of fan. When a fan was at the position of z-axis and y-axis in forced convection, the heat resistances of plate type heat sink were $0.17^{\circ}C/W$, and $0.28^{\circ}C/W$ respectively. In the case of wave type heat sink, they were $0.18^{\circ}C/W$ and $0.53^{\circ}C/W$. As the air flow velocities were averagely $0.386\;m/s\~3.269\;m/s$, air flow velocity of plate type heat sink was faster than that of wave type. In this experiment, it was observed that the plate type heat sink showed a good ability of heat radiation comparing with wave type one.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.4
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• pp.733-737
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• 2007

The object of this paper is to propose a method to solve resulting heat in using numerous modulized watt-class LEDs in MCPCB as lighting device. To use LED for lighting, the chip needs to have a large capacity, resulting in extra heat in P-N connection area. To solve this problem, a Pottier Module, heat-sink panel and a fan was installed to measure variations in the temperature. Additionally, temperature variation characteristics were observed according to the heat conductor panel connecting cooling module and heat-sink panel, insulator and thermal grease. As a result, the type and amount of heat-sink panel was the most important facto. The fan would effect the temperature by max. $18[^{\circ}C]$ while other materials affected the temperature by $2{\sim}3[^{\circ}C]$, showing significant difference.